JPWO2021095252A5 - - Google Patents
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- JPWO2021095252A5 JPWO2021095252A5 JP2020567999A JP2020567999A JPWO2021095252A5 JP WO2021095252 A5 JPWO2021095252 A5 JP WO2021095252A5 JP 2020567999 A JP2020567999 A JP 2020567999A JP 2020567999 A JP2020567999 A JP 2020567999A JP WO2021095252 A5 JPWO2021095252 A5 JP WO2021095252A5
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- JP
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- Prior art keywords
- memory area
- identification information
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- storage
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007689 inspection Methods 0.000 claims description 22
- 230000007547 defect Effects 0.000 claims 7
- 239000000523 sample Substances 0.000 claims 6
- 230000004044 response Effects 0.000 claims 5
- 238000006243 chemical reaction Methods 0.000 claims 4
- 230000002950 deficient Effects 0.000 claims 2
- 230000007723 transport mechanism Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000012795 verification Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/044933 WO2021095252A1 (ja) | 2019-11-15 | 2019-11-15 | ストレージデバイスおよびストレージシステム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021095252A1 JPWO2021095252A1 (https=) | 2021-05-20 |
| JPWO2021095252A5 true JPWO2021095252A5 (https=) | 2022-03-30 |
| JP7214758B2 JP7214758B2 (ja) | 2023-01-30 |
Family
ID=75908679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020567999A Active JP7214758B2 (ja) | 2019-11-15 | 2019-11-15 | ストレージデバイスおよびストレージシステム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11422712B2 (https=) |
| EP (1) | EP4060720A4 (https=) |
| JP (1) | JP7214758B2 (https=) |
| CN (1) | CN113133325B (https=) |
| SG (1) | SG11202012541XA (https=) |
| TW (1) | TWI769571B (https=) |
| WO (1) | WO2021095252A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021095232A1 (ja) * | 2019-11-15 | 2021-05-20 | キオクシア株式会社 | ストレージシステム及びウェハ |
| EP4276632A4 (en) * | 2021-03-23 | 2025-01-29 | Kioxia Corporation | CASSETTE HOUSING, PROBER, SERVER RACK AND STORAGE SYSTEM |
| DE112021007343T5 (de) * | 2021-03-23 | 2024-05-02 | Kioxia Corporation | Speichersystem |
| TWI782589B (zh) * | 2021-06-23 | 2022-11-01 | 力晶積成電子製造股份有限公司 | 晶圓搜尋方法及裝置 |
| EP4383082A4 (en) * | 2021-09-02 | 2025-04-09 | Kioxia Corporation | STORAGE SYSTEM |
| CN114551296B (zh) * | 2022-01-28 | 2023-02-28 | 弥费科技(上海)股份有限公司 | 分区管理方法、装置、计算机设备和存储介质 |
| US20240319920A1 (en) * | 2022-07-27 | 2024-09-26 | SK Hynix Inc. | Data coding device, memory controller, and storage device |
| CN118335167A (zh) * | 2023-01-03 | 2024-07-12 | 长鑫存储技术有限公司 | 存储器及其测试方法 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2082354B (en) | 1980-08-21 | 1984-04-11 | Burroughs Corp | Improvements in or relating to wafer-scale integrated circuits |
| JPS61297191A (ja) * | 1985-06-27 | 1986-12-27 | 株式会社東芝 | Icカ−ド |
| JPS63253494A (ja) * | 1987-04-09 | 1988-10-20 | Toshiba Corp | 携帯可能電子装置 |
| JPS6428863A (en) | 1987-07-23 | 1989-01-31 | Mitsubishi Electric Corp | Semiconductor wafer |
| US5360747A (en) * | 1993-06-10 | 1994-11-01 | Xilinx, Inc. | Method of reducing dice testing with on-chip identification |
| JPH11120305A (ja) * | 1997-10-14 | 1999-04-30 | Mitsubishi Electric Corp | 非接触icカードシステム |
