JP2008056857A5 - - Google Patents
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- Publication number
- JP2008056857A5 JP2008056857A5 JP2006238028A JP2006238028A JP2008056857A5 JP 2008056857 A5 JP2008056857 A5 JP 2008056857A5 JP 2006238028 A JP2006238028 A JP 2006238028A JP 2006238028 A JP2006238028 A JP 2006238028A JP 2008056857 A5 JP2008056857 A5 JP 2008056857A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- linear
- carbon atoms
- containing group
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 claims 16
- 239000004065 semiconductor Substances 0.000 claims 16
- 239000004593 Epoxy Substances 0.000 claims 10
- 125000004432 carbon atom Chemical group C* 0.000 claims 9
- 229920001187 thermosetting polymer Polymers 0.000 claims 9
- 239000004215 Carbon black (E152) Substances 0.000 claims 8
- 229930195733 hydrocarbon Natural products 0.000 claims 8
- 150000002430 hydrocarbons Chemical class 0.000 claims 8
- 125000003545 alkoxy group Chemical group 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 229920002050 silicone resin Polymers 0.000 claims 3
- 150000002902 organometallic compounds Chemical class 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- 125000004429 atom Chemical group 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006238028A JP2008056857A (ja) | 2006-09-01 | 2006-09-01 | 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006238028A JP2008056857A (ja) | 2006-09-01 | 2006-09-01 | 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008056857A JP2008056857A (ja) | 2008-03-13 |
| JP2008056857A5 true JP2008056857A5 (enrdf_load_stackoverflow) | 2009-08-20 |
Family
ID=39239980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006238028A Withdrawn JP2008056857A (ja) | 2006-09-01 | 2006-09-01 | 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008056857A (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5070107B2 (ja) * | 2008-03-31 | 2012-11-07 | ナミックス株式会社 | エポキシ樹脂組成物 |
| JP5193685B2 (ja) * | 2008-05-30 | 2013-05-08 | ナミックス株式会社 | Ｌｅｄ用導電性ダイボンディング剤 |
| JP5600869B2 (ja) * | 2008-11-05 | 2014-10-08 | 横浜ゴム株式会社 | 加熱硬化性光半導体封止用樹脂組成物およびこれを用いる光半導体封止体 |
| JP5435728B2 (ja) * | 2010-03-19 | 2014-03-05 | 横浜ゴム株式会社 | 光半導体封止体 |
| KR101207103B1 (ko) | 2010-03-31 | 2012-12-03 | 코오롱인더스트리 주식회사 | 봉지재 조성물，이의 경화막 및 유기발광소자 |
| JP2013232503A (ja) | 2012-04-27 | 2013-11-14 | Toshiba Corp | 半導体発光装置 |
| TWI637020B (zh) * | 2012-09-28 | 2018-10-01 | 三菱化學股份有限公司 | 熱硬化性樹脂組成物，其製造方法，樹脂硬化物之製造方法，及使環氧化合物之自身聚合發生的方法 |
| JP2017509741A (ja) * | 2014-02-06 | 2017-04-06 | モーメンティブ・パフォーマンス・マテリアルズ・インク | 湿気硬化性シリコーン組成物 |
| JP6349858B2 (ja) * | 2014-03-27 | 2018-07-04 | 三菱ケミカル株式会社 | 熱硬化性樹脂組成物 |
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2006
- 2006-09-01 JP JP2006238028A patent/JP2008056857A/ja not_active Withdrawn