WO2022091479A1 - 電源回路モジュール - Google Patents

電源回路モジュール Download PDF

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Publication number
WO2022091479A1
WO2022091479A1 PCT/JP2021/024397 JP2021024397W WO2022091479A1 WO 2022091479 A1 WO2022091479 A1 WO 2022091479A1 JP 2021024397 W JP2021024397 W JP 2021024397W WO 2022091479 A1 WO2022091479 A1 WO 2022091479A1
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WO
WIPO (PCT)
Prior art keywords
power supply
supply circuit
circuit module
board
upper substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/024397
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
高見 武藤
勉 石毛
隆成 岡田
宏樹 南
宗丈 宮下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2022558851A priority Critical patent/JP7268802B2/ja
Priority to CN202180062056.8A priority patent/CN116057693B/zh
Publication of WO2022091479A1 publication Critical patent/WO2022091479A1/ja
Priority to US18/131,385 priority patent/US20230282569A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
    • H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
    • H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1584—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel

Definitions

  • the present invention relates to a power supply circuit module mounted on a circuit board or the like of an electronic device.
  • Patent Document 1 describes a plurality of substrates in which main surfaces are arranged in parallel, a substrate-to-board connection member connecting these substrates, and a substrate main surface in the longitudinal direction on the substrate main surface of at least one substrate. It has columnar parallel portions arranged in parallel, and the other end side of the parallel portion is arranged so as to extend to the end portion of the main surface of the member, and one end side is connected to the member connection electrode formed on the main surface of the substrate.
  • a two-story laminated mounting structure is shown in which a member connecting members is provided, and members arranged so that the main surface of the substrate and the main surfaces are orthogonal to each other are connected to the other end side of the parallel portion. Has been done.
  • a member arranged so as to be orthogonal to the main surface of the substrate can be connected to the other end side of the parallel portion. Members can be connected easily and at high density.
  • the two-story structure not only increases the density but also has good electrical characteristics.
  • an object of the present invention is to provide a power supply circuit module having good electrical characteristics while being miniaturized by adopting a two-story structure.
  • the power supply circuit module as an example of the present disclosure includes a lower board, an upper board parallel to the lower board, a lower board side component mounted on the lower board, and an upper board side component mounted on the upper board.
  • a power supply circuit including a plurality of inter-board connection members for electrically and mechanically connecting the lower substrate and the upper substrate is provided, and a part of the plurality of inter-board connection members is the power supply circuit. It is characterized in that it is a part of an inductor constituting a part of the power supply circuit or an inductor forming a part of the power supply circuit.
  • a power supply circuit module having good electrical characteristics can be obtained by providing an upper board and a lower board on which components are mounted, respectively, so that the size can be reduced and the parasitic component by the inter-board connection member can be effectively used. Be done.
  • FIG. 1 is a perspective view of the power supply circuit module 101 according to the first embodiment.
  • FIG. 2 is a perspective view showing a state in which the upper substrate 40 is removed together with the upper substrate side component and the upper substrate side resin layer 41 from the state shown in FIG.
  • FIG. 3 is a perspective view showing a state in which the inter-board connection members 52A to 52G and 54A to 54G are further removed from the state shown in FIG.
  • FIG. 4 is a perspective view of the inductor element 20 alone.
  • FIG. 5 is a perspective view showing a state in which the inductor element 20 is removed from the state shown in FIG.
  • FIG. 6 is a perspective view showing the positional relationship between the upper substrate 40 and the inductor element 20 in contact with the upper substrate 40.
  • FIG. 1 is a perspective view of the power supply circuit module 101 according to the first embodiment.
  • FIG. 2 is a perspective view showing a state in which the upper substrate 40 is removed together with the upper substrate side component and the upper substrate side resin layer 41 from
  • FIG. 7 is a perspective view showing the lower surface of the upper substrate 40.
  • FIG. 8 is a bottom view of the lower substrate 30.
  • FIG. 9 is a perspective view of a plurality of power supply circuit modules mounted on a mounting board.
  • FIG. 10 is a perspective view of a power supply circuit module having a partially different structure from the power supply circuit module shown in FIG.
  • FIG. 11 is a circuit diagram of a power supply circuit formed in the power supply circuit module 101 according to the first embodiment.
  • FIG. 12 is a diagram showing an arrangement relationship between the switching circuit components 11 and 12 and the inductor element 20.
