JPWO2021065036A1 - - Google Patents

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Publication number
JPWO2021065036A1
JPWO2021065036A1 JP2021551112A JP2021551112A JPWO2021065036A1 JP WO2021065036 A1 JPWO2021065036 A1 JP WO2021065036A1 JP 2021551112 A JP2021551112 A JP 2021551112A JP 2021551112 A JP2021551112 A JP 2021551112A JP WO2021065036 A1 JPWO2021065036 A1 JP WO2021065036A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021551112A
Other languages
Japanese (ja)
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JPWO2021065036A5 (https=
JP7269361B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021065036A1 publication Critical patent/JPWO2021065036A1/ja
Publication of JPWO2021065036A5 publication Critical patent/JPWO2021065036A5/ja
Application granted granted Critical
Publication of JP7269361B2 publication Critical patent/JP7269361B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07555—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H10W72/9528—Intermetallic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/701—Direct bonding of chips, wafers or substrates characterised by the pads after the direct bonding
    • H10W80/743—Direct bonding of chips, wafers or substrates characterised by the pads after the direct bonding having disposition changed during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP2021551112A 2019-10-01 2020-03-09 ワイヤ接合構造とそれに用いられるボンディングワイヤ及び半導体装置 Active JP7269361B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019181763 2019-10-01
JP2019181763 2019-10-01
PCT/JP2020/010119 WO2021065036A1 (ja) 2019-10-01 2020-03-09 ワイヤ接合構造とそれに用いられるボンディングワイヤ及び半導体装置

Publications (3)

Publication Number Publication Date
JPWO2021065036A1 true JPWO2021065036A1 (https=) 2021-04-08
JPWO2021065036A5 JPWO2021065036A5 (https=) 2022-03-31
JP7269361B2 JP7269361B2 (ja) 2023-05-08

Family

ID=75336861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551112A Active JP7269361B2 (ja) 2019-10-01 2020-03-09 ワイヤ接合構造とそれに用いられるボンディングワイヤ及び半導体装置

Country Status (6)

Country Link
JP (1) JP7269361B2 (https=)
KR (1) KR102766811B1 (https=)
CN (1) CN114502754B (https=)
DE (1) DE112020004723T5 (https=)
TW (1) TWI812853B (https=)
WO (1) WO2021065036A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022085365A1 (ja) * 2020-10-20 2022-04-28 日鉄マイクロメタル株式会社 半導体装置用Ａｇ合金ボンディングワイヤ
JP7157280B1 (ja) 2021-06-25 2022-10-19 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2022270050A1 (ja) * 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN117038618A (zh) 2021-06-25 2023-11-10 日铁新材料股份有限公司 半导体装置用接合线
WO2022270049A1 (ja) * 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN118140305A (zh) * 2021-11-23 2024-06-04 新加坡贺利氏材料私人有限公司 球接合布置
US12601621B2 (en) 2022-03-30 2026-04-14 Applied Materials, Inc. Methods of manufacturing plasma generating cells for a plasma source
TW202433501A (zh) * 2023-01-31 2024-08-16 日商拓自達電線股份有限公司 接合線
JP7723875B1 (ja) * 2024-03-28 2025-08-14 タツタ電線株式会社 ボンディングワイヤ
TW202548036A (zh) * 2024-03-28 2025-12-16 日商拓自達電線股份有限公司 接合線

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6417436A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Composite bonding wire
JPS6417437A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Bonding method for composite bonding wire
JP2001196411A (ja) * 2000-01-11 2001-07-19 Noge Denki Kogyo:Kk 金被覆した銀線ボンディングワイヤ
JP2012169374A (ja) * 2011-02-10 2012-09-06 Tanaka Electronics Ind Co Ltd Ａｇ−Ａｕ−Ｐｄ三元合金系ボンディングワイヤ
JP2014222725A (ja) * 2013-05-14 2014-11-27 田中電子工業株式会社 高速信号用ボンディングワイヤ
JP2016029691A (ja) * 2014-07-25 2016-03-03 田中電子工業株式会社 表面改質銀パラジウム合金ワイヤの構造
WO2017187653A1 (ja) * 2016-04-28 2017-11-02 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6487108B1 (ja) * 2018-11-26 2019-03-20 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ及びその製造方法
JP6507329B1 (ja) * 2019-02-08 2019-04-24 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、ワイヤ接合構造、半導体装置及び半導体装置の製造方法
JP2019186248A (ja) * 2018-04-02 2019-10-24 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法
JP2019186246A (ja) * 2018-04-02 2019-10-24 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3673368B2 (ja) 1997-05-23 2005-07-20 新日本製鐵株式会社 半導体素子用金銀合金細線
JP2001096411A (ja) 1999-09-28 2001-04-10 Hitachi Tool Engineering Ltd ツイストドリル
US9740442B2 (en) 2010-12-21 2017-08-22 Sato Holdings Kabushiki Kaisha Virtual input/output device for printers
EP2822029B1 (en) 2012-02-27 2024-12-18 Nippon Micrometal Corporation Bonding wire
US20130241058A1 (en) * 2012-03-16 2013-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wire Bonding Structures for Integrated Circuits
JP5529992B1 (ja) * 2013-03-14 2014-06-25 タツタ電線株式会社 ボンディング用ワイヤ
JP2015162617A (ja) * 2014-02-28 2015-09-07 サンケン電気株式会社 半導体装置
KR101687597B1 (ko) * 2015-01-19 2016-12-20 엠케이전자 주식회사 본딩 와이어
WO2016189752A1 (ja) * 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR20180008245A (ko) * 2015-06-15 2018-01-24 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어
CN107004610B (zh) * 2015-07-23 2020-07-17 日铁新材料股份有限公司 半导体装置用接合线
KR101812943B1 (ko) * 2016-10-20 2017-12-28 엠케이전자 주식회사 본딩 와이어

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6417436A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Composite bonding wire
JPS6417437A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Bonding method for composite bonding wire
JP2001196411A (ja) * 2000-01-11 2001-07-19 Noge Denki Kogyo:Kk 金被覆した銀線ボンディングワイヤ
JP2012169374A (ja) * 2011-02-10 2012-09-06 Tanaka Electronics Ind Co Ltd Ａｇ−Ａｕ−Ｐｄ三元合金系ボンディングワイヤ
JP2014222725A (ja) * 2013-05-14 2014-11-27 田中電子工業株式会社 高速信号用ボンディングワイヤ
JP2016029691A (ja) * 2014-07-25 2016-03-03 田中電子工業株式会社 表面改質銀パラジウム合金ワイヤの構造
WO2017187653A1 (ja) * 2016-04-28 2017-11-02 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2019186248A (ja) * 2018-04-02 2019-10-24 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法
JP2019186246A (ja) * 2018-04-02 2019-10-24 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法
JP6487108B1 (ja) * 2018-11-26 2019-03-20 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ及びその製造方法
JP6507329B1 (ja) * 2019-02-08 2019-04-24 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、ワイヤ接合構造、半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
CN114502754B (zh) 2023-11-17
KR102766811B1 (ko) 2025-02-17
KR20220047621A (ko) 2022-04-18
WO2021065036A1 (ja) 2021-04-08
DE112020004723T5 (de) 2022-06-15
TWI812853B (zh) 2023-08-21
CN114502754A (zh) 2022-05-13
JP7269361B2 (ja) 2023-05-08
TW202115799A (zh) 2021-04-16

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