JPWO2022004084A1 - - Google Patents
Info
- Publication number
- JPWO2022004084A1 JPWO2022004084A1 JP2022533692A JP2022533692A JPWO2022004084A1 JP WO2022004084 A1 JPWO2022004084 A1 JP WO2022004084A1 JP 2022533692 A JP2022533692 A JP 2022533692A JP 2022533692 A JP2022533692 A JP 2022533692A JP WO2022004084 A1 JPWO2022004084 A1 JP WO2022004084A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/422—PN diodes having the PN junctions in mesas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
- H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/133—Emitter regions of BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/393—Body regions of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/017—Manufacture or treatment using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/80—PNPN diodes, e.g. Shockley diodes or break-over diodes
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023123888A JP7726248B2 (ja) | 2020-07-03 | 2023-07-28 | 半導体装置 |
| JP2025127679A JP2025160397A (ja) | 2020-07-03 | 2025-07-30 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020115759 | 2020-07-03 | ||
| JP2020115759 | 2020-07-03 | ||
| PCT/JP2021/014138 WO2022004084A1 (ja) | 2020-07-03 | 2021-04-01 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023123888A Division JP7726248B2 (ja) | 2020-07-03 | 2023-07-28 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022004084A1 true JPWO2022004084A1 (enExample) | 2022-01-06 |
| JPWO2022004084A5 JPWO2022004084A5 (enExample) | 2022-08-24 |
| JP7327672B2 JP7327672B2 (ja) | 2023-08-16 |
Family
ID=79315725
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022533692A Active JP7327672B2 (ja) | 2020-07-03 | 2021-04-01 | 半導体装置 |
| JP2023123888A Active JP7726248B2 (ja) | 2020-07-03 | 2023-07-28 | 半導体装置 |
| JP2025127679A Pending JP2025160397A (ja) | 2020-07-03 | 2025-07-30 | 半導体装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023123888A Active JP7726248B2 (ja) | 2020-07-03 | 2023-07-28 | 半導体装置 |
| JP2025127679A Pending JP2025160397A (ja) | 2020-07-03 | 2025-07-30 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20220328669A1 (enExample) |
| JP (3) | JP7327672B2 (enExample) |
| CN (1) | CN114846622A (enExample) |
| DE (1) | DE112021000202T5 (enExample) |
| WO (1) | WO2022004084A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11276686B2 (en) * | 2019-05-15 | 2022-03-15 | Fuji Electric Co., Ltd. | Semiconductor device |
| EP3953972A1 (en) * | 2020-06-18 | 2022-02-16 | Dynex Semiconductor Limited | Reverse conducting igbt with controlled anode injection |
| JP7456520B2 (ja) * | 2020-12-07 | 2024-03-27 | 富士電機株式会社 | 半導体装置 |
| JP2023113080A (ja) * | 2022-02-02 | 2023-08-15 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2024241741A1 (ja) * | 2023-05-23 | 2024-11-28 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| CN117497574B (zh) * | 2023-08-31 | 2024-05-14 | 海信家电集团股份有限公司 | 半导体装置 |
| WO2025170006A1 (ja) * | 2024-02-09 | 2025-08-14 | 富士電機株式会社 | 半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012178389A (ja) * | 2011-02-25 | 2012-09-13 | Renesas Electronics Corp | 半導体装置 |
| JP2018195798A (ja) * | 2017-05-16 | 2018-12-06 | 富士電機株式会社 | 半導体装置 |
| JP2019016802A (ja) * | 2015-02-03 | 2019-01-31 | 富士電機株式会社 | 半導体装置及びその製造方法 |
| JP2019195093A (ja) * | 2016-03-10 | 2019-11-07 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2703831A1 (fr) * | 1993-04-07 | 1994-10-14 | Philips Composants | Dispositif semiconducteur comprenant un transistor latéral. |
| JP2009283540A (ja) * | 2008-05-20 | 2009-12-03 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
| US20100308400A1 (en) * | 2008-06-20 | 2010-12-09 | Maxpower Semiconductor Inc. | Semiconductor Power Switches Having Trench Gates |
| US8390060B2 (en) * | 2010-07-06 | 2013-03-05 | Maxpower Semiconductor, Inc. | Power semiconductor devices, structures, and related methods |
| JP6190206B2 (ja) * | 2012-08-21 | 2017-08-30 | ローム株式会社 | 半導体装置 |
| DE112013007576B4 (de) * | 2013-11-05 | 2022-02-03 | Denso Corporation | Halbleitereinrichtung |
| JP6817777B2 (ja) * | 2015-12-16 | 2021-01-20 | ローム株式会社 | 半導体装置 |
| JP6885101B2 (ja) * | 2016-03-11 | 2021-06-09 | 富士電機株式会社 | 半導体装置 |
| JP6741070B2 (ja) | 2016-09-14 | 2020-08-19 | 富士電機株式会社 | 半導体装置およびその製造方法 |
| JP6958011B2 (ja) * | 2017-06-15 | 2021-11-02 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| US10510832B2 (en) * | 2017-07-14 | 2019-12-17 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP7143575B2 (ja) * | 2017-07-18 | 2022-09-29 | 富士電機株式会社 | 半導体装置 |
| JP6958093B2 (ja) * | 2017-08-09 | 2021-11-02 | 富士電機株式会社 | 半導体装置 |
| CN109524396B (zh) * | 2017-09-20 | 2023-05-12 | 株式会社东芝 | 半导体装置 |
-
2021
- 2021-04-01 CN CN202180007468.1A patent/CN114846622A/zh active Pending
- 2021-04-01 WO PCT/JP2021/014138 patent/WO2022004084A1/ja not_active Ceased
- 2021-04-01 JP JP2022533692A patent/JP7327672B2/ja active Active
- 2021-04-01 DE DE112021000202.3T patent/DE112021000202T5/de active Pending
-
2022
- 2022-06-23 US US17/847,167 patent/US20220328669A1/en active Pending
-
2023
- 2023-07-28 JP JP2023123888A patent/JP7726248B2/ja active Active
-
2025
- 2025-07-30 JP JP2025127679A patent/JP2025160397A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012178389A (ja) * | 2011-02-25 | 2012-09-13 | Renesas Electronics Corp | 半導体装置 |
| JP2019016802A (ja) * | 2015-02-03 | 2019-01-31 | 富士電機株式会社 | 半導体装置及びその製造方法 |
| JP2019195093A (ja) * | 2016-03-10 | 2019-11-07 | 富士電機株式会社 | 半導体装置 |
| JP2018195798A (ja) * | 2017-05-16 | 2018-12-06 | 富士電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220328669A1 (en) | 2022-10-13 |
| CN114846622A (zh) | 2022-08-02 |
| JP7327672B2 (ja) | 2023-08-16 |
| WO2022004084A1 (ja) | 2022-01-06 |
| JP7726248B2 (ja) | 2025-08-20 |
| DE112021000202T5 (de) | 2022-08-18 |
| JP2025160397A (ja) | 2025-10-22 |
| JP2023139265A (ja) | 2023-10-03 |
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