  • FIG. 13 is a perspective view of the inductor element 20 provided in the power supply circuit module of the second embodiment.
  • FIG. 14 (A) and 14 (B) are front views of the main part of the power supply circuit module according to the third embodiment.
  • FIG. 15 is a perspective view of the power supply circuit module 104A according to the fourth embodiment.
  • FIG. 16 is a perspective view of another power supply circuit module 104B according to the fourth embodiment.
  • FIG. 17 is a perspective view of the power supply circuit module 105 according to the fifth embodiment.
  • FIG. 18 is a perspective view of the power supply circuit module 106 according to the sixth embodiment.
  • FIG. 19 is a front perspective view of the upper part of the power supply circuit module 106 shown in FIG.
  • FIG. 20 is a perspective view of the power supply circuit module 107 according to the seventh embodiment.
  • 21 is a front perspective view of the upper part of the power supply circuit module 107 shown in FIG. 20.
  • FIG. 22 is a perspective view of the power supply circuit module 108 according to the eighth embodiment.
  • FIG. 23 is a front perspective view of the upper part of the power supply circuit module 108 shown in FIG. 22.
  • FIG. 24 is a perspective view of the power supply circuit module 109 according to the ninth embodiment.
  • FIG. 25 is a perspective view of the state shown in FIG. 24 in a state where the upper substrate 40 is removed.
  • FIG. 26 is a perspective view showing a state in which the low-side source connecting member 80 and the inter-board connection members 52A to 52E and 54A to 54C are removed from the state shown in FIG. 25.
  • FIG. 27 is a circuit diagram of a power supply circuit formed in the power supply circuit module 109 according to the ninth embodiment.
  • FIG. 28 is a circuit diagram of another power supply circuit formed in the power supply circuit module according to the ninth embodiment.
  • FIG. 1 is a perspective view of the power supply circuit module 101 according to the first embodiment.
  • the power supply circuit module 101 includes a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-board connection members for electrically and mechanically connecting the lower substrate 30 and the upper substrate 40. It is equipped with a power supply circuit to be configured.
  • the lower substrate 30 and the upper substrate 40 each have a mounting surface on the upper surface, and the mounting surface of the lower substrate 30 and the mounting surface of the upper substrate 40 are parallel to each other. Further, in the thickness direction of the substrate, the upper surface of the lower substrate 30 and the lower surface of the upper substrate 40 face each other.
  • the chip component 32 and the inductor element 20 are mounted on the lower substrate 30.
  • the chip component 32 and the inductor element 20 are components on the lower substrate side.
  • Chip components 42 and switching circuit components 11 and 12 are mounted on the upper board 40. These chip parts 42 and switching circuit parts 11 and 12 are the above-mentioned board-side parts.
  • the lower substrate 30 is covered with a resin layer 31 on the lower substrate side.
  • the upper substrate 40 is covered with the resin layer 41 on the upper substrate side. In FIG. 1 (also in FIGS. 2, 3 and the like shown later), the lower substrate side resin layer 31 and the upper substrate side resin layer 41 are shown in a transparent manner.
  • FIG. 2 is a perspective view showing a state in which the upper substrate 40 is removed together with the upper substrate side component and the upper substrate side resin layer 41 from the state shown in FIG.
  • a plurality of inter-board connection members 51A to electrically and mechanically connect the lower substrate 30 and the upper substrate 40 between the lower substrate 30 and the upper substrate 40.
  • 51H, 52A to 52G, 53A, 54A to 54G and the like are provided.
  • These board-to-board connection members are columnar metal bodies such as copper pins.
  • FIG. 3 is a perspective view showing a state in which the inter-board connection members 52A to 52G and 54A to 54G are further removed from the state shown in FIG.
  • FIG. 4 is a perspective view of the inductor element 20 alone.
  • FIG. 5 is a perspective view showing a state in which the inductor element 20 is removed from the state shown in FIG.
  • the inductor element 20 has a rectangular parallelepiped shape as a whole, and is provided with input side terminals 21 and 23 and output side terminals 22 and 24 on its side. As shown in FIGS. 3, 4, and 5, the terminal 21 of the inductor element 20 conducts to the inter-board connection member 53H, and the terminal 23 conducts to the inter-board connection member 51H. Further, the terminal 22 of the inductor element 20 conducts to the inter-board connection members 51I, 51J, 51K, and the terminal 24 conducts to the inter-board connection members 53I, 53J, 53K.
