JPWO2022196158A1 - - Google Patents
Info
- Publication number
- JPWO2022196158A1 JPWO2022196158A1 JP2023506844A JP2023506844A JPWO2022196158A1 JP WO2022196158 A1 JPWO2022196158 A1 JP WO2022196158A1 JP 2023506844 A JP2023506844 A JP 2023506844A JP 2023506844 A JP2023506844 A JP 2023506844A JP WO2022196158 A1 JPWO2022196158 A1 JP WO2022196158A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7806—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a Schottky barrier diode
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021045115 | 2021-03-18 | ||
PCT/JP2022/004301 WO2022196158A1 (ja) | 2021-03-18 | 2022-02-03 | ワイドバンドギャップ半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022196158A1 true JPWO2022196158A1 (ja) | 2022-09-22 |
Family
ID=83322204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023506844A Pending JPWO2022196158A1 (ja) | 2021-03-18 | 2022-02-03 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230335633A1 (ja) |
JP (1) | JPWO2022196158A1 (ja) |
CN (1) | CN116830262A (ja) |
DE (1) | DE112022000168T5 (ja) |
WO (1) | WO2022196158A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023080086A1 (ja) * | 2021-11-05 | 2023-05-11 | ローム株式会社 | 半導体装置 |
WO2023080088A1 (ja) * | 2021-11-05 | 2023-05-11 | ローム株式会社 | 半導体装置 |
WO2023080083A1 (ja) * | 2021-11-05 | 2023-05-11 | ローム株式会社 | 半導体装置 |
WO2023080087A1 (ja) * | 2021-11-05 | 2023-05-11 | ローム株式会社 | 半導体装置 |
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