CN116057693B - 电源电路模块 - Google Patents

电源电路模块

Info

Publication number
CN116057693B
CN116057693B CN202180062056.8A CN202180062056A CN116057693B CN 116057693 B CN116057693 B CN 116057693B CN 202180062056 A CN202180062056 A CN 202180062056A CN 116057693 B CN116057693 B CN 116057693B
Authority
CN
China
Prior art keywords
substrate
upper substrate
circuit module
power circuit
inter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180062056.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN116057693A (zh
Inventor
武藤高见
石毛勉
冈田隆成
南宏树
宫下宗丈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN116057693A publication Critical patent/CN116057693A/zh
Application granted granted Critical
Publication of CN116057693B publication Critical patent/CN116057693B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
    • H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
    • H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1584—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
CN202180062056.8A 2020-10-30 2021-06-28 电源电路模块 Active CN116057693B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020-182955 2020-10-30
JP2020182955 2020-10-30
JP2021037422 2021-03-09
JP2021-037422 2021-03-09
PCT/JP2021/024397 WO2022091479A1 (ja) 2020-10-30 2021-06-28 電源回路モジュール

Publications (2)

Publication Number Publication Date
CN116057693A CN116057693A (zh) 2023-05-02
CN116057693B true CN116057693B (zh) 2026-03-24

Family

ID=81383869

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180062056.8A Active CN116057693B (zh) 2020-10-30 2021-06-28 电源电路模块

Country Status (4)

Country Link
US (1) US20230282569A1 (https=)
JP (1) JP7268802B2 (https=)
CN (1) CN116057693B (https=)
WO (1) WO2022091479A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230396158A1 (en) * 2021-03-10 2023-12-07 Monolithic Power Systems, Inc. Sandwich structure power supply module
WO2025100029A1 (ja) * 2023-11-07 2025-05-15 株式会社村田製作所 スイッチング電源モジュール
WO2025100028A1 (ja) * 2023-11-07 2025-05-15 株式会社村田製作所 スイッチング電源モジュール
KR20250136213A (ko) * 2024-03-07 2025-09-16 이브 에너지 씨오., 엘티디. 배터리 관리 시스템 및 배터리 팩
WO2026079148A1 (ja) * 2024-10-07 2026-04-16 株式会社村田製作所 スイッチング電源モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114686A (ja) * 1998-10-07 2000-04-21 Tdk Corp 表面実装部品
JP2004327556A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置及びその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283093A (ja) * 1987-05-14 1988-11-18 Matsushita Electric Ind Co Ltd 小型電子回路装置
JPH03191592A (ja) * 1989-12-21 1991-08-21 Taiyo Yuden Co Ltd 混成集積回路の組立構造
FR2819678B1 (fr) * 2001-01-12 2003-04-11 Sagem Circuit de filtrage, et dispositif d'alimentation de puissance equipe d'un tel circuit de filtrage
JP2006344633A (ja) * 2005-06-07 2006-12-21 Toyota Industries Corp 基板実装構造
JP5082854B2 (ja) * 2005-10-28 2012-11-28 日立金属株式会社 Ｄｃ−ｄｃコンバータ
TW200832875A (en) * 2007-01-19 2008-08-01 Murata Manufacturing Co DC-DC converter module
WO2009083890A1 (en) * 2007-12-27 2009-07-09 Nxp B.V. Apparatus and method for chip-scale package with capacitors as bumps
JP4711026B2 (ja) * 2008-10-08 2011-06-29 株式会社村田製作所 複合モジュール
JP5251791B2 (ja) * 2009-08-31 2013-07-31 株式会社デンソー 樹脂封止型半導体装置およびその製造方法
KR101405878B1 (ko) * 2011-01-26 2014-06-12 가부시키가이샤 무라타 세이사쿠쇼 전력 전송 시스템
CN205428912U (zh) * 2013-02-25 2016-08-03 株式会社村田制作所 模块以及模块元器件
WO2015019519A1 (ja) * 2013-08-07 2015-02-12 パナソニックＩｐマネジメント株式会社 Ｄｃ－ｄｃコンバータモジュール
US20150201495A1 (en) * 2014-01-14 2015-07-16 Qualcomm Incorporated Stacked conductive interconnect inductor
JP2017084961A (ja) * 2015-10-28 2017-05-18 株式会社村田製作所 集積回路素子の実装構造
WO2017183385A1 (ja) * 2016-04-21 2017-10-26 株式会社村田製作所 電源モジュール
WO2018190850A1 (en) * 2017-04-13 2018-10-18 Hewlett-Packard Development Company, L.P. Connecting circuit boards using functional components
JPWO2020017582A1 (ja) * 2018-07-20 2021-06-24 株式会社村田製作所 モジュール
JP2021182575A (ja) * 2020-05-18 2021-11-25 現代自動車株式会社Hyundai Motor Company 半導体装置内部スナバ回路接続構造及びこれを用いたパワーモジュール構造
WO2022004420A1 (ja) * 2020-06-30 2022-01-06 株式会社村田製作所 電源モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114686A (ja) * 1998-10-07 2000-04-21 Tdk Corp 表面実装部品
JP2004327556A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
CN116057693A (zh) 2023-05-02
JPWO2022091479A1 (https=) 2022-05-05
JP7268802B2 (ja) 2023-05-08
WO2022091479A1 (ja) 2022-05-05
US20230282569A1 (en) 2023-09-07

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