JPWO2022097424A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022097424A5
JPWO2022097424A5 JP2022560686A JP2022560686A JPWO2022097424A5 JP WO2022097424 A5 JPWO2022097424 A5 JP WO2022097424A5 JP 2022560686 A JP2022560686 A JP 2022560686A JP 2022560686 A JP2022560686 A JP 2022560686A JP WO2022097424 A5 JPWO2022097424 A5 JP WO2022097424A5
Authority
JP
Japan
Prior art keywords
inductor
circuit board
signal transmission
chip
compensating section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022560686A
Other languages
English (en)
Japanese (ja)
Other versions
JP7456516B2 (ja
JPWO2022097424A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/037463 external-priority patent/WO2022097424A1/ja
Publication of JPWO2022097424A1 publication Critical patent/JPWO2022097424A1/ja
Publication of JPWO2022097424A5 publication Critical patent/JPWO2022097424A5/ja
Application granted granted Critical
Publication of JP7456516B2 publication Critical patent/JP7456516B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022560686A 2020-11-04 2021-10-08 信号電源分離回路が構成される多層回路基板 Active JP7456516B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020184488 2020-11-04
JP2020184488 2020-11-04
PCT/JP2021/037463 WO2022097424A1 (ja) 2020-11-04 2021-10-08 信号電源分離回路が構成される多層回路基板

Publications (3)

Publication Number Publication Date
JPWO2022097424A1 JPWO2022097424A1 (https=) 2022-05-12
JPWO2022097424A5 true JPWO2022097424A5 (https=) 2023-05-11
JP7456516B2 JP7456516B2 (ja) 2024-03-27

Family

ID=81457153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022560686A Active JP7456516B2 (ja) 2020-11-04 2021-10-08 信号電源分離回路が構成される多層回路基板

Country Status (3)

Country Link
US (1) US12309914B2 (https=)
JP (1) JP7456516B2 (https=)
WO (1) WO2022097424A1 (https=)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729658Y2 (ja) * 1987-03-02 1995-07-05 株式会社村田製作所 回路基板
JPH0371703A (ja) * 1989-08-11 1991-03-27 Hitachi Ltd 多層基板の接続方法
JPH06350312A (ja) * 1993-06-04 1994-12-22 Nec Corp 同軸コネクタと多層プリント基板の接続構造
JP3661326B2 (ja) * 1997-01-16 2005-06-15 松下電器産業株式会社 印刷配線基板装置
JP3471679B2 (ja) * 1999-10-15 2003-12-02 日本電気株式会社 プリント基板
JP2004129053A (ja) * 2002-10-04 2004-04-22 Mitsubishi Electric Corp Ｄｃブロック回路および通信装置
JP2007123740A (ja) * 2005-10-31 2007-05-17 Sony Corp フレキシブル基板、光送受信モジュール及び光送受信装置
EP2209172A1 (en) * 2009-01-15 2010-07-21 3M Innovative Properties Company Telecommunications Jack with a Multilayer PCB
JP2010200223A (ja) * 2009-02-27 2010-09-09 Seiko Epson Corp 電子機器、電子機器の制御方法、リモートコントローラー、リモートコントローラーの制御方法及びプログラム
US8138734B2 (en) * 2009-04-06 2012-03-20 Monolithic Power Systems, Inc. Accurate current limit for peak current mode DC-DC converter
US9706642B2 (en) * 2010-08-27 2017-07-11 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and device for differential signal channel length compensation in electronic system
JP2014171154A (ja) 2013-03-05 2014-09-18 Nippon Telegr & Teleph Corp <Ntt> マイクロストリップ線路
JP6226600B2 (ja) * 2013-07-18 2017-11-08 キヤノン株式会社 プリント回路板
JP6398978B2 (ja) * 2013-08-20 2018-10-03 株式会社村田製作所 高周波モジュール
US9780662B1 (en) * 2015-05-15 2017-10-03 Maxim Integrated Products, Inc. Method for portable sensor-less DC-DC converter control loops
US10158339B2 (en) * 2015-12-11 2018-12-18 Intel Corporation Capacitive compensation structures using partially meshed ground planes
US20190372542A1 (en) * 2017-02-06 2019-12-05 Mitsubishi Electric Corporation Noise filter
US10418994B1 (en) * 2017-07-12 2019-09-17 Xilinx, Inc. Circuit for and method of extending the bandwidth of a termination block
CN112119489B (zh) * 2018-08-21 2024-03-12 Ngk电子器件株式会社 布线基板、封装体及模块
JP7133486B2 (ja) * 2019-01-16 2022-09-08 日立Astemo株式会社 信号伝送装置、信号伝送システム

Similar Documents

Publication Publication Date Title
JP5146703B2 (ja) 多層基板
US6621012B2 (en) Insertion of electrical component within a via of a printed circuit board
US7518884B2 (en) Tailoring impedances of conductive traces in a circuit board
US8049118B2 (en) Printed circuit board
JP7120294B2 (ja) 電子機器
CA2600894A1 (en) A radio frequency circuit board topology
JP2010050298A5 (https=)
US10057975B2 (en) Electronic assemblies and method for manufacturing the same
CN106470523A (zh) 柔性电路板及其制作方法
JP2002111324A (ja) 信号伝送用回路基板、その製造方法及びそれを用いた電子機器
FI4000133T3 (fi) Mikroliuska-antenni
US20130093532A1 (en) Flexible printed circuit board
JP6441850B2 (ja) 多層プリント配線板
JPWO2022097424A5 (https=)
WO2008074041A3 (de) Beheizbares element
US20080245558A1 (en) Via structure of printed circuit board
TWM540453U (zh) 軟式印刷電路板與硬式印刷電路板焊接結構
JP2011023547A (ja) 回路基板
CN109936913B (zh) 印刷电路板、存储器模块和包括存储器模块的存储器系统
JP7456516B2 (ja) 信号電源分離回路が構成される多層回路基板
JP2011034317A (ja) ストレージ装置
JP2846803B2 (ja) 多層配線基板
US9769944B2 (en) Semiconductor memory device
KR101843381B1 (ko) 배선 기판
KR20200003205A (ko) 쿼드러처 커플러