JP2021185123A5 - - Google Patents
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- Publication number
- JP2021185123A5 JP2021185123A5 JP2021127045A JP2021127045A JP2021185123A5 JP 2021185123 A5 JP2021185123 A5 JP 2021185123A5 JP 2021127045 A JP2021127045 A JP 2021127045A JP 2021127045 A JP2021127045 A JP 2021127045A JP 2021185123 A5 JP2021185123 A5 JP 2021185123A5
- Authority
- JP
- Japan
- Prior art keywords
- assembly
- groove
- aluminum material
- solid aluminum
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 8
- 229910052782 aluminium Inorganic materials 0.000 claims 8
- 239000000463 material Substances 0.000 claims 7
- 239000007787 solid Substances 0.000 claims 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
- 238000009736 wetting Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/955,431 US10882130B2 (en) | 2018-04-17 | 2018-04-17 | Ceramic-aluminum assembly with bonding trenches |
| US15/955,431 | 2018-04-17 | ||
| JP2020557148A JP6924910B2 (ja) | 2018-04-17 | 2019-04-05 | 結合溝を備えたセラミック−アルミニウムアセンブリ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020557148A Division JP6924910B2 (ja) | 2018-04-17 | 2019-04-05 | 結合溝を備えたセラミック−アルミニウムアセンブリ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021185123A JP2021185123A (ja) | 2021-12-09 |
| JP2021185123A5 true JP2021185123A5 (https=) | 2022-04-07 |
Family
ID=66248706
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020557148A Active JP6924910B2 (ja) | 2018-04-17 | 2019-04-05 | 結合溝を備えたセラミック−アルミニウムアセンブリ |
| JP2021127045A Pending JP2021185123A (ja) | 2018-04-17 | 2021-08-03 | 結合溝を備えたセラミック−アルミニウムアセンブリ |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020557148A Active JP6924910B2 (ja) | 2018-04-17 | 2019-04-05 | 結合溝を備えたセラミック−アルミニウムアセンブリ |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US10882130B2 (https=) |
| JP (2) | JP6924910B2 (https=) |
| KR (3) | KR102519075B1 (https=) |
| CN (1) | CN112135806A (https=) |
| DE (1) | DE112019002005B4 (https=) |
| TW (1) | TWI709547B (https=) |
| WO (1) | WO2019204050A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10793772B1 (en) | 2020-03-13 | 2020-10-06 | Accelovant Technologies Corporation | Monolithic phosphor composite for sensing systems |
| US11359976B2 (en) | 2020-10-23 | 2022-06-14 | Accelovant Technologies Corporation | Multipoint surface temperature measurement system and method thereof |
| CA3137183C (en) | 2020-11-05 | 2024-02-20 | Accelovant Technologies Corporation | Optoelectronic transducer module for thermographic temperature measurements |
| CN113828954B (zh) * | 2021-10-22 | 2022-11-01 | 中国科学院空天信息创新研究院 | 金属-陶瓷封接方法、金属-陶瓷复合结构 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0788262B2 (ja) | 1985-04-01 | 1995-09-27 | 株式会社日立製作所 | 窒化ケイ素と金属との接合方法 |
| US5234152A (en) | 1992-01-07 | 1993-08-10 | Regents Of The University Of California | Transient liquid phase ceramic bonding |
| US5240671A (en) | 1992-06-01 | 1993-08-31 | Microelectronics And Computer Technology Corporation | Method of forming recessed patterns in insulating substrates |
| JP3813654B2 (ja) * | 1995-02-09 | 2006-08-23 | 日本碍子株式会社 | セラミックスの接合構造およびその製造方法 |
| AT405039B (de) * | 1996-02-08 | 1999-04-26 | Electrovac | Verbundbauteil |
| US6315188B1 (en) | 2000-06-28 | 2001-11-13 | Sandia Corporation | Surface preparation for high purity alumina ceramics enabling direct brazing in hydrogen atmospheres |
| US7195693B2 (en) | 2002-06-05 | 2007-03-27 | Advanced Thermal Sciences | Lateral temperature equalizing system for large area surfaces during processing |
| US6644394B1 (en) | 2002-06-25 | 2003-11-11 | Brazeway, Inc. | Braze alloy flow-barrier |
| DE10239416B4 (de) | 2002-08-28 | 2005-03-03 | Robert Bosch Gmbh | Verfahren zur Herstellung eines aus Keramikschichten bestehenden Verbundkörpers |
