JPWO2021130591A5 - - Google Patents

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JPWO2021130591A5
JPWO2021130591A5 JP2021566372A JP2021566372A JPWO2021130591A5 JP WO2021130591 A5 JPWO2021130591 A5 JP WO2021130591A5 JP 2021566372 A JP2021566372 A JP 2021566372A JP 2021566372 A JP2021566372 A JP 2021566372A JP WO2021130591 A5 JPWO2021130591 A5 JP WO2021130591A5
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Japan
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transistor
memory circuit
circuit
semiconductor device
layer
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JP2021566372A
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Japanese (ja)
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JPWO2021130591A1 (https=
JP7660075B2 (ja
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Priority claimed from PCT/IB2020/061872 external-priority patent/WO2021130591A1/ja
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Priority to JP2025058192A priority Critical patent/JP7778264B2/ja
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Publication of JP7660075B2 publication Critical patent/JP7660075B2/ja
Priority to JP2025197409A priority patent/JP2026027489A/ja
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JP2021566372A 2019-12-27 2020-12-14 半導体装置 Active JP7660075B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2025058192A JP7778264B2 (ja) 2019-12-27 2025-03-31 半導体装置
JP2025197409A JP2026027489A (ja) 2019-12-27 2025-11-18 半導体装置

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019238710 2019-12-27
JP2019238710 2019-12-27
JP2020005295 2020-01-16
JP2020005295 2020-01-16
JP2020169003 2020-10-06
JP2020169003 2020-10-06
PCT/IB2020/061872 WO2021130591A1 (ja) 2019-12-27 2020-12-14 半導体装置

Related Child Applications (1)

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JP2025058192A Division JP7778264B2 (ja) 2019-12-27 2025-03-31 半導体装置

Publications (3)

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JPWO2021130591A1 JPWO2021130591A1 (https=) 2021-07-01
JPWO2021130591A5 true JPWO2021130591A5 (https=) 2023-12-06
JP7660075B2 JP7660075B2 (ja) 2025-04-10

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JP2021566372A Active JP7660075B2 (ja) 2019-12-27 2020-12-14 半導体装置
JP2025058192A Active JP7778264B2 (ja) 2019-12-27 2025-03-31 半導体装置
JP2025197409A Pending JP2026027489A (ja) 2019-12-27 2025-11-18 半導体装置

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JP2025058192A Active JP7778264B2 (ja) 2019-12-27 2025-03-31 半導体装置
JP2025197409A Pending JP2026027489A (ja) 2019-12-27 2025-11-18 半導体装置

Country Status (6)

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US (2) US12426313B2 (https=)
JP (3) JP7660075B2 (https=)
KR (1) KR20220120598A (https=)
CN (1) CN114902414A (https=)
DE (1) DE112020006360T5 (https=)
WO (1) WO2021130591A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117094281B (zh) * 2023-10-19 2024-02-13 杭州行芯科技有限公司 获取热力学参数的方法、电子设备及存储介质

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