  • FIG. 6 is a perspective view showing the positional relationship between the upper substrate 40 and the inductor element 20 in contact with the upper substrate 40.
  • FIG. 7 is a perspective view showing the lower surface of the upper substrate 40. However, in FIGS. 6 and 7, they are shown in an inverted state.
  • the input side terminals 21 and 23 of the inductor element 20 conduct to the electrodes 40E1 and 40E3 of the upper substrate 40, respectively, and the output side terminals 22 and 24 are the electrodes 40E2 and 40E2 of the upper substrate 40. Conducts to 40E4 respectively.
  • the input side terminal 21 of the inductor element 20 and the inter-board connection member 53H constitute an inter-board connection member that electrically and mechanically connects the lower substrate 30 and the upper substrate 40.
  • the input side terminal 23 and the inter-board connection member 51H form an inter-board connection member.
  • the output side terminal 22 of the inductor element 20 and the inter-board connection members 51I, 51J, 51K constitute an inter-board connection member that electrically and mechanically connects the lower substrate 30 and the upper substrate 40.
  • the output side terminal 24 and the inter-board connection members 53I, 53J, 53K constitute an inter-board connection member.
  • the input side terminals 21 and 23 and the output side terminals 22 and 24 of the inductor element 20 utilize the parasitic inductance as a passive component. Further, the lower ends of the input side terminals 21 and 23 and the output side terminals 22 and 24 are connected to the electrodes of the lower substrate 30, respectively. The upper ends of the input side terminals 21 and 23 and the output side terminals 22 and 24 are connected to the electrodes of the upper substrate 40, respectively.
  • each connection portion of the inter-board connection member is electrically and mechanically connected by soldering or a conductive adhesive.
  • the lower surfaces of the inter-board connection members 51A to 51K and 53A to 53K are connected to the electrodes of the lower substrate 30.
  • the lower surfaces of the inter-board connection members 52A to 52G and 54A to 54G are connected to the upper surfaces of the inter-board connection members 51A to 51G and 53A to 53G, and the upper surfaces of the inter-board connection members 52A to 52G and 54A to 54G are the upper substrates 40. It is connected to the electrode of.
  • FIG. 8 is a bottom view of the lower substrate 30.
  • a plurality of electrodes are arranged on the lower surface of the lower substrate 30.
  • the power supply circuit module 101 is mounted on the mounting board by connecting these electrodes to the mounting board by soldering or the like.
  • a chip component 42 other than the two switching circuit components 11 and 12 is arranged between the two switching circuit components 11 and 12.
  • the chip component 42 is, for example, a capacitor that constitutes a part of a DC-DC converter circuit.
  • These chip components 42 other than the switching circuit components 11 and 12 generate less heat, and the two switching circuit components 11 and 12 are thermally separated by these chip components 42. Further, the two switching circuit components 11 and 12 are distributed and arranged on the upper substrate 40. Therefore, the excessive rise in the temperature of the switching circuit components 11 and 12 is suppressed.
  • the upper substrate 40 includes an upper substrate side resin layer 41 that seals the chip component 42 and the switching circuit components 11 and 12.
  • the upper substrate side resin meeting 41 has a flat upper surface. This facilitates adsorption in the manufacturing process. Further, since heat dissipation parts such as a heat sink can be mounted on the surface, it is easy to obtain good heat dissipation.
  • FIG. 9 is a perspective view of a plurality of power supply circuit modules mounted on a mounting board.
  • the mounting board is not shown.
  • the radiator 60 is mounted on the upper surfaces of the four power supply circuit modules 101A, 101B, 101C, and 101D.
  • the radiator 60 is shown transparently.
  • the resin layer on the upper substrate side is not formed on the upper substrate thereof. Therefore, the switching circuit components 11 and 12 of the power supply circuit modules 101A, 101B, 101C and 101D are directly thermally coupled to the radiator 60 to effectively dissipate heat from the switching circuit components 11 and 12.
  • FIG. 10 is a perspective view of a power supply circuit module having a partially different structure from the power supply circuit module shown in FIG.
  • the space between the lower substrate side resin layer 31 and the upper substrate 40 is filled with an inter-board mold 70 made of an insulating resin. Therefore, the space between the terminals 21 to 24 of the inductor element 20 and the respective inter-board connection members adjacent to these terminals is filled with the insulating resin. Due to the structure, the electrical insulation between the terminals 21 to 24 of the inductor 2 and the inter-board connection member is further ensured.
