CN114586151A - 半导体装置、功率转换装置以及半导体装置的制造方法 - Google Patents

半导体装置、功率转换装置以及半导体装置的制造方法 Download PDF

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Publication number
CN114586151A
CN114586151A CN202080073761.3A CN202080073761A CN114586151A CN 114586151 A CN114586151 A CN 114586151A CN 202080073761 A CN202080073761 A CN 202080073761A CN 114586151 A CN114586151 A CN 114586151A
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CN
China
Prior art keywords
elastic member
semiconductor element
bonding
semiconductor device
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080073761.3A
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English (en)
Chinese (zh)
Inventor
小川道雄
藤野纯司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN114586151A publication Critical patent/CN114586151A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080073761.3A 2019-10-29 2020-10-19 半导体装置、功率转换装置以及半导体装置的制造方法 Pending CN114586151A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019195900 2019-10-29
JP2019-195900 2019-10-29
PCT/JP2020/039271 WO2021085216A1 (ja) 2019-10-29 2020-10-19 半導体装置、電力変換装置、および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN114586151A true CN114586151A (zh) 2022-06-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080073761.3A Pending CN114586151A (zh) 2019-10-29 2020-10-19 半导体装置、功率转换装置以及半导体装置的制造方法

Country Status (3)

Country Link
JP (1) JP7166471B2 (https=)
CN (1) CN114586151A (https=)
WO (1) WO2021085216A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4071791A1 (en) * 2021-04-09 2022-10-12 Hitachi Energy Switzerland AG Spring element for a press contact in a power semiconductor module, and method for manufacturing the same
JP7694512B2 (ja) * 2022-09-02 2025-06-18 株式会社デンソー 半導体装置
US12557668B2 (en) * 2023-04-27 2026-02-17 Allegro Microsystems, Llc High voltage integrated circuit packages with diagonalized lead configuration and method of making the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110869A (ja) * 2000-09-26 2002-04-12 Toshiba Corp 半導体装置
JP2005019771A (ja) * 2003-06-27 2005-01-20 Toyota Motor Corp 密閉構造
US20080224282A1 (en) * 2007-03-13 2008-09-18 Renesas Technology Corp. Semiconductor device and method of manufacturing the same
KR20110073698A (ko) * 2009-12-24 2011-06-30 한국전기연구원 종단 구조 반도체 칩의 실장구조
JP2016092346A (ja) * 2014-11-11 2016-05-23 三菱電機株式会社 電力用半導体装置
CN109786341A (zh) * 2017-11-14 2019-05-21 赛米控电子股份有限公司 具有开关装置的功率半导体模块及其配置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302734A (ja) * 1993-04-14 1994-10-28 Sansha Electric Mfg Co Ltd 電力用半導体モジュール
JP2013236015A (ja) * 2012-05-10 2013-11-21 Nhk Spring Co Ltd パワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110869A (ja) * 2000-09-26 2002-04-12 Toshiba Corp 半導体装置
JP2005019771A (ja) * 2003-06-27 2005-01-20 Toyota Motor Corp 密閉構造
US20080224282A1 (en) * 2007-03-13 2008-09-18 Renesas Technology Corp. Semiconductor device and method of manufacturing the same
KR20110073698A (ko) * 2009-12-24 2011-06-30 한국전기연구원 종단 구조 반도체 칩의 실장구조
JP2016092346A (ja) * 2014-11-11 2016-05-23 三菱電機株式会社 電力用半導体装置
CN109786341A (zh) * 2017-11-14 2019-05-21 赛米控电子股份有限公司 具有开关装置的功率半导体模块及其配置

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JP7166471B2 (ja) 2022-11-07
WO2021085216A1 (ja) 2021-05-06

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