JPWO2021095603A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2021095603A5 JPWO2021095603A5 JP2021556037A JP2021556037A JPWO2021095603A5 JP WO2021095603 A5 JPWO2021095603 A5 JP WO2021095603A5 JP 2021556037 A JP2021556037 A JP 2021556037A JP 2021556037 A JP2021556037 A JP 2021556037A JP WO2021095603 A5 JPWO2021095603 A5 JP WO2021095603A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- insulating film
- plug
- substrate
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 37
- 239000004065 semiconductor Substances 0.000 claims 21
- 238000004519 manufacturing process Methods 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- 239000011521 glass Substances 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 3
- 229910002601 GaN Inorganic materials 0.000 claims 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 2
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019204187 | 2019-11-11 | ||
| JP2019204187 | 2019-11-11 | ||
| PCT/JP2020/041208 WO2021095603A1 (ja) | 2019-11-11 | 2020-11-04 | 画像表示装置の製造方法および画像表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021095603A1 JPWO2021095603A1 (https=) | 2021-05-20 |
| JPWO2021095603A5 true JPWO2021095603A5 (https=) | 2023-10-24 |
| JP7585602B2 JP7585602B2 (ja) | 2024-11-19 |
Family
ID=75912066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021556037A Active JP7585602B2 (ja) | 2019-11-11 | 2020-11-04 | 画像表示装置の製造方法および画像表示装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US12224273B2 (https=) |
| JP (1) | JP7585602B2 (https=) |
| CN (1) | CN114556578A (https=) |
| TW (1) | TWI862725B (https=) |
| WO (1) | WO2021095603A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7652632B2 (ja) * | 2021-06-09 | 2025-03-27 | 株式会社ジャパンディスプレイ | 表示装置及び表示装置の製造方法 |
| WO2023277466A1 (ko) * | 2021-06-30 | 2023-01-05 | 엘지전자 주식회사 | 반도체 발광소자를 포함하는 디스플레이 장치 |
| JPWO2023052893A1 (https=) * | 2021-09-29 | 2023-04-06 | ||
| DE112021007529T5 (de) * | 2021-12-30 | 2024-02-29 | Hubei San'an Optoelectronics Co., Ltd. | Lichtemittierendes Modul, Verfahren zur Herstellung eines lichtemittierenden Moduls und Anzeigevorrichtung |
| TWI838985B (zh) * | 2022-11-28 | 2024-04-11 | 錼創顯示科技股份有限公司 | 微型發光二極體顯示裝置與其製造方法 |
| GB202218165D0 (en) * | 2022-12-02 | 2023-01-18 | Poro Tech Ltd | Opto-electronic device having an electrical interconnection layer |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141492A (ja) * | 2000-10-31 | 2002-05-17 | Canon Inc | 発光ダイオードディスプレイパネル及びその製造方法 |
| JP4852322B2 (ja) * | 2006-03-03 | 2012-01-11 | ローム株式会社 | 窒化物半導体発光素子及びその製造方法 |
| TWI479660B (zh) * | 2006-08-31 | 2015-04-01 | 半導體能源研究所股份有限公司 | 薄膜電晶體，其製造方法，及半導體裝置 |
| JP2008147608A (ja) | 2006-10-27 | 2008-06-26 | Canon Inc | Ｌｅｄアレイの製造方法とｌｅｄアレイ、及びｌｅｄプリンタ |
| JP5171016B2 (ja) | 2006-10-27 | 2013-03-27 | キヤノン株式会社 | 半導体部材、半導体物品の製造方法、その製造方法を用いたｌｅｄアレイ |
| JP4827698B2 (ja) | 2006-10-27 | 2011-11-30 | キヤノン株式会社 | 発光素子の形成方法 |
| KR101428719B1 (ko) * | 2008-05-22 | 2014-08-12 | 삼성전자 주식회사 | 발광 소자 및 발광 장치의 제조 방법, 상기 방법을이용하여 제조한 발광 소자 및 발광 장치 |
| JP2010219310A (ja) * | 2009-03-17 | 2010-09-30 | Sharp Corp | 光デバイスおよび光デバイス構造 |
| US8912024B2 (en) * | 2011-11-18 | 2014-12-16 | Invensas Corporation | Front facing piggyback wafer assembly |
| US8987765B2 (en) | 2013-06-17 | 2015-03-24 | LuxVue Technology Corporation | Reflective bank structure and method for integrating a light emitting device |
| US9111464B2 (en) | 2013-06-18 | 2015-08-18 | LuxVue Technology Corporation | LED display with wavelength conversion layer |