  • FIG. 11 is a circuit diagram of a power supply circuit formed in the power supply circuit module 101 according to the first embodiment.
  • This power supply circuit is a DC-DC converter including a switching circuit 10, an inductor element 20, and smoothing capacitors Co1, Co2, and Ci.
  • the switching circuit 10 is a two-phase half-bridge circuit, and the inductor element 20 is connected between the output of the half-bridge circuit and the load (resistor RL).
  • the switching circuit 10 includes switching circuit components 11 and 12.
  • the switching circuit component 11 is composed of a high-side switching element Q1, a low-side switching element Q2, and a drive circuit for driving them.
  • the switching circuit component 12 is composed of a high-side switching element Q3, a low-side switching element Q4, and a drive circuit for driving them.
  • the switching circuit component 11 may include a control circuit for controlling the switching elements Q1 and Q2.
  • the switching circuit component 12 may include a control circuit that controls the switching elements Q3 and Q4.
  • the inductor element 20 is a coupled inductor composed of coils L1 and L2 that are magnetically coupled to each other with a predetermined coupling coefficient.
  • the inductors L3 and L4 shown in FIG. 11 represent the leakage inductance generated by the uncoupling of the coils L1 and L2 by a circuit symbol.
  • the inductors L21 and L23 represent the parasitic inductance generated in the input side terminals 21 and 23 by circuit symbols, respectively.
  • the inductors L22 and L24 represent the parasitic inductance generated in the output side terminals 22 and 24 by circuit symbols, respectively.
  • inductors L21 and L22 are connected in series with the inductor L3, a circuit in which these combined inductances are connected to the output unit of the switching circuit component 11 is configured.
  • inductors L23 and L24 are connected in series to the inductor L4, a circuit in which these combined inductances are connected to the output unit of the switching circuit component 12 is configured.
  • the switching elements Q1, Q2, Q3, and Q4 of the switching circuit components 11 and 12 are driven in a two-phase phase with a 180-degree phase difference.
  • the smoothing capacitors Co1 and Co2 are connected in parallel to smooth the fluctuation of the output voltage Vout.
  • the smoothing capacitor Ci smoothes the input voltage Vin.
  • the load connected to the output of the power supply circuit module 101 is represented by a resistor RL.
  • the DC-DC converter is a two-phase phase in which the inductors of the two DC-DC converters are magnetically coupled to each other, the ripple of the output voltage is effectively suppressed. Further, since the voltage applied to the coils L1 and L2 can be reduced by the mutual inductor by magnetic coupling, the inductance of the coils L1 and L2 can be reduced. This enhances the responsiveness to the load response.
  • signals such as Isense1, Isense2, PWM1, and PWM2 pass through the inter-board connection members 51A to 51D and 52A to 52D.
  • the ground line and the power supply line are arranged in the vicinity of the input side terminals 21 and 23 of the inductor element 20, or are surrounded by the ground line and the power supply line, and the input side terminal 21 having a large voltage change of the inductor element 20 is formed. , 23 will be shielded by the ground line and power supply line. As a result, unnecessary radiation from the inductor element 20 is effectively suppressed.
  • a shield member such as a metal plate may be provided between the terminals 21 to 24 of the inductor element 20 and the inter-board connection members 51A to 51D and 52A to 52D.
  • This shield member is not limited to a metal plate, but may be a columnar conductor. Further, the shield member may be connected to the ground.
  • FIG. 12 is a diagram showing the arrangement relationship between the switching circuit components 11 and 12 and the inductor element 20.
  • the terminals 21 to 24 of the inductor element 20 overlap with the switching circuit components 11 and 12.
  • the inductor element 20 includes four terminals in which the input side terminals 21 and 23 and the output side terminals 22 and 24 are arranged point-symmetrically with respect to the center point O of the inductor element 20.
  • the positions of the input side terminal and the output side terminal are juxtaposed with each other in a 180-degree rotation position.
  • the input side terminal 21 of the inductor element 20 is close to the output terminal SWout1 of the switching circuit component 11, and the input side terminal 23 of the inductor element 20 is close to the output terminal SWout2 of the switching circuit component 12. are doing. Therefore, the parasitic resistance in the connection path between the switching circuit components 11 and 12 and the inductor element 20 is minimized.
