KR20220093176A - 편향가능 플래튼 및 연관된 방법 - Google Patents

편향가능 플래튼 및 연관된 방법 Download PDF

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Publication number
KR20220093176A
KR20220093176A KR1020227018492A KR20227018492A KR20220093176A KR 20220093176 A KR20220093176 A KR 20220093176A KR 1020227018492 A KR1020227018492 A KR 1020227018492A KR 20227018492 A KR20227018492 A KR 20227018492A KR 20220093176 A KR20220093176 A KR 20220093176A
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KR
South Korea
Prior art keywords
layer
platen
temperature control
layers
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227018492A
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English (en)
Korean (ko)
Inventor
다웨이 선
밍 잉
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20220093176A publication Critical patent/KR20220093176A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—
    • H01L21/67103—
    • H01L21/67109—
    • H01L21/67288—
    • H01L21/6833—
    • H01L21/68757—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020227018492A 2019-11-05 2020-10-24 편향가능 플래튼 및 연관된 방법 Pending KR20220093176A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/674,340 US11133213B2 (en) 2019-11-05 2019-11-05 Deflectable platen and associated method
US16/674,340 2019-11-05
PCT/US2020/057234 WO2021091708A1 (en) 2019-11-05 2020-10-24 Deflectable platen and associated method

Publications (1)

Publication Number Publication Date
KR20220093176A true KR20220093176A (ko) 2022-07-05

Family

ID=75688808

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227018492A Pending KR20220093176A (ko) 2019-11-05 2020-10-24 편향가능 플래튼 및 연관된 방법

Country Status (6)

Country Link
US (1) US11133213B2 (https=)
JP (1) JP7801215B2 (https=)
KR (1) KR20220093176A (https=)
CN (1) CN114631177B (https=)
TW (1) TWI873213B (https=)
WO (1) WO2021091708A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302550A (ja) * 1993-04-13 1994-10-28 Hitachi Ltd 半導体製造装置
JP3149398B2 (ja) * 1998-06-16 2001-03-26 株式会社アドバンスト・ディスプレイ 液晶パネル製造装置および方法
JP2000031253A (ja) 1998-07-10 2000-01-28 Komatsu Ltd 基板処理装置及び方法
JP2000124299A (ja) * 1998-10-16 2000-04-28 Hitachi Ltd 半導体装置の製造方法および半導体製造装置
TW492135B (en) * 2000-05-25 2002-06-21 Tomoegawa Paper Co Ltd Adhesive sheets for static electricity chuck device, and static electricity chuck device
US6623563B2 (en) 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
US6669783B2 (en) * 2001-06-28 2003-12-30 Lam Research Corporation High temperature electrostatic chuck
JP2007067349A (ja) * 2005-09-02 2007-03-15 Nissan Motor Co Ltd 圧接型半導体装置
JP4524268B2 (ja) * 2006-04-28 2010-08-11 信越化学工業株式会社 静電チャック機能付きセラミックヒーター及びその製造方法
DE102006022264B4 (de) * 2006-05-11 2008-04-03 Uhlmann Pac-Systeme Gmbh & Co. Kg Siegelwerkzeug zum Siegeln von Folien in einer Siegelstation
JP2011221006A (ja) * 2010-03-23 2011-11-04 Tokyo Electron Ltd ウェハ型温度検知センサおよびその製造方法
US9948214B2 (en) * 2012-04-26 2018-04-17 Applied Materials, Inc. High temperature electrostatic chuck with real-time heat zone regulating capability
US9281252B1 (en) 2014-10-24 2016-03-08 Globalfoundries Inc. Method comprising applying an external mechanical stress to a semiconductor structure and semiconductor processing tool
US10054856B2 (en) 2015-02-12 2018-08-21 Toshiba Memory Corporation Exposure method, manufacturing method of device, and thin film sheet
JP6341457B1 (ja) * 2017-03-29 2018-06-13 Toto株式会社 静電チャック
JP2019057538A (ja) 2017-09-19 2019-04-11 株式会社アルバック 吸着装置、真空装置

Also Published As

Publication number Publication date
CN114631177B (zh) 2025-08-19
JP7801215B2 (ja) 2026-01-16
JP2023500831A (ja) 2023-01-11
TWI873213B (zh) 2025-02-21
TW202135204A (zh) 2021-09-16
CN114631177A (zh) 2022-06-14
WO2021091708A1 (en) 2021-05-14
US20210134650A1 (en) 2021-05-06
US11133213B2 (en) 2021-09-28

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