JPWO2022004084A1 - - Google Patents

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Publication number
JPWO2022004084A1
JPWO2022004084A1 JP2022533692A JP2022533692A JPWO2022004084A1 JP WO2022004084 A1 JPWO2022004084 A1 JP WO2022004084A1 JP 2022533692 A JP2022533692 A JP 2022533692A JP 2022533692 A JP2022533692 A JP 2022533692A JP WO2022004084 A1 JPWO2022004084 A1 JP WO2022004084A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022533692A
Other languages
Japanese (ja)
Other versions
JP7327672B2 (ja
JPWO2022004084A5 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022004084A1 publication Critical patent/JPWO2022004084A1/ja
Publication of JPWO2022004084A5 publication Critical patent/JPWO2022004084A5/ja
Priority to JP2023123888A priority Critical patent/JP7726248B2/ja
Application granted granted Critical
Publication of JP7327672B2 publication Critical patent/JP7327672B2/ja
Priority to JP2025127679A priority patent/JP2025160397A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/422PN diodes having the PN junctions in mesas
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133Emitter regions of BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/017Manufacture or treatment using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/117Recessed field plates, e.g. trench field plates or buried field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates
    • H10D64/513Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/80PNPN diodes, e.g. Shockley diodes or break-over diodes
JP2022533692A 2020-07-03 2021-04-01 半導体装置 Active JP7327672B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023123888A JP7726248B2 (ja) 2020-07-03 2023-07-28 半導体装置
JP2025127679A JP2025160397A (ja) 2020-07-03 2025-07-30 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020115759 2020-07-03
JP2020115759 2020-07-03
PCT/JP2021/014138 WO2022004084A1 (ja) 2020-07-03 2021-04-01 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023123888A Division JP7726248B2 (ja) 2020-07-03 2023-07-28 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022004084A1 true JPWO2022004084A1 (enExample) 2022-01-06
JPWO2022004084A5 JPWO2022004084A5 (enExample) 2022-08-24
JP7327672B2 JP7327672B2 (ja) 2023-08-16

Family

ID=79315725

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022533692A Active JP7327672B2 (ja) 2020-07-03 2021-04-01 半導体装置
JP2023123888A Active JP7726248B2 (ja) 2020-07-03 2023-07-28 半導体装置
JP2025127679A Pending JP2025160397A (ja) 2020-07-03 2025-07-30 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023123888A Active JP7726248B2 (ja) 2020-07-03 2023-07-28 半導体装置
JP2025127679A Pending JP2025160397A (ja) 2020-07-03 2025-07-30 半導体装置

Country Status (5)

Country Link
US (1) US20220328669A1 (enExample)
JP (3) JP7327672B2 (enExample)
CN (1) CN114846622A (enExample)
DE (1) DE112021000202T5 (enExample)
WO (1) WO2022004084A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11276686B2 (en) * 2019-05-15 2022-03-15 Fuji Electric Co., Ltd. Semiconductor device
EP3953972A1 (en) * 2020-06-18 2022-02-16 Dynex Semiconductor Limited Reverse conducting igbt with controlled anode injection
JP7456520B2 (ja) * 2020-12-07 2024-03-27 富士電機株式会社 半導体装置
JP2023113080A (ja) * 2022-02-02 2023-08-15 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2024241741A1 (ja) * 2023-05-23 2024-11-28 富士電機株式会社 半導体装置および半導体装置の製造方法
CN117497574B (zh) * 2023-08-31 2024-05-14 海信家电集团股份有限公司 半导体装置
WO2025170006A1 (ja) * 2024-02-09 2025-08-14 富士電機株式会社 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012178389A (ja) * 2011-02-25 2012-09-13 Renesas Electronics Corp 半導体装置
JP2018195798A (ja) * 2017-05-16 2018-12-06 富士電機株式会社 半導体装置
JP2019016802A (ja) * 2015-02-03 2019-01-31 富士電機株式会社 半導体装置及びその製造方法
JP2019195093A (ja) * 2016-03-10 2019-11-07 富士電機株式会社 半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2703831A1 (fr) * 1993-04-07 1994-10-14 Philips Composants Dispositif semiconducteur comprenant un transistor latéral.
JP2009283540A (ja) * 2008-05-20 2009-12-03 Denso Corp 炭化珪素半導体装置およびその製造方法
US20100308400A1 (en) * 2008-06-20 2010-12-09 Maxpower Semiconductor Inc. Semiconductor Power Switches Having Trench Gates
US8390060B2 (en) * 2010-07-06 2013-03-05 Maxpower Semiconductor, Inc. Power semiconductor devices, structures, and related methods
JP6190206B2 (ja) * 2012-08-21 2017-08-30 ローム株式会社 半導体装置
DE112013007576B4 (de) * 2013-11-05 2022-02-03 Denso Corporation Halbleitereinrichtung
JP6817777B2 (ja) * 2015-12-16 2021-01-20 ローム株式会社 半導体装置
JP6885101B2 (ja) * 2016-03-11 2021-06-09 富士電機株式会社 半導体装置
JP6741070B2 (ja) 2016-09-14 2020-08-19 富士電機株式会社 半導体装置およびその製造方法
JP6958011B2 (ja) * 2017-06-15 2021-11-02 富士電機株式会社 半導体装置および半導体装置の製造方法
US10510832B2 (en) * 2017-07-14 2019-12-17 Fuji Electric Co., Ltd. Semiconductor device
JP7143575B2 (ja) * 2017-07-18 2022-09-29 富士電機株式会社 半導体装置
JP6958093B2 (ja) * 2017-08-09 2021-11-02 富士電機株式会社 半導体装置
CN109524396B (zh) * 2017-09-20 2023-05-12 株式会社东芝 半导体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012178389A (ja) * 2011-02-25 2012-09-13 Renesas Electronics Corp 半導体装置
JP2019016802A (ja) * 2015-02-03 2019-01-31 富士電機株式会社 半導体装置及びその製造方法
JP2019195093A (ja) * 2016-03-10 2019-11-07 富士電機株式会社 半導体装置
JP2018195798A (ja) * 2017-05-16 2018-12-06 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
US20220328669A1 (en) 2022-10-13
CN114846622A (zh) 2022-08-02
JP7327672B2 (ja) 2023-08-16
WO2022004084A1 (ja) 2022-01-06
JP7726248B2 (ja) 2025-08-20
DE112021000202T5 (de) 2022-08-18
JP2025160397A (ja) 2025-10-22
JP2023139265A (ja) 2023-10-03

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