  • the power input terminal Vin1 of the switching circuit component 11 and the power input terminal Vin2 of the switching circuit component 12 are close to each other. Therefore, the connection lines of the power input terminals Vin1 and Vin2 are evenly shortened, and the total parasitic resistance in the lines connected to the power input terminals Vin1 and Vin2 is suppressed. Further, the smoothing capacitor Ci connected to these power input terminals Vin1 and Vin2 can be configured by a single component. If the output terminals SWout1 and SWout2 of the switching circuit components 11 and 12 are arranged close to each other, the smoothing capacitors Co1 and Co2 can be configured by a single component.
  • Second Embodiment the power supply circuit module characterized by the configuration of the terminal of the inductor will be illustrated.
  • FIG. 13 is a perspective view of the inductor element 20 provided in the power supply circuit module of the second embodiment.
  • the inductor element 20 includes input side terminals 21 and 23 and output side terminals 22 and 24.
  • the output side terminals 22 and 24 have a wide portion in contact with the electrode formed on the lower surface of the upper substrate (upper substrate 40 in the example shown in FIG. 1). An electrode to which the output side terminals 22 and 24 of the inductor element 20 are in contact is formed on the lower surface of the upper substrate. Therefore, the electrical connection and the mechanical connection between the output side terminals 22 and 24 of the inductor element 20 and the electrodes on the upper substrate side on which the output side terminals 22 and 24 are conductive are strengthened. In the example shown in FIG. 13, wide portions are provided on the output side terminals 22 and 24, but wide portions may be provided on the input side terminals 21 and 23. Furthermore, wide portions may be provided in all the terminals 21 to 24.
  • FIG. 14 (A) and 14 (B) are front views of the main part of the power supply circuit module according to the third embodiment.
  • a plurality of inter-board connection members are formed between the lower substrate 30 and the upper substrate 40, and among these inter-board connection members, the chip component 55 is the upper surface of the lower substrate 30. Is connected in series between the electrodes formed on the top substrate 40 and the electrodes formed on the lower surface of the upper substrate 40.
  • the chip component 55 is, for example, a chip capacitor, a chip inductor, or a chip resistor, and constitutes a part of a circuit of a power supply circuit module.
  • a plurality of inter-board connection members are formed between the lower substrate 30 and the upper substrate 40, and one of these inter-board connection members is a chip component 56A, 56B. It is composed of.
  • the chip component 56A is mounted on the upper surface of the lower substrate 30, and the chip component 56B is mounted on the lower surface of the upper substrate 40. Further, the chip component 56A and the chip component 56B are electrically and mechanically connected to each other.
  • the chip components 56A and 56B are connected in parallel to each other, and this parallel circuit is connected to an electrode formed on the upper surface of the lower substrate 30 and an electrode formed on the lower surface of the upper substrate 40.
  • the chip components 56A and 56B are, for example, a chip capacitor, a chip inductor, and a chip resistor, and form a part of a circuit of a power supply circuit module.
  • the inter-board connection member is not limited to the terminal of the component, but may be a passive component or a part of the passive component constituting a part of the power supply circuit.
  • FIG. 15 is a perspective view of the power supply circuit module 104A according to the fourth embodiment.
  • FIG. 16 is a perspective view of another power supply circuit module 104B according to the fourth embodiment.
  • These power supply circuit modules 104A and 104B include a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-board connection members for electrically and mechanically connecting the lower substrate 30 and the upper substrate 40. To prepare for.
  • the lower substrate 30 is composed of a multilayer board, and chip components and an inductor element 20 are mounted therein. Chip components and switching circuit components 11 and 12 are mounted on the upper board 40.
  • the upper substrate 40 is covered with the resin layer 41 on the upper substrate side.
  • a plurality of inter-board connection members 52G, 54A to 54G that electrically and mechanically connect the lower substrate 30 and the upper substrate 40 are shown.
  • the adjacent substrate-to-board connection members are connected to each other via an insulating resin body 71. That is, the insulating resin body 71 is interposed between the adjacent inter-board connection members.
  • These resin bodies 71 are formed by coating.
  • Other schematic configurations are as shown in the first embodiment.
  • FIG. 16 shows a plurality of inter-board connection members 52G, 54A to 54D that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.
  • the predetermined height positions of these inter-board connection members are filled with an insulating resin body 72. That is, each substrate-to-board connection member penetrates the insulating resin body 72.
