JPWO2021091708A5 - - Google Patents

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Publication number
JPWO2021091708A5
JPWO2021091708A5 JP2022525211A JP2022525211A JPWO2021091708A5 JP WO2021091708 A5 JPWO2021091708 A5 JP WO2021091708A5 JP 2022525211 A JP2022525211 A JP 2022525211A JP 2022525211 A JP2022525211 A JP 2022525211A JP WO2021091708 A5 JPWO2021091708 A5 JP WO2021091708A5
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JP
Japan
Prior art keywords
layer
degrees celsius
deflection
heated
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022525211A
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English (en)
Japanese (ja)
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JP7801215B2 (ja
JP2023500831A (ja
JP2023500831A5 (https=
Publication date
Priority claimed from US16/674,340 external-priority patent/US11133213B2/en
Application filed filed Critical
Publication of JP2023500831A publication Critical patent/JP2023500831A/ja
Publication of JPWO2021091708A5 publication Critical patent/JPWO2021091708A5/ja
Publication of JP2023500831A5 publication Critical patent/JP2023500831A5/ja
Application granted granted Critical
Publication of JP7801215B2 publication Critical patent/JP7801215B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022525211A 2019-11-05 2020-10-24 可撓性プラテン及びそれに関連する方法 Active JP7801215B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/674,340 US11133213B2 (en) 2019-11-05 2019-11-05 Deflectable platen and associated method
US16/674,340 2019-11-05
PCT/US2020/057234 WO2021091708A1 (en) 2019-11-05 2020-10-24 Deflectable platen and associated method

Publications (4)

Publication Number Publication Date
JP2023500831A JP2023500831A (ja) 2023-01-11
JPWO2021091708A5 true JPWO2021091708A5 (https=) 2023-11-01
JP2023500831A5 JP2023500831A5 (https=) 2023-11-01
JP7801215B2 JP7801215B2 (ja) 2026-01-16

Family

ID=75688808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022525211A Active JP7801215B2 (ja) 2019-11-05 2020-10-24 可撓性プラテン及びそれに関連する方法

Country Status (6)

Country Link
US (1) US11133213B2 (https=)
JP (1) JP7801215B2 (https=)
KR (1) KR20220093176A (https=)
CN (1) CN114631177B (https=)
TW (1) TWI873213B (https=)
WO (1) WO2021091708A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302550A (ja) * 1993-04-13 1994-10-28 Hitachi Ltd 半導体製造装置
JP3149398B2 (ja) * 1998-06-16 2001-03-26 株式会社アドバンスト・ディスプレイ 液晶パネル製造装置および方法
JP2000031253A (ja) 1998-07-10 2000-01-28 Komatsu Ltd 基板処理装置及び方法
JP2000124299A (ja) * 1998-10-16 2000-04-28 Hitachi Ltd 半導体装置の製造方法および半導体製造装置
TW492135B (en) * 2000-05-25 2002-06-21 Tomoegawa Paper Co Ltd Adhesive sheets for static electricity chuck device, and static electricity chuck device
US6623563B2 (en) 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
US6669783B2 (en) * 2001-06-28 2003-12-30 Lam Research Corporation High temperature electrostatic chuck
JP2007067349A (ja) * 2005-09-02 2007-03-15 Nissan Motor Co Ltd 圧接型半導体装置
JP4524268B2 (ja) * 2006-04-28 2010-08-11 信越化学工業株式会社 静電チャック機能付きセラミックヒーター及びその製造方法
DE102006022264B4 (de) * 2006-05-11 2008-04-03 Uhlmann Pac-Systeme Gmbh & Co. Kg Siegelwerkzeug zum Siegeln von Folien in einer Siegelstation
JP2011221006A (ja) * 2010-03-23 2011-11-04 Tokyo Electron Ltd ウェハ型温度検知センサおよびその製造方法
US9948214B2 (en) * 2012-04-26 2018-04-17 Applied Materials, Inc. High temperature electrostatic chuck with real-time heat zone regulating capability
US9281252B1 (en) 2014-10-24 2016-03-08 Globalfoundries Inc. Method comprising applying an external mechanical stress to a semiconductor structure and semiconductor processing tool
US10054856B2 (en) 2015-02-12 2018-08-21 Toshiba Memory Corporation Exposure method, manufacturing method of device, and thin film sheet
JP6341457B1 (ja) * 2017-03-29 2018-06-13 Toto株式会社 静電チャック
JP2019057538A (ja) 2017-09-19 2019-04-11 株式会社アルバック 吸着装置、真空装置

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