JPWO2020255790A5 - - Google Patents
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- Publication number
- JPWO2020255790A5 JPWO2020255790A5 JP2021528107A JP2021528107A JPWO2020255790A5 JP WO2020255790 A5 JPWO2020255790 A5 JP WO2020255790A5 JP 2021528107 A JP2021528107 A JP 2021528107A JP 2021528107 A JP2021528107 A JP 2021528107A JP WO2020255790 A5 JPWO2020255790 A5 JP WO2020255790A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- shield member
- projecting portion
- beyond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019112277 | 2019-06-17 | ||
| JP2019112277 | 2019-06-17 | ||
| PCT/JP2020/022661 WO2020255790A1 (ja) | 2019-06-17 | 2020-06-09 | 電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020255790A1 JPWO2020255790A1 (https=) | 2020-12-24 |
| JPWO2020255790A5 true JPWO2020255790A5 (https=) | 2023-06-21 |
| JP7562526B2 JP7562526B2 (ja) | 2024-10-07 |
Family
ID=74037248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021528107A Active JP7562526B2 (ja) | 2019-06-17 | 2020-06-09 | 電子機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11997840B2 (https=) |
| JP (1) | JP7562526B2 (https=) |
| WO (1) | WO2020255790A1 (https=) |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59112973U (ja) * | 1983-01-20 | 1984-07-30 | 富士通株式会社 | 高周波用混成集積回路のケ−ス格納構造 |
| US4910434A (en) * | 1988-03-31 | 1990-03-20 | Digital Equipment Corporation | Multifunctional enclosure for wiring board in display |
| JPH06112973A (ja) | 1992-09-25 | 1994-04-22 | Matsushita Electric Works Ltd | パケット再送方式 |
| US5436803A (en) * | 1993-12-16 | 1995-07-25 | Schlegel Corporation | Emi shielding having flexible conductive envelope |
| US5557064A (en) * | 1994-04-18 | 1996-09-17 | Motorola, Inc. | Conformal shield and method for forming same |
| JP3022379B2 (ja) * | 1997-02-24 | 2000-03-21 | 株式会社セガ・エンタープライゼス | ノイズシールド構造を備える電子機器 |
| US6134121A (en) * | 1998-02-02 | 2000-10-17 | Motorola, Inc. | Housing assembly utilizing a heat shrinkable composite laminate |
| US6137051A (en) * | 1998-12-09 | 2000-10-24 | Nortel Networks Corporation | EMI shield/ gasket enclosure |
| US6900383B2 (en) * | 2001-03-19 | 2005-05-31 | Hewlett-Packard Development Company, L.P. | Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| JP2002344172A (ja) | 2001-05-16 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 無線端末装置 |
| DE10260459A1 (de) * | 2002-01-08 | 2003-08-14 | Mitsumi Electric Co Ltd | Abschirmummantelung für elektronische Geräte |
| JP4096605B2 (ja) * | 2002-04-23 | 2008-06-04 | 日本電気株式会社 | 半導体装置および半導体装置のシールド形成方法 |
| JP2008005461A (ja) * | 2006-05-24 | 2008-01-10 | Sharp Corp | 衛星信号用コンバータ、アンテナ装置および衛星放送受信装置 |
| US8634823B2 (en) * | 2010-06-01 | 2014-01-21 | Hendrikus A. Le Sage | Retrofit inline antenna power monitor system and method |
| WO2013150676A1 (ja) * | 2012-04-03 | 2013-10-10 | 三菱電機株式会社 | Emcシールド装置 |
| TW201511655A (zh) * | 2013-09-05 | 2015-03-16 | Hon Hai Prec Ind Co Ltd | 電子裝置 |
| CN108029222B (zh) * | 2015-09-18 | 2020-08-28 | 东丽株式会社 | 电子设备壳体 |
| US10652996B2 (en) * | 2015-12-21 | 2020-05-12 | 3M Innovative Properties Company | Formable shielding film |
| JP2018060991A (ja) | 2016-09-28 | 2018-04-12 | 住友ベークライト株式会社 | 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板 |
| US12098983B2 (en) * | 2017-01-18 | 2024-09-24 | Clad Innovations Ltd. | Duct mounted air quality monitoring system, method and device |
-
2020
- 2020-06-09 JP JP2021528107A patent/JP7562526B2/ja active Active
- 2020-06-09 WO PCT/JP2020/022661 patent/WO2020255790A1/ja not_active Ceased
- 2020-06-09 US US17/616,319 patent/US11997840B2/en active Active
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