  • Other schematic configurations are as shown in the first embodiment.
  • the relative positions of the plurality of inter-board connection members and the relative positions of the inter-board connection members and the terminals of the inductor element 20 can be fixed, so that electrical insulation is ensured between them.
  • FIG. 17 is a perspective view of the power supply circuit module 105 according to the fifth embodiment.
  • the power supply circuit module 105 includes a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-board connection members for electrically and mechanically connecting the lower substrate 30 and the upper substrate 40. ..
  • inter-board connection members 52G, 54A to 54G that electrically and mechanically connect the lower substrate 30 and the upper substrate 40 are shown.
  • the area of the lower surface of these inter-board connection members 52G, 54A to 54G is larger than the area of the upper surface.
  • a power supply circuit module including a metal plate for protection and heat dissipation in the resin layer on the upper substrate side will be exemplified.
  • FIG. 18 is a perspective view of the power supply circuit module 106 according to the sixth embodiment.
  • FIG. 19 is a front perspective view of the upper part of the power supply circuit module 106 shown in FIG.
  • the power supply circuit module 106 includes a plurality of inter-board connection members 52A to 52G that electrically and mechanically connect the lower substrate 30, the upper substrate 40 parallel to the lower substrate 30, and the lower substrate 30 and the upper substrate 40. It is equipped with 54G and the like.
  • the lower substrate 30 is composed of a multilayer board, and chip components and an inductor element 20 are mounted therein.
  • a plurality of chip parts and switching circuit parts 11 and 12 are mounted on the upper board 40. Further, the upper surface of the upper substrate 40 is coated with the resin layer 41 on the upper substrate side. The upper substrate side resin layer 41 is provided with a metal plate 43 exposed on the outer surface. The metal plate 43 is adhered to the switching circuit components 11 and 12 via a thermal conductor TIM (Thermal Interface Material).
  • the metal plate 43 is, for example, a copper plate having a small thermal resistance.
  • the metal plate 43 is provided on the surface of the resin layer 41 on the upper substrate side, it is applied to the components mounted on the upper substrate 40 (switching circuit components 11, 12, etc.) by an external force. Stress is suppressed.
  • the switching circuit components 11 and 12 which are heat generating components have high heat dissipation, and the heat dissipation of the heat generating component and the upper substrate 40 Has high heat dissipation.
  • a power supply circuit module including a metal plate for protection and heat dissipation in the resin layer on the upper substrate side will be exemplified.
  • FIG. 20 is a perspective view of the power supply circuit module 107 according to the seventh embodiment.
  • 21 is a front perspective view of the upper part of the power supply circuit module 107 shown in FIG. 20.
  • the power supply circuit module 107 includes a plurality of inter-board connection members 52A to 52G that electrically and mechanically connect the lower substrate 30, the upper substrate 40 parallel to the lower substrate 30, and the lower substrate 30 and the upper substrate 40. It is equipped with 54G and the like.
  • the lower substrate 30 is composed of a multilayer board, and chip components and an inductor element 20 are mounted therein.
  • a plurality of chip parts and switching circuit parts 11 and 12 are mounted on the upper board 40. Further, the upper surface of the upper substrate 40 is coated with the resin layer 41 on the upper substrate side. The upper substrate side resin layer 41 is provided with a metal plate 43 exposed on the outer surface. The metal plate 43 is adhered to the switching circuit components 11 and 12 via a thermal conductor TIM (Thermal Interface Material).
  • the metal plate 43 is, for example, a copper plate having a small thermal resistance.
  • the tapered portion TP is provided on the edge of the metal plate 43.
  • the direction of this taper is a direction for suppressing the protrusion of the metal plate 43 to the outer surface of the resin layer 41 on the upper substrate side.
  • the coefficient of thermal expansion (linear expansion coefficient) of the metal plate 43 and the upper substrate side resin layer 41 are different, the metal plate 43 and the upper substrate side resin layer 41 engage with each other at the tapered portion of the edge of the metal plate 43. Therefore, the metal plate 43 is suppressed from being lifted or detached from the resin layer 41 on the upper substrate side.
  • the resistance to stress caused by the difference in the external force and the coefficient of thermal expansion of the components mounted on the upper board 40 is high.
  • the switching circuit parts 11 and 12 which are heat generating parts, have high heat dissipation, the heat dissipation of the heat generating parts and the heat dissipation of the upper board 40 are high.
