JP7801215B2 - 可撓性プラテン及びそれに関連する方法 - Google Patents

可撓性プラテン及びそれに関連する方法

Info

Publication number
JP7801215B2
JP7801215B2 JP2022525211A JP2022525211A JP7801215B2 JP 7801215 B2 JP7801215 B2 JP 7801215B2 JP 2022525211 A JP2022525211 A JP 2022525211A JP 2022525211 A JP2022525211 A JP 2022525211A JP 7801215 B2 JP7801215 B2 JP 7801215B2
Authority
JP
Japan
Prior art keywords
layer
temperature control
platen
control element
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022525211A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021091708A5 (https=
JP2023500831A (ja
JP2023500831A5 (https=
Inventor
ダーウェイ スン，
ミン イン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2023500831A publication Critical patent/JP2023500831A/ja
Publication of JPWO2021091708A5 publication Critical patent/JPWO2021091708A5/ja
Publication of JP2023500831A5 publication Critical patent/JP2023500831A5/ja
Application granted granted Critical
Publication of JP7801215B2 publication Critical patent/JP7801215B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022525211A 2019-11-05 2020-10-24 可撓性プラテン及びそれに関連する方法 Active JP7801215B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/674,340 US11133213B2 (en) 2019-11-05 2019-11-05 Deflectable platen and associated method
US16/674,340 2019-11-05
PCT/US2020/057234 WO2021091708A1 (en) 2019-11-05 2020-10-24 Deflectable platen and associated method

Publications (4)

Publication Number Publication Date
JP2023500831A JP2023500831A (ja) 2023-01-11
JPWO2021091708A5 JPWO2021091708A5 (https=) 2023-11-01
JP2023500831A5 JP2023500831A5 (https=) 2023-11-01
JP7801215B2 true JP7801215B2 (ja) 2026-01-16

Family

ID=75688808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022525211A Active JP7801215B2 (ja) 2019-11-05 2020-10-24 可撓性プラテン及びそれに関連する方法

Country Status (6)

Country Link
US (1) US11133213B2 (https=)
JP (1) JP7801215B2 (https=)
KR (1) KR20220093176A (https=)
CN (1) CN114631177B (https=)
TW (1) TWI873213B (https=)
WO (1) WO2021091708A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031253A (ja) 1998-07-10 2000-01-28 Komatsu Ltd 基板処理装置及び方法
JP2005516379A (ja) 2001-06-28 2005-06-02 ラム　リサーチ　コーポレーション 高温静電チャック
JP2015517224A (ja) 2012-04-26 2015-06-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ リアルタイム加熱ゾーン調整機能を備えた高温静電チャック

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302550A (ja) * 1993-04-13 1994-10-28 Hitachi Ltd 半導体製造装置
JP3149398B2 (ja) * 1998-06-16 2001-03-26 株式会社アドバンスト・ディスプレイ 液晶パネル製造装置および方法
JP2000124299A (ja) * 1998-10-16 2000-04-28 Hitachi Ltd 半導体装置の製造方法および半導体製造装置
TW492135B (en) * 2000-05-25 2002-06-21 Tomoegawa Paper Co Ltd Adhesive sheets for static electricity chuck device, and static electricity chuck device
US6623563B2 (en) 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
JP2007067349A (ja) * 2005-09-02 2007-03-15 Nissan Motor Co Ltd 圧接型半導体装置
JP4524268B2 (ja) * 2006-04-28 2010-08-11 信越化学工業株式会社 静電チャック機能付きセラミックヒーター及びその製造方法
DE102006022264B4 (de) * 2006-05-11 2008-04-03 Uhlmann Pac-Systeme Gmbh & Co. Kg Siegelwerkzeug zum Siegeln von Folien in einer Siegelstation
JP2011221006A (ja) * 2010-03-23 2011-11-04 Tokyo Electron Ltd ウェハ型温度検知センサおよびその製造方法
US9281252B1 (en) 2014-10-24 2016-03-08 Globalfoundries Inc. Method comprising applying an external mechanical stress to a semiconductor structure and semiconductor processing tool
US10054856B2 (en) 2015-02-12 2018-08-21 Toshiba Memory Corporation Exposure method, manufacturing method of device, and thin film sheet
JP6341457B1 (ja) * 2017-03-29 2018-06-13 Toto株式会社 静電チャック
JP2019057538A (ja) 2017-09-19 2019-04-11 株式会社アルバック 吸着装置、真空装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031253A (ja) 1998-07-10 2000-01-28 Komatsu Ltd 基板処理装置及び方法
JP2005516379A (ja) 2001-06-28 2005-06-02 ラム　リサーチ　コーポレーション 高温静電チャック
JP2015517224A (ja) 2012-04-26 2015-06-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ リアルタイム加熱ゾーン調整機能を備えた高温静電チャック

Also Published As

Publication number Publication date
CN114631177B (zh) 2025-08-19
KR20220093176A (ko) 2022-07-05
JP2023500831A (ja) 2023-01-11
TWI873213B (zh) 2025-02-21
TW202135204A (zh) 2021-09-16
CN114631177A (zh) 2022-06-14
WO2021091708A1 (en) 2021-05-14
US20210134650A1 (en) 2021-05-06
US11133213B2 (en) 2021-09-28

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