JPWO2021085216A1 - - Google Patents

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Publication number
JPWO2021085216A1
JPWO2021085216A1 JP2021553430A JP2021553430A JPWO2021085216A1 JP WO2021085216 A1 JPWO2021085216 A1 JP WO2021085216A1 JP 2021553430 A JP2021553430 A JP 2021553430A JP 2021553430 A JP2021553430 A JP 2021553430A JP WO2021085216 A1 JPWO2021085216 A1 JP WO2021085216A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021553430A
Other languages
Japanese (ja)
Other versions
JP7166471B2 (ja
JPWO2021085216A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021085216A1 publication Critical patent/JPWO2021085216A1/ja
Publication of JPWO2021085216A5 publication Critical patent/JPWO2021085216A5/ja
Application granted granted Critical
Publication of JP7166471B2 publication Critical patent/JP7166471B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
JP2021553430A 2019-10-29 2020-10-19 半導体装置、電力変換装置、および半導体装置の製造方法 Active JP7166471B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019195900 2019-10-29
JP2019195900 2019-10-29
PCT/JP2020/039271 WO2021085216A1 (ja) 2019-10-29 2020-10-19 半導体装置、電力変換装置、および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021085216A1 true JPWO2021085216A1 (https=) 2021-05-06
JPWO2021085216A5 JPWO2021085216A5 (https=) 2022-06-27
JP7166471B2 JP7166471B2 (ja) 2022-11-07

Family

ID=75715973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021553430A Active JP7166471B2 (ja) 2019-10-29 2020-10-19 半導体装置、電力変換装置、および半導体装置の製造方法

Country Status (3)

Country Link
JP (1) JP7166471B2 (https=)
CN (1) CN114586151A (https=)
WO (1) WO2021085216A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4071791A1 (en) * 2021-04-09 2022-10-12 Hitachi Energy Switzerland AG Spring element for a press contact in a power semiconductor module, and method for manufacturing the same
JP7694512B2 (ja) * 2022-09-02 2025-06-18 株式会社デンソー 半導体装置
US12557668B2 (en) * 2023-04-27 2026-02-17 Allegro Microsystems, Llc High voltage integrated circuit packages with diagonalized lead configuration and method of making the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302734A (ja) * 1993-04-14 1994-10-28 Sansha Electric Mfg Co Ltd 電力用半導体モジュール
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2013236015A (ja) * 2012-05-10 2013-11-21 Nhk Spring Co Ltd パワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110869A (ja) * 2000-09-26 2002-04-12 Toshiba Corp 半導体装置
JP2005019771A (ja) * 2003-06-27 2005-01-20 Toyota Motor Corp 密閉構造
KR101104389B1 (ko) * 2009-12-24 2012-01-16 한국전기연구원 종단 구조 반도체 칩의 실장구조
JP6256309B2 (ja) * 2014-11-11 2018-01-10 三菱電機株式会社 電力用半導体装置
DE102017126716B4 (de) * 2017-11-14 2021-07-22 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul mit einer Schalteinrichtung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302734A (ja) * 1993-04-14 1994-10-28 Sansha Electric Mfg Co Ltd 電力用半導体モジュール
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2013236015A (ja) * 2012-05-10 2013-11-21 Nhk Spring Co Ltd パワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子

Also Published As

Publication number Publication date
CN114586151A (zh) 2022-06-03
JP7166471B2 (ja) 2022-11-07
WO2021085216A1 (ja) 2021-05-06

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