JPWO2021085216A5 - - Google Patents
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- Publication number
- JPWO2021085216A5 JPWO2021085216A5 JP2021553430A JP2021553430A JPWO2021085216A5 JP WO2021085216 A5 JPWO2021085216 A5 JP WO2021085216A5 JP 2021553430 A JP2021553430 A JP 2021553430A JP 2021553430 A JP2021553430 A JP 2021553430A JP WO2021085216 A5 JPWO2021085216 A5 JP WO2021085216A5
- Authority
- JP
- Japan
- Prior art keywords
- elastic member
- semiconductor device
- joining
- electrode plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims 6
- 238000006243 chemical reaction Methods 0.000 claims 5
- 239000011162 core material Substances 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019195900 | 2019-10-29 | ||
| JP2019195900 | 2019-10-29 | ||
| PCT/JP2020/039271 WO2021085216A1 (ja) | 2019-10-29 | 2020-10-19 | 半導体装置、電力変換装置、および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021085216A1 JPWO2021085216A1 (https=) | 2021-05-06 |
| JPWO2021085216A5 true JPWO2021085216A5 (https=) | 2022-06-27 |
| JP7166471B2 JP7166471B2 (ja) | 2022-11-07 |
Family
ID=75715973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021553430A Active JP7166471B2 (ja) | 2019-10-29 | 2020-10-19 | 半導体装置、電力変換装置、および半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7166471B2 (https=) |
| CN (1) | CN114586151A (https=) |
| WO (1) | WO2021085216A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4071791A1 (en) * | 2021-04-09 | 2022-10-12 | Hitachi Energy Switzerland AG | Spring element for a press contact in a power semiconductor module, and method for manufacturing the same |
| JP7694512B2 (ja) * | 2022-09-02 | 2025-06-18 | 株式会社デンソー | 半導体装置 |
| US12557668B2 (en) * | 2023-04-27 | 2026-02-17 | Allegro Microsystems, Llc | High voltage integrated circuit packages with diagonalized lead configuration and method of making the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302734A (ja) * | 1993-04-14 | 1994-10-28 | Sansha Electric Mfg Co Ltd | 電力用半導体モジュール |
| JP2002110869A (ja) * | 2000-09-26 | 2002-04-12 | Toshiba Corp | 半導体装置 |
| JP2005019771A (ja) * | 2003-06-27 | 2005-01-20 | Toyota Motor Corp | 密閉構造 |
| JP2008227131A (ja) * | 2007-03-13 | 2008-09-25 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| KR101104389B1 (ko) * | 2009-12-24 | 2012-01-16 | 한국전기연구원 | 종단 구조 반도체 칩의 실장구조 |
| JP2013236015A (ja) * | 2012-05-10 | 2013-11-21 | Nhk Spring Co Ltd | パワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子 |
| JP6256309B2 (ja) * | 2014-11-11 | 2018-01-10 | 三菱電機株式会社 | 電力用半導体装置 |
| DE102017126716B4 (de) * | 2017-11-14 | 2021-07-22 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem Leistungshalbleitermodul mit einer Schalteinrichtung |
-
2020
- 2020-10-19 JP JP2021553430A patent/JP7166471B2/ja active Active
- 2020-10-19 CN CN202080073761.3A patent/CN114586151A/zh active Pending
- 2020-10-19 WO PCT/JP2020/039271 patent/WO2021085216A1/ja not_active Ceased
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