JPWO2021039274A1 - - Google Patents

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Publication number
JPWO2021039274A1
JPWO2021039274A1 JP2021542667A JP2021542667A JPWO2021039274A1 JP WO2021039274 A1 JPWO2021039274 A1 JP WO2021039274A1 JP 2021542667 A JP2021542667 A JP 2021542667A JP 2021542667 A JP2021542667 A JP 2021542667A JP WO2021039274 A1 JPWO2021039274 A1 JP WO2021039274A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021542667A
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Japanese (ja)
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JP7574798B2 (ja
JPWO2021039274A5 (https=
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2021542667A 2019-08-27 2020-07-30 組成物、及び接着性ポリマーの洗浄方法 Active JP7574798B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019154914 2019-08-27
JP2019154914 2019-08-27
PCT/JP2020/029340 WO2021039274A1 (ja) 2019-08-27 2020-07-30 組成物、及び接着性ポリマーの洗浄方法

Publications (3)

Publication Number Publication Date
JPWO2021039274A1 true JPWO2021039274A1 (https=) 2021-03-04
JPWO2021039274A5 JPWO2021039274A5 (https=) 2022-05-11
JP7574798B2 JP7574798B2 (ja) 2024-10-29

Family

ID=74685865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542667A Active JP7574798B2 (ja) 2019-08-27 2020-07-30 組成物、及び接着性ポリマーの洗浄方法

Country Status (6)

Country Link
US (1) US11781092B2 (https=)
JP (1) JP7574798B2 (https=)
KR (1) KR102669766B1 (https=)
CN (1) CN114269892B (https=)
TW (1) TWI758813B (https=)
WO (1) WO2021039274A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102804998B1 (ko) * 2020-03-23 2025-05-09 닛산 가가쿠 가부시키가이샤 반도체 기판의 세정 방법, 가공된 반도체 기판의 제조 방법 및 박리용 조성물
US12577508B2 (en) * 2020-04-09 2026-03-17 Resonac Corporation Composition, and method for cleaning adhesive polymer
WO2022244593A1 (ja) * 2021-05-21 2022-11-24 昭和電工株式会社 分解洗浄組成物及びその製造方法、並びに接着性ポリマーの洗浄方法
TW202504983A (zh) * 2021-09-16 2025-02-01 日商日產化學股份有限公司 半導體基板之洗淨方法、加工後之半導體基板之製造方法、以及剝離及溶解用組成物
CN116218612B (zh) * 2021-12-06 2024-07-09 上海新阳半导体材料股份有限公司 一种聚酰亚胺清洗液在清洗半导体器件中的应用
CN116218611B (zh) * 2021-12-06 2024-06-21 上海新阳半导体材料股份有限公司 一种聚酰亚胺清洗液
CN116218610B (zh) * 2021-12-06 2024-07-09 上海新阳半导体材料股份有限公司 一种聚酰亚胺清洗液的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004000969A (ja) * 2002-05-31 2004-01-08 Internatl Business Mach Corp <Ibm> 電子コンポーネントからシリコーンポリマ付着物を除去する方法
JP2008252100A (ja) * 2007-03-21 2008-10-16 General Chemical Performance Products Llc 半導体エッチング残渣の除去剤及び洗浄剤
WO2014092022A1 (ja) * 2012-12-11 2014-06-19 富士フイルム株式会社 シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法
JP2017199754A (ja) * 2016-04-26 2017-11-02 信越化学工業株式会社 洗浄剤組成物及び薄型基板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
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JP2006176700A (ja) * 2004-12-24 2006-07-06 Tokuyama Corp 洗浄剤組成物
TWI339780B (en) * 2005-07-28 2011-04-01 Rohm & Haas Elect Mat Stripper
CN101201556A (zh) * 2006-12-15 2008-06-18 安集微电子（上海）有限公司 低蚀刻性光刻胶清洗剂
DE102011088885A1 (de) 2011-12-16 2013-06-20 Wacker Chemie Ag Siliconlöser
BE1020269A5 (nl) * 2012-01-17 2013-07-02 Taminco Gebruik van vervangende oplosmiddelen voor n-methylpyrrolidon (nmp).
US11978622B2 (en) * 2014-06-30 2024-05-07 Entegris, Inc. Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility
KR20160070386A (ko) * 2014-12-10 2016-06-20 동우 화인켐 주식회사 실리콘계 수지 제거용 조성물
KR102347599B1 (ko) * 2014-12-16 2022-01-10 동우 화인켐 주식회사 실리콘계 수지 제거용 조성물
KR102519448B1 (ko) * 2017-03-24 2023-04-07 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 처리 방법 및 이를 위한 조성물
CN108929808B (zh) * 2017-05-26 2020-11-27 荒川化学工业株式会社 无铅软钎料焊剂用清洗剂组合物、无铅软钎料焊剂的清洗方法
PL3844142T3 (pl) * 2018-08-30 2024-12-02 Huntsman Petrochemical Llc Czwartorzędowe wodorotlenki amoniowe poliamin
KR102181219B1 (ko) * 2019-04-19 2020-11-20 동우 화인켐 주식회사 접착 폴리머 제거용 조성물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004000969A (ja) * 2002-05-31 2004-01-08 Internatl Business Mach Corp <Ibm> 電子コンポーネントからシリコーンポリマ付着物を除去する方法
JP2008252100A (ja) * 2007-03-21 2008-10-16 General Chemical Performance Products Llc 半導体エッチング残渣の除去剤及び洗浄剤
WO2014092022A1 (ja) * 2012-12-11 2014-06-19 富士フイルム株式会社 シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法
JP2017199754A (ja) * 2016-04-26 2017-11-02 信越化学工業株式会社 洗浄剤組成物及び薄型基板の製造方法

Also Published As

Publication number Publication date
CN114269892A (zh) 2022-04-01
KR20220025847A (ko) 2022-03-03
WO2021039274A1 (ja) 2021-03-04
TW202113059A (zh) 2021-04-01
US11781092B2 (en) 2023-10-10
KR102669766B1 (ko) 2024-05-28
US20220290078A1 (en) 2022-09-15
CN114269892B (zh) 2024-02-23
JP7574798B2 (ja) 2024-10-29
TWI758813B (zh) 2022-03-21

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