  • FIG. 22 is a perspective view of the power supply circuit module 108 according to the eighth embodiment.
  • FIG. 23 is a front perspective view of the upper part of the power supply circuit module 108 shown in FIG. 22.
  • the power supply circuit module 108 includes a plurality of inter-board connection members 52A to 52G that electrically and mechanically connect the lower substrate 30, the upper substrate 40 parallel to the lower substrate 30, and the lower substrate 30 and the upper substrate 40. It is equipped with 54G and the like.
  • the lower substrate 30 is composed of a multilayer board, and chip components and an inductor element 20 are mounted therein.
  • a plurality of chip parts and switching circuit parts 11 and 12 are mounted on the upper board 40. Further, the upper surface of the upper substrate 40 is covered with the resin layer 41 on the upper substrate side. The upper substrate side resin layer 41 is provided with a metal plate 43 exposed on the outer surface. The metal plate 43 is adhered to the switching circuit components 11 and 12 via a thermal conductor TIM (Thermal Interface Material).
  • the metal plate 43 is, for example, a copper plate having a small thermal resistance.
  • the exposed portion 43E which is a part of the edge of the metal plate 43, is exposed on the side portion of the resin layer 41 on the upper substrate side.
  • the metal plate 43 and the upper substrate side resin layer 41 are engaged with each other at the exposed portion 43E at the edge of the metal plate 43, the metal plate 43 is suppressed from being lifted or detached from the upper substrate side resin layer 41.
  • the metal plate 43 is integrated over a plurality of power supply circuit modules. That is, before the separation of the plurality of power supply circuit modules that are continuous in the vertical and horizontal directions, the metal plate 43 is an integral body. Then, the plurality of power supply circuit modules are separated into individual power supply circuit modules 108 by separating them at the portion of the metal plate 43. The exposed portion 43E at the edge of the metal plate 43 is a portion exposed by separating the plurality of power supply circuit modules into individual power supply circuit modules 108.
  • the resistance to stress caused by the difference in the external force and the coefficient of thermal expansion of the components mounted on the upper board 40 is high.
  • the switching circuit parts 11 and 12 which are heat generating parts, have high heat dissipation, the heat dissipation of the heat generating parts and the heat dissipation of the upper board 40 are high.
  • a power supply circuit module characterized by a connection structure between the drain of the switching element and the electrode of the lower substrate will be exemplified.
  • FIG. 24 is a perspective view of the power supply circuit module 109 according to the ninth embodiment.
  • the power supply circuit module 109 includes a lower substrate 30 and an upper substrate 40 parallel to the lower substrate 30.
  • FIG. 25 is a perspective view of the state shown in FIG. 24 with the upper substrate 40 removed.
  • the power supply circuit module 109 includes a plurality of inter-board connection members 52A to 52E, 54A to 54C, and the like that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.
  • FIG. 26 is a perspective view in a state where the low-side source connecting member 80 and the inter-board connection members 52A to 52E and 54A to 54C, which will be described later, are removed from the state shown in FIG. 25.
  • the lower substrate 30 is composed of a multilayer board, and chip components and an inductor element 20 are mounted on the lower substrate 30.
  • FIG. 27 is a circuit diagram of a power supply circuit formed in the power supply circuit module 109 according to the ninth embodiment.
  • This power supply circuit is a DC-DC converter including a switching circuit 10, an inductor element 20, and smoothing capacitors Co1, Co2, and Ci.
  • the switching circuit 10 has two step-down converter circuits arranged in parallel, and has two pairs of switching circuits using MOS-FETs connected by a half bridge.
  • the inductor element 20 is connected between the intermediate potential of the half-bridge connection and the load (resistance RL).
  • the switching circuit 10 includes switching circuit components 11 and 12.
  • the switching circuit component 11 is composed of a high-side switching element Q1, a low-side switching element Q2, and a drive circuit for driving them.
  • the switching circuit component 12 is composed of a high-side switching element Q3, a low-side switching element Q4, and a drive circuit for driving them.
  • switching circuit components 11 and 12 and chip components 42 are mounted on the upper surface of the upper board 40.
  • the area A11 is a mounting area for the switching circuit component 11
  • the area A12 is a mounting area for the switching circuit component 12.