| JP6620464B2 (ja) * | 2015-08-26 | 2019-12-18 | 大日本印刷株式会社 | フレキシブル透明基板及びそれを用いたシースルー型のｌｅｄ表示装置 |
| US10304811B2 (en) * | 2015-09-04 | 2019-05-28 | Hong Kong Beida Jade Bird Display Limited | Light-emitting diode display panel with micro lens array |
| KR102469311B1 (ko) * | 2016-03-31 | 2022-11-18 | 동우 화인켐 주식회사 | 유연성 디스플레이 장치의 제조 방법 |
| JP6738041B2 (ja) * | 2016-04-22 | 2020-08-12 | 天馬微電子有限公司 | 表示装置及び表示方法 |
| CN109564930B (zh) | 2016-05-13 | 2023-08-15 | 原子能与替代能源委员会 | 用于生产包括多个氮化镓二极管的光电设备的方法 |
| CN109844848A (zh) * | 2016-10-19 | 2019-06-04 | 奥加诺电路股份有限公司 | 有源矩阵led显示器 |
| KR102772357B1 (ko) * | 2016-12-20 | 2025-02-21 | 엘지디스플레이 주식회사 | 발광 다이오드 칩 및 이를 포함하는 발광 다이오드 디스플레이 장치 |
| US10902770B2 (en) | 2016-12-22 | 2021-01-26 | Sharp Kabushiki Kaisha | Display device |
| US10847553B2 (en) * | 2017-01-13 | 2020-11-24 | Massachusetts Institute Of Technology | Method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display |
| JP2018205456A (ja) * | 2017-06-01 | 2018-12-27 | 株式会社ブイ・テクノロジー | フルカラーｌｅｄ表示パネル |
| WO2019049360A1 (ja) | 2017-09-11 | 2019-03-14 | 凸版印刷株式会社 | 表示装置及び表示装置基板 |
| US10693042B2 (en) | 2017-11-23 | 2020-06-23 | Lg Display Co., Ltd. | Light-emitting device and display device using the same |
| KR102606570B1 (ko) * | 2017-11-29 | 2023-11-30 | 삼성디스플레이 주식회사 | 표시패널 및 그 제조방법 |
| JP7079106B2 (ja) | 2018-01-24 | 2022-06-01 | シャープ株式会社 | 画像表示素子、及び画像表示素子の製造方法 |
| US10748879B2 (en) | 2018-02-28 | 2020-08-18 | Sharp Kabushiki Kaisha | Image display device and display |
| JP7249787B2 (ja) | 2018-02-28 | 2023-03-31 | シャープ株式会社 | 表示素子及び表示装置 |
| JP7248441B2 (ja) | 2018-03-02 | 2023-03-29 | シャープ株式会社 | 画像表示素子 |
| US10437402B1 (en) | 2018-03-27 | 2019-10-08 | Shaoher Pan | Integrated light-emitting pixel arrays based devices by bonding |
| US10325894B1 (en) * | 2018-04-17 | 2019-06-18 | Shaoher Pan | Integrated multi-color light-emitting pixel arrays based devices by bonding |
| CN108615740B (zh) | 2018-05-26 | 2020-11-10 | 矽照光电（厦门）有限公司 | 柔性有源彩色半导体发光显示模块及柔性显示屏 |
-
2020
- 2020-11-04 WO PCT/JP2020/041208 patent/WO2021095603A1/ja not_active Ceased
- 2020-11-04 JP JP2021556037A patent/JP7585602B2/ja active Active
- 2020-11-04 CN CN202080071263.5A patent/CN114556578A/zh active Pending
- 2020-11-06 TW TW109138849A patent/TWI862725B/zh active
-
2022
- 2022-05-03 US US17/735,432 patent/US12224273B2/en active Active
-
2024
- 2024-12-27 US US19/003,676 patent/US20260123536A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2021095603A5 (https=) | ||
| CN109300919B (zh) | Micro LED显示基板及其制作方法、显示装置 | |
| TWI646651B (zh) | 發光二極體顯示器及其製造方法 | |
| JPWO2020226044A5 (https=) | ||
| US10886438B2 (en) | Manufacturing method of light-emitting device | |
| JP6755656B2 (ja) | 発光素子、発光素子アレイ及びそれを含む照明装置 | |
| CN106920868B (zh) | 发光装置与其制作方法 | |
| CN107437551A (zh) | 显示装置及其制造方法 | |
| JPWO2020230667A5 (https=) | ||
| JPWO2021020393A5 (https=) | ||
| WO2016183899A1 (zh) | 无边框显示装置及其制作方法 | |
| JP2010153814A5 (https=) | ||
| JP5148336B2 (ja) | 発光ダイオードチップおよびその製造方法 | |
| TWI521690B (zh) | 發光元件的轉移方法以及發光元件陣列 | |
| CN103247651B (zh) | 发光二极管阵列 | |
| KR102595921B1 (ko) | 표시장치 및 표시장치 제조방법 | |
| CN110556457B (zh) | 发光二极管以及具有该发光二极管的发光元件 | |
| CN114864775B (zh) | 一种半导体发光元件及其制备方法 | |
| JPWO2020230668A5 (https=) | ||
| TW201924071A (zh) | 一種薄膜電晶體陣列結構及其綁定區、綁定區的製作方法 | |
| US8008098B2 (en) | Light emitting device and method of manufacturing the same | |
| CN104701307A (zh) | 平面高压串联led集成芯片及其制造方法 | |
| TWI394290B (zh) | 電激發光裝置及其製造方法 | |
| JPWO2021065918A5 (https=) | ||
| TWI657573B (zh) | 顯示裝置及其製造方法 |