JPWO2022059742A1 - - Google Patents

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Publication number
JPWO2022059742A1
JPWO2022059742A1 JP2022550608A JP2022550608A JPWO2022059742A1 JP WO2022059742 A1 JPWO2022059742 A1 JP WO2022059742A1 JP 2022550608 A JP2022550608 A JP 2022550608A JP 2022550608 A JP2022550608 A JP 2022550608A JP WO2022059742 A1 JPWO2022059742 A1 JP WO2022059742A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022550608A
Other languages
Japanese (ja)
Other versions
JP7439283B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022059742A1 publication Critical patent/JPWO2022059742A1/ja
Application granted granted Critical
Publication of JP7439283B2 publication Critical patent/JP7439283B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Sealing Material Composition (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2022550608A 2020-09-18 2021-09-16 表示素子用封止剤およびその硬化物 Active JP7439283B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020157661 2020-09-18
JP2020157661 2020-09-18
PCT/JP2021/034167 WO2022059742A1 (ja) 2020-09-18 2021-09-16 表示素子用封止剤およびその硬化物

Publications (2)

Publication Number Publication Date
JPWO2022059742A1 true JPWO2022059742A1 (zh) 2022-03-24
JP7439283B2 JP7439283B2 (ja) 2024-02-27

Family

ID=80776725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022550608A Active JP7439283B2 (ja) 2020-09-18 2021-09-16 表示素子用封止剤およびその硬化物

Country Status (5)

Country Link
JP (1) JP7439283B2 (zh)
KR (1) KR20230022968A (zh)
CN (1) CN115836094B (zh)
TW (1) TW202216945A (zh)
WO (1) WO2022059742A1 (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017536429A (ja) * 2014-10-29 2017-12-07 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. ディスプレイ密封材用組成物、これを含む有機保護層、およびこれらを含むディスプレイ装置
WO2019230846A1 (ja) * 2018-05-30 2019-12-05 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP2020034867A (ja) * 2018-08-31 2020-03-05 三井化学株式会社 硬化型封止材、硬化物および表示装置
WO2020129792A1 (ja) * 2018-12-18 2020-06-25 積水化学工業株式会社 硬化性樹脂組成物、硬化物、及び、有機ｅｌ表示素子
WO2020129794A1 (ja) * 2018-12-18 2020-06-25 積水化学工業株式会社 硬化性樹脂組成物、硬化物、及び、有機ｅｌ表示素子
WO2021100710A1 (ja) * 2019-11-18 2021-05-27 デンカ株式会社 組成物、硬化体、有機エレクトロルミネッセンス表示素子用封止材及び有機エレクトロルミネッセンス表示装置
WO2021100711A1 (ja) * 2019-11-18 2021-05-27 デンカ株式会社 組成物、硬化体、有機エレクトロルミネッセンス表示素子用封止材及び有機エレクトロルミネッセンス表示装置
WO2021200668A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 感光性組成物、硬化物、有機エレクトロルミネッセンス表示装置および感光性組成物の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017061606A (ja) * 2015-09-24 2017-03-30 Jsr株式会社 硬化性組成物、硬化物、硬化物の形成方法、積層体及び有機ｅｌデバイス
JP6294522B1 (ja) * 2017-02-14 2018-03-14 積水化学工業株式会社 有機ｅｌ表示素子用封止剤、及び、有機ｅｌ表示素子
WO2019082996A1 (ja) * 2017-10-26 2019-05-02 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017536429A (ja) * 2014-10-29 2017-12-07 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. ディスプレイ密封材用組成物、これを含む有機保護層、およびこれらを含むディスプレイ装置
WO2019230846A1 (ja) * 2018-05-30 2019-12-05 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP2020034867A (ja) * 2018-08-31 2020-03-05 三井化学株式会社 硬化型封止材、硬化物および表示装置
WO2020129792A1 (ja) * 2018-12-18 2020-06-25 積水化学工業株式会社 硬化性樹脂組成物、硬化物、及び、有機ｅｌ表示素子
WO2020129794A1 (ja) * 2018-12-18 2020-06-25 積水化学工業株式会社 硬化性樹脂組成物、硬化物、及び、有機ｅｌ表示素子
WO2021100710A1 (ja) * 2019-11-18 2021-05-27 デンカ株式会社 組成物、硬化体、有機エレクトロルミネッセンス表示素子用封止材及び有機エレクトロルミネッセンス表示装置
WO2021100711A1 (ja) * 2019-11-18 2021-05-27 デンカ株式会社 組成物、硬化体、有機エレクトロルミネッセンス表示素子用封止材及び有機エレクトロルミネッセンス表示装置
WO2021200668A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 感光性組成物、硬化物、有機エレクトロルミネッセンス表示装置および感光性組成物の製造方法

Also Published As

Publication number Publication date
WO2022059742A1 (ja) 2022-03-24
TW202216945A (zh) 2022-05-01
KR20230022968A (ko) 2023-02-16
JP7439283B2 (ja) 2024-02-27
CN115836094B (zh) 2024-07-16
CN115836094A (zh) 2023-03-21

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