JPWO2022202505A1 - - Google Patents

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Publication number
JPWO2022202505A1
JPWO2022202505A1 JP2023509054A JP2023509054A JPWO2022202505A1 JP WO2022202505 A1 JPWO2022202505 A1 JP WO2022202505A1 JP 2023509054 A JP2023509054 A JP 2023509054A JP 2023509054 A JP2023509054 A JP 2023509054A JP WO2022202505 A1 JPWO2022202505 A1 JP WO2022202505A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023509054A
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Japanese (ja)
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JPWO2022202505A5 (enrdf_load_stackoverflow
JP7491463B2 (ja
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Publication of JPWO2022202505A5 publication Critical patent/JPWO2022202505A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Conductive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2023509054A 2021-03-23 2022-03-15 導電性樹脂組成物、高熱伝導性材料および半導体装置 Active JP7491463B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021048261 2021-03-23
JP2021048261 2021-03-23
JP2021163521 2021-10-04
JP2021163521 2021-10-04
PCT/JP2022/011708 WO2022202505A1 (ja) 2021-03-23 2022-03-15 導電性樹脂組成物、高熱伝導性材料および半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022202505A1 true JPWO2022202505A1 (enrdf_load_stackoverflow) 2022-09-29
JPWO2022202505A5 JPWO2022202505A5 (enrdf_load_stackoverflow) 2023-07-21
JP7491463B2 JP7491463B2 (ja) 2024-05-28

Family

ID=83396138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509054A Active JP7491463B2 (ja) 2021-03-23 2022-03-15 導電性樹脂組成物、高熱伝導性材料および半導体装置

Country Status (4)

Country Link
JP (1) JP7491463B2 (enrdf_load_stackoverflow)
KR (1) KR20230159849A (enrdf_load_stackoverflow)
TW (1) TW202244101A (enrdf_load_stackoverflow)
WO (1) WO2022202505A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7677368B2 (ja) * 2023-03-20 2025-05-15 味の素株式会社 液状樹脂組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05501783A (ja) * 1989-11-29 1993-04-02 アチソン・インダストリーズ・インコーポレイテツド 導電性支持ベースに半導体ダイを接着するのに有用な導電性接着剤
JP2004168922A (ja) * 2002-11-21 2004-06-17 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2008007558A (ja) * 2006-06-27 2008-01-17 Sumitomo Bakelite Co Ltd 液状樹脂組成物及び液状樹脂組成物を使用して作製した半導体装置
JP2015160932A (ja) * 2014-02-28 2015-09-07 昭和電工株式会社 導電性接着剤及びそれらを使用した電子機器
JP2016222804A (ja) * 2015-05-29 2016-12-28 株式会社タムラ製作所 導電性接着剤および電子基板
WO2022030089A1 (ja) * 2020-08-04 2022-02-10 ナミックス株式会社 導電性組成物、ダイアタッチ材、加圧焼結型ダイアタッチ材及び電子部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5806760B1 (ja) 2014-05-29 2015-11-10 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
DE112018002911T5 (de) 2017-06-07 2020-02-20 Tanaka Kikinzoku Kogyo K.K. Thermisch leitende und elektrisch leitende Adhäsivzusammensetzung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05501783A (ja) * 1989-11-29 1993-04-02 アチソン・インダストリーズ・インコーポレイテツド 導電性支持ベースに半導体ダイを接着するのに有用な導電性接着剤
JP2004168922A (ja) * 2002-11-21 2004-06-17 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2008007558A (ja) * 2006-06-27 2008-01-17 Sumitomo Bakelite Co Ltd 液状樹脂組成物及び液状樹脂組成物を使用して作製した半導体装置
JP2015160932A (ja) * 2014-02-28 2015-09-07 昭和電工株式会社 導電性接着剤及びそれらを使用した電子機器
JP2016222804A (ja) * 2015-05-29 2016-12-28 株式会社タムラ製作所 導電性接着剤および電子基板
WO2022030089A1 (ja) * 2020-08-04 2022-02-10 ナミックス株式会社 導電性組成物、ダイアタッチ材、加圧焼結型ダイアタッチ材及び電子部品

Also Published As

Publication number Publication date
KR20230159849A (ko) 2023-11-22
JP7491463B2 (ja) 2024-05-28
TW202244101A (zh) 2022-11-16
WO2022202505A1 (ja) 2022-09-29

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