  • An electrode to which the drain of the low-side switching element Q2 of the switching circuit component 11 is connected is formed in the low-side drain connection portion LD in the region A11. Similarly, an electrode to which the drain of the low-side switching element Q4 of the switching circuit component 12 is connected is formed in the low-side drain connection portion LD in the region A12. Further, an electrode to which the source of the low-side switching element Q2 of the switching circuit component 11 is connected is formed in the low-side source connection portion LS in the region A11. Similarly, an electrode to which the source of the low-side switching element Q4 of the switching circuit component 12 is connected is formed in the low-side source connection portion LS in the region A12.
  • An electrode to which the drain of the high-side switching element Q1 of the switching circuit component 11 is connected is formed in the high-side drain connection portion HD in the region A11.
  • an electrode to which the drain of the high-side switching element Q3 of the switching circuit component 12 is connected is formed in the high-side drain connection portion HD in the region A12.
  • an electrode to which the source of the high-side switching element Q1 of the switching circuit component 11 is connected is formed in the high-side source connection portion HS in the region A11.
  • an electrode to which the source of the high-side switching element Q3 of the switching circuit component 12 is connected is formed in the high-side source connection portion HS in the region A12.
  • the low-side source connection unit LS, low-side drain connection unit LD, high-side source connection unit HS, and high-side drain connection unit HD correspond to LS, LD, HS, and HD shown in FIG. 27, respectively.
  • the low-side source connecting member 80 includes a contact surface 80S that abuts on the back surface of the upper substrate 40, legs 80F extending from the contact surface 80S toward the lower substrate 30, and the same. It has a bent portion 80B between the contact surface 80S and the leg portion 80F. The contact surface 80S, the leg portion 80F, and the bent portion 80B are integrated. Since the low-side source connecting member 80 is a molded body of a copper plate and is thicker than the conductor pattern formed on the lower substrate 30 and the upper substrate 40, the resistance value is lower than that of the conductor pattern.
  • a part of the low-side source connecting member 80 is conductive to the low-side source connecting portion LS in the region A11 of the upper substrate 40 and the low-side source connecting portion LS in the region A12. ..
  • the input side terminal 21 of the inductor element 20 is conducting to the low side drain connection portion LD and the high side source connection portion HS in the region A11 of the upper substrate 40.
  • the input side terminal 23 of the inductor element 20 is conductive to the low side drain connection portion LD and the high side source connection portion HS in the region A12 of the upper substrate 40.
  • the circuit configuration itself of the power supply circuit module 109 of this embodiment is the same as the circuit configuration shown in FIG. 11 in the first embodiment.
  • the sources of the switching elements Q2 and Q4 are connected to the electrode of the low-side source connecting portion LS of the upper substrate 40 shown in FIG. 24, and the low-side source connecting member 80 is connected to the immediate vicinity of the GND electrode. ing. Therefore, the resistance component from the source of the switching elements Q2 and Q4 to the input / output terminal electrode of the GND is small.
  • the source of the switching element Q1 and the drain of the switching element Q2 are connected to the input side terminal 21 of the inductor element 20 at the shortest distance. Therefore, the resistance component from the source of the switching element Q1 and the drain of the switching element Q2 to the input side terminal 21 of the inductor element 20 is small.
  • the source of the switching element Q3 and the drain of the switching element Q4 are connected to the input side terminal 23 of the inductor element 20 at the shortest distance. Therefore, the resistance component from the source of the switching element Q3 and the drain of the switching element Q4 to the input side terminal 23 of the inductor element 20 is small.
  • the switching elements Q1 to Q4 are connected to the low-side source connecting member 80 at the shortest distance, the resistance of the current path to which the sources of the switching elements Q1 to Q4 are connected is small, and the power efficiency due to the resistance is small. The decrease can be suppressed.
  • FIG. 28 is a circuit diagram of the power supply circuit module in that case. In this way, the drains of the high-side switching elements Q1 and Q3 may be configured to be connected to the high-side drain connecting member at the shortest distance.
  • the inter-board connection member is not limited to a columnar shape, but may be a prismatic shape.
  • the arrangement of parts with respect to the lower substrate 30 and the upper substrate 40 is not limited to the embodiment.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
PCT/JP2021/024397 2020-10-30 2021-06-28 電源回路モジュール Ceased WO2022091479A1 (ja)

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US18/131,385 US20230282569A1 (en) 2020-10-30 2023-04-06 Power supply circuit module

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US20230282569A1 (en) 2023-09-07

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