JPWO2021182083A1 - - Google Patents

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Publication number
JPWO2021182083A1
JPWO2021182083A1 JP2022505890A JP2022505890A JPWO2021182083A1 JP WO2021182083 A1 JPWO2021182083 A1 JP WO2021182083A1 JP 2022505890 A JP2022505890 A JP 2022505890A JP 2022505890 A JP2022505890 A JP 2022505890A JP WO2021182083 A1 JPWO2021182083 A1 JP WO2021182083A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022505890A
Other versions
JP7148017B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021182083A1 publication Critical patent/JPWO2021182083A1/ja
Application granted granted Critical
Publication of JP7148017B2 publication Critical patent/JP7148017B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
JP2022505890A 2020-03-13 2021-02-22 検査治具及びそれを備えた基板検査装置 Active JP7148017B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020044781 2020-03-13
JP2020044783 2020-03-13
JP2020044783 2020-03-13
JP2020044781 2020-03-13
PCT/JP2021/006519 WO2021182083A1 (ja) 2020-03-13 2021-02-22 検査治具及びそれを備えた基板検査装置

Publications (2)

Publication Number Publication Date
JPWO2021182083A1 true JPWO2021182083A1 (ja) 2021-09-16
JP7148017B2 JP7148017B2 (ja) 2022-10-05

Family

ID=77670679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505890A Active JP7148017B2 (ja) 2020-03-13 2021-02-22 検査治具及びそれを備えた基板検査装置

Country Status (6)

Country Link
US (1) US20230117705A1 (ja)
JP (1) JP7148017B2 (ja)
KR (1) KR20220153013A (ja)
CN (1) CN115280166A (ja)
TW (1) TW202136791A (ja)
WO (1) WO2021182083A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810824B (zh) * 2022-02-23 2023-08-01 研鋐精密電子科技股份有限公司 一種探針卡及其製作方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122140A (ja) * 1986-11-12 1988-05-26 Hitachi Ltd 半導体素子検査装置及びその製法
JP2002082129A (ja) * 2000-09-08 2002-03-22 Mitsubishi Materials Corp コンタクトプローブ及びプローブ装置
JP2003075515A (ja) * 2001-08-31 2003-03-12 Mitsubishi Electric Corp 半導体集積回路の試験装置およびその試験方法
JP2005251813A (ja) * 2004-03-02 2005-09-15 Matsushita Electric Ind Co Ltd ウエハレベルバーンインアライメント装置およびウエハレベルバーンインアライメント方法
JP2008032648A (ja) * 2006-07-31 2008-02-14 Nhk Spring Co Ltd プローブカードの平行度調整機構
JP2009042008A (ja) * 2007-08-07 2009-02-26 Renesas Technology Corp プローブカード、半導体検査装置および半導体装置の製造方法
JP2009541715A (ja) * 2006-06-16 2009-11-26 フォームファクター， インコーポレイテッド プローブ・カード基板上のタイル角部のソーイング
US20100237887A1 (en) * 2009-02-19 2010-09-23 Touchdown Technologies, Inc. Microelectronic contactor assembly, structures thereof, and methods of constructing same
JP2012510633A (ja) * 2008-12-03 2012-05-10 フォームファクター， インコーポレイテッド 熱応答を改善するためのプローブカードアセンブリの機械的分離
JP2013145210A (ja) * 2012-01-16 2013-07-25 Micronics Japan Co Ltd 基板積層式プローブカード
JP2016024031A (ja) * 2014-07-18 2016-02-08 株式会社日本マイクロニクス 接触検査装置
JP2016524139A (ja) * 2013-05-14 2016-08-12 フォームファクター， インコーポレイテッド 交換可能プローブヘッドの自動取り付け及び取り外し
US20180048084A1 (en) * 2014-10-25 2018-02-15 ComponentZee, LLC Fluid Pressure Activated Electrical Contact Devices and Methods

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
US7808259B2 (en) * 2007-09-26 2010-10-05 Formfactor, Inc. Component assembly and alignment
US7772863B2 (en) * 2008-12-03 2010-08-10 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
JP2013191737A (ja) 2012-03-14 2013-09-26 Tokyo Electron Ltd ウエハ検査装置
WO2014182633A1 (en) * 2013-05-06 2014-11-13 Formfactor A probe card assembly for testing electronic devices
JP2019178961A (ja) 2018-03-30 2019-10-17 株式会社ヨコオ スペーストランスフォーマ、プローブカード用セラミックス基板、スペーストランスフォーマの製造方法およびプローブカード用セラミックス基板の形成方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122140A (ja) * 1986-11-12 1988-05-26 Hitachi Ltd 半導体素子検査装置及びその製法
JP2002082129A (ja) * 2000-09-08 2002-03-22 Mitsubishi Materials Corp コンタクトプローブ及びプローブ装置
JP2003075515A (ja) * 2001-08-31 2003-03-12 Mitsubishi Electric Corp 半導体集積回路の試験装置およびその試験方法
JP2005251813A (ja) * 2004-03-02 2005-09-15 Matsushita Electric Ind Co Ltd ウエハレベルバーンインアライメント装置およびウエハレベルバーンインアライメント方法
JP2009541715A (ja) * 2006-06-16 2009-11-26 フォームファクター， インコーポレイテッド プローブ・カード基板上のタイル角部のソーイング
JP2008032648A (ja) * 2006-07-31 2008-02-14 Nhk Spring Co Ltd プローブカードの平行度調整機構
JP2009042008A (ja) * 2007-08-07 2009-02-26 Renesas Technology Corp プローブカード、半導体検査装置および半導体装置の製造方法
JP2012510633A (ja) * 2008-12-03 2012-05-10 フォームファクター， インコーポレイテッド 熱応答を改善するためのプローブカードアセンブリの機械的分離
US20100237887A1 (en) * 2009-02-19 2010-09-23 Touchdown Technologies, Inc. Microelectronic contactor assembly, structures thereof, and methods of constructing same
JP2013145210A (ja) * 2012-01-16 2013-07-25 Micronics Japan Co Ltd 基板積層式プローブカード
JP2016524139A (ja) * 2013-05-14 2016-08-12 フォームファクター， インコーポレイテッド 交換可能プローブヘッドの自動取り付け及び取り外し
JP2016024031A (ja) * 2014-07-18 2016-02-08 株式会社日本マイクロニクス 接触検査装置
US20180048084A1 (en) * 2014-10-25 2018-02-15 ComponentZee, LLC Fluid Pressure Activated Electrical Contact Devices and Methods

Also Published As

Publication number Publication date
CN115280166A (zh) 2022-11-01
WO2021182083A1 (ja) 2021-09-16
KR20220153013A (ko) 2022-11-17
US20230117705A1 (en) 2023-04-20
TW202136791A (zh) 2021-10-01
JP7148017B2 (ja) 2022-10-05

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