| JPH11251382A (ja) * | 1998-02-26 | 1999-09-17 | Hitachi Ltd | 半導体集積回路装置 |
| JP3430015B2 (ja) * | 1998-05-20 | 2003-07-28 | 東京エレクトロン株式会社 | 信頼性試験システム |
| JP4234244B2 (ja) | 1998-12-28 | 2009-03-04 | 富士通マイクロエレクトロニクス株式会社 | ウエハーレベルパッケージ及びウエハーレベルパッケージを用いた半導体装置の製造方法 |
| JP2000278632A (ja) | 1999-03-23 | 2000-10-06 | Toshiba Video Products Japan Kk | 記録再生装置 |
| JP3980807B2 (ja) | 2000-03-27 | 2007-09-26 | 株式会社東芝 | 半導体装置及び半導体モジュール |
| JP4489915B2 (ja) | 2000-07-31 | 2010-06-23 | 大日本印刷株式会社 | 暗証コード照合機能をもった携帯型情報処理装置 |
| US6871307B2 (en) * | 2001-10-10 | 2005-03-22 | Tower Semiconductorltd. | Efficient test structure for non-volatile memory and other semiconductor integrated circuits |
| JP2005228788A (ja) | 2004-02-10 | 2005-08-25 | Seiko Epson Corp | ウエーハとプローブカードとの位置合わせ方法、プローブ検査方法及びプローブ検査装置 |
| KR100618696B1 (ko) * | 2004-04-28 | 2006-09-08 | 주식회사 하이닉스반도체 | 인식 정보를 갖는 메모리 장치 |
| US7761773B2 (en) | 2005-06-30 | 2010-07-20 | Sigmatel, Inc. | Semiconductor device including a unique identifier and error correction code |
| JP2007096190A (ja) | 2005-09-30 | 2007-04-12 | Seiko Epson Corp | プローブカードの針先研磨方法、及びプローブ装置 |
| US7609561B2 (en) * | 2006-01-18 | 2009-10-27 | Apple Inc. | Disabling faulty flash memory dies |
| KR101841753B1 (ko) | 2006-08-18 | 2018-03-23 | 브룩스 오토메이션 인코퍼레이티드 | 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템 |
| KR100712561B1 (ko) * | 2006-08-23 | 2007-05-02 | 삼성전자주식회사 | 웨이퍼 형태의 프로브 카드 및 그 제조방법과 웨이퍼형태의 프로브 카드를 구비한 반도체 검사장치 |
| JP2008107918A (ja) | 2006-10-23 | 2008-05-08 | Fujitsu Ltd | 移動体識別管理システム、カードリーダおよび移動体識別管理方法 |
| JP2010512584A (ja) | 2006-12-06 | 2010-04-22 | フュージョン マルチシステムズ,インク.(ディービイエイ フュージョン−アイオー) | 空データトークン指令を有する要求デバイスからのデータを管理する装置、システムおよび方法 |
| JP5374246B2 (ja) | 2009-06-12 | 2013-12-25 | 学校法人慶應義塾 | 密封型半導体記録媒体及び密封型半導体記録装置 |
| US8595415B2 (en) | 2011-02-02 | 2013-11-26 | Micron Technology, Inc. | At least semi-autonomous modules in a memory system and methods |
| US8446772B2 (en) * | 2011-08-04 | 2013-05-21 | Sandisk Technologies Inc. | Memory die self-disable if programmable element is not trusted |
| TWI451106B (zh) * | 2012-03-26 | 2014-09-01 | Silicon Motion Inc | 晶圓測試系統及其測試方法 |
| US10062650B2 (en) * | 2014-09-01 | 2018-08-28 | Mitsubishi Electric Corporation | Semiconductor device, and semiconductor chip having chip identification information |
| US11175309B2 (en) * | 2014-12-24 | 2021-11-16 | Qualitau, Inc. | Semi-automatic prober |
| JP2018037006A (ja) * | 2016-09-02 | 2018-03-08 | ルネサスエレクトロニクス株式会社 | 半導体製品品質管理システム、半導体製品品質管理方法、および自動車 |
| EP3659055A4 (en) | 2017-07-24 | 2021-04-28 | Cerebras Systems Inc. | DEVICE AND METHOD FOR MULTI-CHIP CONNECTION |
| JP7074454B2 (ja) | 2017-10-30 | 2022-05-24 | キオクシア株式会社 | 計算機システムおよび制御方法 |
| US10955468B2 (en) | 2018-01-23 | 2021-03-23 | Texas Instruments Incorporated | Wafer probe resumption of die testing |
-
2019
- 2019-11-15 WO PCT/JP2019/044933 patent/WO2021095252A1/ja not_active Ceased
- 2019-11-15 EP EP19932226.4A patent/EP4060720A4/en active Pending
- 2019-11-15 JP JP2020567999A patent/JP7214758B2/ja active Active
- 2019-11-15 CN CN201980039444.7A patent/CN113133325B/zh active Active
- 2019-11-15 SG SG11202012541XA patent/SG11202012541XA/en unknown
-
2020
- 2020-11-03 TW TW109138174A patent/TWI769571B/zh active
- 2020-12-14 US US17/121,024 patent/US11422712B2/en active Active
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