JPWO2022091479A1 - - Google Patents

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Publication number
JPWO2022091479A1
JPWO2022091479A1 JP2022558851A JP2022558851A JPWO2022091479A1 JP WO2022091479 A1 JPWO2022091479 A1 JP WO2022091479A1 JP 2022558851 A JP2022558851 A JP 2022558851A JP 2022558851 A JP2022558851 A JP 2022558851A JP WO2022091479 A1 JPWO2022091479 A1 JP WO2022091479A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022558851A
Other languages
Japanese (ja)
Other versions
JPWO2022091479A5 (https=
JP7268802B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2022091479A1 publication Critical patent/JPWO2022091479A1/ja
Application granted granted Critical
Publication of JP7268802B2 publication Critical patent/JP7268802B2/ja
Publication of JPWO2022091479A5 publication Critical patent/JPWO2022091479A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
    • H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
    • H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1584—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2022558851A 2020-10-30 2021-06-28 電源回路モジュール Active JP7268802B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020182955 2020-10-30
JP2020182955 2020-10-30
JP2021037422 2021-03-09
JP2021037422 2021-03-09
PCT/JP2021/024397 WO2022091479A1 (ja) 2020-10-30 2021-06-28 電源回路モジュール

Publications (3)

Publication Number Publication Date
JPWO2022091479A1 true JPWO2022091479A1 (https=) 2022-05-05
JP7268802B2 JP7268802B2 (ja) 2023-05-08
JPWO2022091479A5 JPWO2022091479A5 (https=) 2023-05-16

Family

ID=81383869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022558851A Active JP7268802B2 (ja) 2020-10-30 2021-06-28 電源回路モジュール

Country Status (4)

Country Link
US (1) US20230282569A1 (https=)
JP (1) JP7268802B2 (https=)
CN (1) CN116057693B (https=)
WO (1) WO2022091479A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230396158A1 (en) * 2021-03-10 2023-12-07 Monolithic Power Systems, Inc. Sandwich structure power supply module
WO2025100029A1 (ja) * 2023-11-07 2025-05-15 株式会社村田製作所 スイッチング電源モジュール
WO2025100028A1 (ja) * 2023-11-07 2025-05-15 株式会社村田製作所 スイッチング電源モジュール
KR20250136213A (ko) * 2024-03-07 2025-09-16 이브 에너지 씨오., 엘티디. 배터리 관리 시스템 및 배터리 팩
WO2026079148A1 (ja) * 2024-10-07 2026-04-16 株式会社村田製作所 スイッチング電源モジュール

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283093A (ja) * 1987-05-14 1988-11-18 Matsushita Electric Ind Co Ltd 小型電子回路装置
JPH03191592A (ja) * 1989-12-21 1991-08-21 Taiyo Yuden Co Ltd 混成集積回路の組立構造
JP2000114686A (ja) * 1998-10-07 2000-04-21 Tdk Corp 表面実装部品
JP2006344633A (ja) * 2005-06-07 2006-12-21 Toyota Industries Corp 基板実装構造
WO2008087781A1 (ja) * 2007-01-19 2008-07-24 Murata Manufacturing Co., Ltd. Ｄｃ－ｄｃコンバータモジュール
WO2010041589A1 (ja) * 2008-10-08 2010-04-15 株式会社村田製作所 複合モジュール
WO2014129008A1 (ja) * 2013-02-25 2014-08-28 株式会社村田製作所 モジュールおよび該モジュールを構成するモジュール部品並びにこのモジュールの製造方法
WO2015019519A1 (ja) * 2013-08-07 2015-02-12 パナソニックＩｐマネジメント株式会社 Ｄｃ－ｄｃコンバータモジュール
JP2017504211A (ja) * 2014-01-14 2017-02-02 クアルコム，インコーポレイテッド スタック型導電性相互接続インダクタ
JP2017084961A (ja) * 2015-10-28 2017-05-18 株式会社村田製作所 集積回路素子の実装構造
WO2017183385A1 (ja) * 2016-04-21 2017-10-26 株式会社村田製作所 電源モジュール
WO2018190850A1 (en) * 2017-04-13 2018-10-18 Hewlett-Packard Development Company, L.P. Connecting circuit boards using functional components
WO2022004420A1 (ja) * 2020-06-30 2022-01-06 株式会社村田製作所 電源モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2819678B1 (fr) * 2001-01-12 2003-04-11 Sagem Circuit de filtrage, et dispositif d'alimentation de puissance equipe d'un tel circuit de filtrage
JP2004327556A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置及びその製造方法
JP5082854B2 (ja) * 2005-10-28 2012-11-28 日立金属株式会社 Ｄｃ−ｄｃコンバータ
WO2009083890A1 (en) * 2007-12-27 2009-07-09 Nxp B.V. Apparatus and method for chip-scale package with capacitors as bumps
JP5251791B2 (ja) * 2009-08-31 2013-07-31 株式会社デンソー 樹脂封止型半導体装置およびその製造方法
KR101405878B1 (ko) * 2011-01-26 2014-06-12 가부시키가이샤 무라타 세이사쿠쇼 전력 전송 시스템
JPWO2020017582A1 (ja) * 2018-07-20 2021-06-24 株式会社村田製作所 モジュール
JP2021182575A (ja) * 2020-05-18 2021-11-25 現代自動車株式会社Hyundai Motor Company 半導体装置内部スナバ回路接続構造及びこれを用いたパワーモジュール構造

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283093A (ja) * 1987-05-14 1988-11-18 Matsushita Electric Ind Co Ltd 小型電子回路装置
JPH03191592A (ja) * 1989-12-21 1991-08-21 Taiyo Yuden Co Ltd 混成集積回路の組立構造
JP2000114686A (ja) * 1998-10-07 2000-04-21 Tdk Corp 表面実装部品
JP2006344633A (ja) * 2005-06-07 2006-12-21 Toyota Industries Corp 基板実装構造
WO2008087781A1 (ja) * 2007-01-19 2008-07-24 Murata Manufacturing Co., Ltd. Ｄｃ－ｄｃコンバータモジュール
WO2010041589A1 (ja) * 2008-10-08 2010-04-15 株式会社村田製作所 複合モジュール
WO2014129008A1 (ja) * 2013-02-25 2014-08-28 株式会社村田製作所 モジュールおよび該モジュールを構成するモジュール部品並びにこのモジュールの製造方法
WO2015019519A1 (ja) * 2013-08-07 2015-02-12 パナソニックＩｐマネジメント株式会社 Ｄｃ－ｄｃコンバータモジュール
JP2017504211A (ja) * 2014-01-14 2017-02-02 クアルコム，インコーポレイテッド スタック型導電性相互接続インダクタ
JP2017084961A (ja) * 2015-10-28 2017-05-18 株式会社村田製作所 集積回路素子の実装構造
WO2017183385A1 (ja) * 2016-04-21 2017-10-26 株式会社村田製作所 電源モジュール
WO2018190850A1 (en) * 2017-04-13 2018-10-18 Hewlett-Packard Development Company, L.P. Connecting circuit boards using functional components
WO2022004420A1 (ja) * 2020-06-30 2022-01-06 株式会社村田製作所 電源モジュール

Also Published As

Publication number Publication date
CN116057693A (zh) 2023-05-02
CN116057693B (zh) 2026-03-24
JP7268802B2 (ja) 2023-05-08
WO2022091479A1 (ja) 2022-05-05
US20230282569A1 (en) 2023-09-07

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