JPWO2022153151A5 - - Google Patents
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- Publication number
- JPWO2022153151A5 JPWO2022153151A5 JP2022574865A JP2022574865A JPWO2022153151A5 JP WO2022153151 A5 JPWO2022153151 A5 JP WO2022153151A5 JP 2022574865 A JP2022574865 A JP 2022574865A JP 2022574865 A JP2022574865 A JP 2022574865A JP WO2022153151 A5 JPWO2022153151 A5 JP WO2022153151A5
- Authority
- JP
- Japan
- Prior art keywords
- cluster
- load lock
- lock chamber
- ninth
- transport device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 22
- 238000004519 manufacturing process Methods 0.000 claims 15
- 238000005530 etching Methods 0.000 claims 10
- 238000001459 lithography Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 239000011261 inert gas Substances 0.000 claims 5
- 238000004380 ashing Methods 0.000 claims 4
- 238000004140 cleaning Methods 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000001312 dry etching Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000001039 wet etching Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021004537 | 2021-01-14 | ||
| JP2021011853 | 2021-01-28 | ||
| PCT/IB2022/050107 WO2022153151A1 (ja) | 2021-01-14 | 2022-01-07 | 発光デバイスの製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022153151A1 JPWO2022153151A1 (https=) | 2022-07-21 |
| JPWO2022153151A5 true JPWO2022153151A5 (https=) | 2025-01-06 |
Family
ID=82447062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022574865A Pending JPWO2022153151A1 (https=) | 2021-01-14 | 2022-01-07 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240057464A1 (https=) |
| JP (1) | JPWO2022153151A1 (https=) |
| WO (1) | WO2022153151A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001257350A (ja) * | 2000-03-08 | 2001-09-21 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US7319920B2 (en) * | 2003-11-10 | 2008-01-15 | Applied Materials, Inc. | Method and apparatus for self-calibration of a substrate handling robot |
| JP2007220360A (ja) * | 2006-02-14 | 2007-08-30 | Tokyo Electron Ltd | 発光素子、発光素子の製造方法および基板処理装置 |
| JP4859485B2 (ja) * | 2006-02-27 | 2012-01-25 | 三菱重工業株式会社 | 有機半導体製造装置 |
| US20080219810A1 (en) * | 2007-03-05 | 2008-09-11 | Van Der Meulen Peter | Semiconductor manufacturing process modules |
| JP2014044810A (ja) * | 2012-08-24 | 2014-03-13 | Canon Inc | 有機ｅｌ装置の製造方法 |
| JP2014070241A (ja) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | 蒸着装置および蒸着方法 |
| KR101990555B1 (ko) * | 2012-12-24 | 2019-06-19 | 삼성디스플레이 주식회사 | 박막봉지 제조장치 및 박막봉지 제조방법 |
| KR101673016B1 (ko) * | 2013-08-27 | 2016-11-07 | 삼성디스플레이 주식회사 | 박막봉지 제조장치 및 이를 이용한 표시 장치의 제조방법 |
| CN110249417B (zh) * | 2017-02-10 | 2023-10-24 | 应用材料公司 | 用于深沟槽内的低温选择性外延的方法及设备 |
| JP6524564B2 (ja) * | 2017-06-28 | 2019-06-05 | パナソニックＩｐマネジメント株式会社 | 素子チップの製造方法および基板加熱装置 |
| KR102035398B1 (ko) * | 2017-12-15 | 2019-10-22 | 주식회사 야스 | 증착 시스템 |
| JP7316782B2 (ja) * | 2018-12-14 | 2023-07-28 | キヤノントッキ株式会社 | 蒸着装置、電子デバイスの製造装置、および、蒸着方法 |
-
2022
- 2022-01-07 US US18/260,841 patent/US20240057464A1/en active Pending
- 2022-01-07 JP JP2022574865A patent/JPWO2022153151A1/ja active Pending
- 2022-01-07 WO PCT/IB2022/050107 patent/WO2022153151A1/ja not_active Ceased
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