JPWO2022044865A5 - - Google Patents

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Publication number
JPWO2022044865A5
JPWO2022044865A5 JP2022544463A JP2022544463A JPWO2022044865A5 JP WO2022044865 A5 JPWO2022044865 A5 JP WO2022044865A5 JP 2022544463 A JP2022544463 A JP 2022544463A JP 2022544463 A JP2022544463 A JP 2022544463A JP WO2022044865 A5 JPWO2022044865 A5 JP WO2022044865A5
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JP
Japan
Prior art keywords
semiconductor light
light emitting
emitting device
metal layer
substrate
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Application number
JP2022544463A
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English (en)
Japanese (ja)
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JP7736696B2 (ja
JPWO2022044865A1 (https=
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Priority claimed from PCT/JP2021/029884 external-priority patent/WO2022044865A1/ja
Publication of JPWO2022044865A1 publication Critical patent/JPWO2022044865A1/ja
Publication of JPWO2022044865A5 publication Critical patent/JPWO2022044865A5/ja
Application granted granted Critical
Publication of JP7736696B2 publication Critical patent/JP7736696B2/ja
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JP2022544463A 2020-08-25 2021-08-16 半導体発光装置及び光源装置 Active JP7736696B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020141924 2020-08-25
JP2020141924 2020-08-25
PCT/JP2021/029884 WO2022044865A1 (ja) 2020-08-25 2021-08-16 半導体発光装置及び光源装置

Publications (3)

Publication Number Publication Date
JPWO2022044865A1 JPWO2022044865A1 (https=) 2022-03-03
JPWO2022044865A5 true JPWO2022044865A5 (https=) 2023-05-12
JP7736696B2 JP7736696B2 (ja) 2025-09-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022544463A Active JP7736696B2 (ja) 2020-08-25 2021-08-16 半導体発光装置及び光源装置

Country Status (3)

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US (1) US20230198221A1 (https=)
JP (1) JP7736696B2 (https=)
WO (1) WO2022044865A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230238770A1 (en) * 2022-01-24 2023-07-27 Materion Corporation Semiconductor package for an edge emitting laser diode
WO2025183158A1 (ja) * 2024-02-28 2025-09-04 京セラ株式会社 光素子搭載用パッケージ及び発光装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087543A (ja) * 2002-08-23 2004-03-18 Furukawa Electric Co Ltd:The 光モジュール
KR100584972B1 (ko) * 2004-06-11 2006-05-29 삼성전기주식회사 밀봉용 스페이서가 형성된 ｍｅｍｓ 패키지 및 그 제조 방법
JP2007005505A (ja) * 2005-06-23 2007-01-11 Matsushita Electric Ind Co Ltd 半導体レーザ装置
JP2009088066A (ja) * 2007-09-28 2009-04-23 Panasonic Corp 半導体装置
JP5127594B2 (ja) * 2008-06-26 2013-01-23 三菱電機株式会社 半導体パッケージ
JP5320270B2 (ja) * 2009-11-25 2013-10-23 株式会社沖データ 表示パネルの製造方法
WO2011142059A1 (ja) * 2010-05-12 2011-11-17 パナソニック株式会社 半導体装置及びその製造方法
JP5671486B2 (ja) * 2012-01-27 2015-02-18 株式会社沖データ 発光パネル、及びそれを備えたヘッドアップディスプレイ
JP5712149B2 (ja) * 2012-01-31 2015-05-07 株式会社沖データ 表示パネル、表示パネルの製造方法、及び表示装置
JP2018106973A (ja) * 2016-12-27 2018-07-05 大日本印刷株式会社 Ｌｅｄバックライト装置およびｌｅｄ画像表示装置

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