JPWO2021177078A1 - - Google Patents

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Publication number
JPWO2021177078A1
JPWO2021177078A1 JP2022505129A JP2022505129A JPWO2021177078A1 JP WO2021177078 A1 JPWO2021177078 A1 JP WO2021177078A1 JP 2022505129 A JP2022505129 A JP 2022505129A JP 2022505129 A JP2022505129 A JP 2022505129A JP WO2021177078 A1 JPWO2021177078 A1 JP WO2021177078A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022505129A
Other versions
JPWO2021177078A5 (ja
JP7175423B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021177078A1 publication Critical patent/JPWO2021177078A1/ja
Publication of JPWO2021177078A5 publication Critical patent/JPWO2021177078A5/ja
Priority to JP2022176869A priority Critical patent/JP7345619B2/ja
Application granted granted Critical
Publication of JP7175423B2 publication Critical patent/JP7175423B2/ja
Priority to JP2023142630A priority patent/JP2023155484A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
JP2022505129A 2020-03-05 2021-02-22 基板処理方法、及び基板処理装置 Active JP7175423B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022176869A JP7345619B2 (ja) 2020-03-05 2022-11-04 基板処理方法、及び基板処理装置
JP2023142630A JP2023155484A (ja) 2020-03-05 2023-09-04 制御装置、及び記憶媒体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020037866 2020-03-05
JP2020037866 2020-03-05
PCT/JP2021/006666 WO2021177078A1 (ja) 2020-03-05 2021-02-22 基板処理方法、及び基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022176869A Division JP7345619B2 (ja) 2020-03-05 2022-11-04 基板処理方法、及び基板処理装置

Publications (3)

Publication Number Publication Date
JPWO2021177078A1 true JPWO2021177078A1 (ja) 2021-09-10
JPWO2021177078A5 JPWO2021177078A5 (ja) 2022-10-21
JP7175423B2 JP7175423B2 (ja) 2022-11-18

Family

ID=77613537

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022505129A Active JP7175423B2 (ja) 2020-03-05 2021-02-22 基板処理方法、及び基板処理装置
JP2022176869A Active JP7345619B2 (ja) 2020-03-05 2022-11-04 基板処理方法、及び基板処理装置
JP2023142630A Pending JP2023155484A (ja) 2020-03-05 2023-09-04 制御装置、及び記憶媒体

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022176869A Active JP7345619B2 (ja) 2020-03-05 2022-11-04 基板処理方法、及び基板処理装置
JP2023142630A Pending JP2023155484A (ja) 2020-03-05 2023-09-04 制御装置、及び記憶媒体

Country Status (6)

Country Link
US (2) US11676835B2 (ja)
JP (3) JP7175423B2 (ja)
KR (2) KR102553044B1 (ja)
CN (2) CN116153775A (ja)
TW (1) TW202142321A (ja)
WO (1) WO2021177078A1 (ja)

Citations (3)

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JP2015213105A (ja) * 2014-05-01 2015-11-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP2016082227A (ja) * 2014-10-21 2016-05-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP2017005230A (ja) * 2015-06-16 2017-01-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

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JPS6118758U (ja) 1984-07-09 1986-02-03 卓 住江 メビウスモツプ
US6334902B1 (en) * 1997-09-24 2002-01-01 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for removing a liquid from a surface
US7527698B2 (en) * 1998-09-23 2009-05-05 Interuniversitair Microelektronica Centrum (Imec, Vzw) Method and apparatus for removing a liquid from a surface of a substrate
US6770151B1 (en) * 2001-07-13 2004-08-03 Lam Research Corporation Drying a substrate using a combination of substrate processing technologies
JP4011900B2 (ja) 2001-12-04 2007-11-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US20030192577A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Method and apparatus for wafer cleaning
US20050208774A1 (en) * 2004-01-08 2005-09-22 Akira Fukunaga Wet processing method and processing apparatus of substrate
JP4324527B2 (ja) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
TWI286353B (en) * 2004-10-12 2007-09-01 Tokyo Electron Ltd Substrate processing method and substrate processing apparatus
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US20110289795A1 (en) * 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
JP5538102B2 (ja) * 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
JP6379400B2 (ja) 2013-09-26 2018-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN108155133B (zh) * 2014-02-27 2022-04-15 斯克林集团公司 基板处理装置
KR102308587B1 (ko) * 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP6454245B2 (ja) * 2014-10-21 2019-01-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
JP6707386B2 (ja) * 2016-04-07 2020-06-10 東京エレクトロン株式会社 めっき処理装置、めっき処理方法及び記憶媒体
JP6881922B2 (ja) * 2016-09-12 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6654534B2 (ja) * 2016-09-15 2020-02-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6811619B2 (ja) * 2017-01-12 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6400766B2 (ja) 2017-03-23 2018-10-03 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
JP6938248B2 (ja) * 2017-07-04 2021-09-22 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7034634B2 (ja) * 2017-08-31 2022-03-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7064339B2 (ja) * 2018-01-31 2022-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7197376B2 (ja) * 2019-01-17 2022-12-27 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP7285692B2 (ja) * 2019-05-17 2023-06-02 東京エレクトロン株式会社 乾燥装置、基板処理システム、および乾燥方法
JP7407574B2 (ja) * 2019-11-29 2024-01-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
KR102508052B1 (ko) * 2019-12-27 2023-03-09 가부시키가이샤 스크린 홀딩스 기판 처리 방법 및 기판 처리 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015213105A (ja) * 2014-05-01 2015-11-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP2016082227A (ja) * 2014-10-21 2016-05-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP2017005230A (ja) * 2015-06-16 2017-01-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
JP2022190113A (ja) 2022-12-22
US20230268207A1 (en) 2023-08-24
JP7345619B2 (ja) 2023-09-15
US11676835B2 (en) 2023-06-13
TW202142321A (zh) 2021-11-16
US20230099012A1 (en) 2023-03-30
KR20230105000A (ko) 2023-07-11
KR20220137163A (ko) 2022-10-11
KR102553044B1 (ko) 2023-07-10
CN116153775A (zh) 2023-05-23
CN115176334B (zh) 2023-03-14
JP7175423B2 (ja) 2022-11-18
JP2023155484A (ja) 2023-10-20
WO2021177078A1 (ja) 2021-09-10
CN115176334A (zh) 2022-10-11

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