JPWO2022091479A5 - - Google Patents

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Publication number
JPWO2022091479A5
JPWO2022091479A5 JP2022558851A JP2022558851A JPWO2022091479A5 JP WO2022091479 A5 JPWO2022091479 A5 JP WO2022091479A5 JP 2022558851 A JP2022558851 A JP 2022558851A JP 2022558851 A JP2022558851 A JP 2022558851A JP WO2022091479 A5 JPWO2022091479 A5 JP WO2022091479A5
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JP
Japan
Prior art keywords
upper substrate
power supply
substrate
supply circuit
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022558851A
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English (en)
Japanese (ja)
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JPWO2022091479A1 (https=
JP7268802B2 (ja
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Priority claimed from PCT/JP2021/024397 external-priority patent/WO2022091479A1/ja
Publication of JPWO2022091479A1 publication Critical patent/JPWO2022091479A1/ja
Application granted granted Critical
Publication of JP7268802B2 publication Critical patent/JP7268802B2/ja
Publication of JPWO2022091479A5 publication Critical patent/JPWO2022091479A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022558851A 2020-10-30 2021-06-28 電源回路モジュール Active JP7268802B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020182955 2020-10-30
JP2020182955 2020-10-30
JP2021037422 2021-03-09
JP2021037422 2021-03-09
PCT/JP2021/024397 WO2022091479A1 (ja) 2020-10-30 2021-06-28 電源回路モジュール

Publications (3)

Publication Number Publication Date
JPWO2022091479A1 JPWO2022091479A1 (https=) 2022-05-05
JP7268802B2 JP7268802B2 (ja) 2023-05-08
JPWO2022091479A5 true JPWO2022091479A5 (https=) 2023-05-16

Family

ID=81383869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022558851A Active JP7268802B2 (ja) 2020-10-30 2021-06-28 電源回路モジュール

Country Status (4)

Country Link
US (1) US20230282569A1 (https=)
JP (1) JP7268802B2 (https=)
CN (1) CN116057693B (https=)
WO (1) WO2022091479A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230396158A1 (en) * 2021-03-10 2023-12-07 Monolithic Power Systems, Inc. Sandwich structure power supply module
WO2025100029A1 (ja) * 2023-11-07 2025-05-15 株式会社村田製作所 スイッチング電源モジュール
WO2025100028A1 (ja) * 2023-11-07 2025-05-15 株式会社村田製作所 スイッチング電源モジュール
KR20250136213A (ko) * 2024-03-07 2025-09-16 이브 에너지 씨오., 엘티디. 배터리 관리 시스템 및 배터리 팩
WO2026079148A1 (ja) * 2024-10-07 2026-04-16 株式会社村田製作所 スイッチング電源モジュール

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283093A (ja) * 1987-05-14 1988-11-18 Matsushita Electric Ind Co Ltd 小型電子回路装置
JPH03191592A (ja) * 1989-12-21 1991-08-21 Taiyo Yuden Co Ltd 混成集積回路の組立構造
JP2000114686A (ja) * 1998-10-07 2000-04-21 Tdk Corp 表面実装部品
FR2819678B1 (fr) * 2001-01-12 2003-04-11 Sagem Circuit de filtrage, et dispositif d'alimentation de puissance equipe d'un tel circuit de filtrage
JP2004327556A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置及びその製造方法
JP2006344633A (ja) * 2005-06-07 2006-12-21 Toyota Industries Corp 基板実装構造
JP5082854B2 (ja) * 2005-10-28 2012-11-28 日立金属株式会社 Ｄｃ−ｄｃコンバータ
TW200832875A (en) * 2007-01-19 2008-08-01 Murata Manufacturing Co DC-DC converter module
WO2009083890A1 (en) * 2007-12-27 2009-07-09 Nxp B.V. Apparatus and method for chip-scale package with capacitors as bumps
JP4711026B2 (ja) * 2008-10-08 2011-06-29 株式会社村田製作所 複合モジュール
JP5251791B2 (ja) * 2009-08-31 2013-07-31 株式会社デンソー 樹脂封止型半導体装置およびその製造方法
KR101405878B1 (ko) * 2011-01-26 2014-06-12 가부시키가이샤 무라타 세이사쿠쇼 전력 전송 시스템
CN205428912U (zh) * 2013-02-25 2016-08-03 株式会社村田制作所 模块以及模块元器件
WO2015019519A1 (ja) * 2013-08-07 2015-02-12 パナソニックＩｐマネジメント株式会社 Ｄｃ－ｄｃコンバータモジュール
US20150201495A1 (en) * 2014-01-14 2015-07-16 Qualcomm Incorporated Stacked conductive interconnect inductor
JP2017084961A (ja) * 2015-10-28 2017-05-18 株式会社村田製作所 集積回路素子の実装構造
WO2017183385A1 (ja) * 2016-04-21 2017-10-26 株式会社村田製作所 電源モジュール
WO2018190850A1 (en) * 2017-04-13 2018-10-18 Hewlett-Packard Development Company, L.P. Connecting circuit boards using functional components
JPWO2020017582A1 (ja) * 2018-07-20 2021-06-24 株式会社村田製作所 モジュール
JP2021182575A (ja) * 2020-05-18 2021-11-25 現代自動車株式会社Hyundai Motor Company 半導体装置内部スナバ回路接続構造及びこれを用いたパワーモジュール構造
WO2022004420A1 (ja) * 2020-06-30 2022-01-06 株式会社村田製作所 電源モジュール

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