| JP3935037B2 (ja) | 2002-09-30 | 2007-06-20 | Ｄｏｗａホールディングス株式会社 | アルミニウム−セラミックス接合基板の製造方法 |
| KR100716100B1 (ko) * | 2003-06-13 | 2007-05-09 | 가부시끼가이샤 도꾸야마 | 질화알루미늄 접합체 및 그의 제조 방법 |
| JP2005022966A (ja) * | 2003-06-13 | 2005-01-27 | Tokuyama Corp | 窒化アルミニウム接合体及びその製造方法 |
| JP4918856B2 (ja) | 2004-04-05 | 2012-04-18 | 三菱マテリアル株式会社 | パワーモジュール用基板及びパワーモジュール |
| US20080314320A1 (en) | 2005-02-04 | 2008-12-25 | Component Re-Engineering Company, Inc. | Chamber Mount for High Temperature Application of AIN Heaters |
| TW200633947A (en) | 2005-02-16 | 2006-10-01 | Ngk Insulators Ltd | Joined body and manufacturing method for the same |
| US20100177454A1 (en) | 2009-01-09 | 2010-07-15 | Component Re-Engineering Company, Inc. | Electrostatic chuck with dielectric inserts |
| JP5841329B2 (ja) | 2009-12-25 | 2016-01-13 | 株式会社日本セラテック | セラミックス接合体の製造方法 |
| CN107117986A (zh) | 2010-05-21 | 2017-09-01 | 阔斯泰公司 | 陶瓷对陶瓷接合件及相关方法 |
| US8932680B2 (en) | 2011-07-29 | 2015-01-13 | Nike, Inc. | Method of manufacturing a golf ball including a blend of highly neutralized acid polymers |
| US9624137B2 (en) | 2011-11-30 | 2017-04-18 | Component Re-Engineering Company, Inc. | Low temperature method for hermetically joining non-diffusing ceramic materials |
| US8932690B2 (en) | 2011-11-30 | 2015-01-13 | Component Re-Engineering Company, Inc. | Plate and shaft device |
| US8684256B2 (en) | 2011-11-30 | 2014-04-01 | Component Re-Engineering Company, Inc. | Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing |
| US20130250471A1 (en) | 2012-03-22 | 2013-09-26 | Component Re-Engineering Company, Inc. | Compressible conductive element for use in current-carrying structure |
| US20140014710A1 (en) | 2012-06-12 | 2014-01-16 | Component Re-Engineering Compnay, Inc. | Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized Regions |
| US9984866B2 (en) | 2012-06-12 | 2018-05-29 | Component Re-Engineering Company, Inc. | Multiple zone heater |
| FR2993494B1 (fr) * | 2012-07-18 | 2014-08-22 | Herakles | Procede de brasage de pieces en materiau composite avec ancrage du joint de brasure |
| US10471531B2 (en) | 2014-12-31 | 2019-11-12 | Component Re-Engineering Company, Inc. | High temperature resistant silicon joint for the joining of ceramics |
| US9999947B2 (en) | 2015-05-01 | 2018-06-19 | Component Re-Engineering Company, Inc. | Method for repairing heaters and chucks used in semiconductor processing |
| EP3371881B1 (en) | 2015-11-02 | 2023-02-15 | Watlow Electric Manufacturing Company | Electrostatic chuck for clamping in high temperature semiconductor processing and method of making the same |
| KR20200019235A (ko) | 2017-06-23 | 2020-02-21 | 와틀로 일렉트릭 매뉴팩츄어링 컴파니 | 고온 가열판 받침대 |
-
2018
- 2018-04-17 US US15/955,431 patent/US10882130B2/en active Active
-
2019
- 2019-04-05 KR KR1020227022478A patent/KR102519075B1/ko active Active
- 2019-04-05 CN CN201980033229.6A patent/CN112135806A/zh active Pending
- 2019-04-05 KR KR1020207033061A patent/KR102343816B1/ko active Active
- 2019-04-05 JP JP2020557148A patent/JP6924910B2/ja active Active
- 2019-04-05 WO PCT/US2019/025930 patent/WO2019204050A1/en not_active Ceased
- 2019-04-05 KR KR1020217042076A patent/KR102417020B1/ko active Active
- 2019-04-05 DE DE112019002005.6T patent/DE112019002005B4/de active Active
- 2019-04-15 TW TW108113089A patent/TWI709547B/zh active
-
2020
- 2020-03-02 US US16/805,952 patent/US20200230728A1/en not_active Abandoned
- 2020-11-09 US US17/092,529 patent/US20210078092A1/en not_active Abandoned
-
2021
- 2021-08-03 JP JP2021127045A patent/JP2021185123A/ja active Pending
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