JPWO2020255790A1 - - Google Patents

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Publication number
JPWO2020255790A1
JPWO2020255790A1 JP2021528107A JP2021528107A JPWO2020255790A1 JP WO2020255790 A1 JPWO2020255790 A1 JP WO2020255790A1 JP 2021528107 A JP2021528107 A JP 2021528107A JP 2021528107 A JP2021528107 A JP 2021528107A JP WO2020255790 A1 JPWO2020255790 A1 JP WO2020255790A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021528107A
Other languages
Japanese (ja)
Other versions
JP7562526B2 (ja
JPWO2020255790A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2020255790A1 publication Critical patent/JPWO2020255790A1/ja
Publication of JPWO2020255790A5 publication Critical patent/JPWO2020255790A5/ja
Application granted granted Critical
Publication of JP7562526B2 publication Critical patent/JP7562526B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526Electromagnetic shields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)
JP2021528107A 2019-06-17 2020-06-09 電子機器 Active JP7562526B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019112277 2019-06-17
JP2019112277 2019-06-17
PCT/JP2020/022661 WO2020255790A1 (ja) 2019-06-17 2020-06-09 電子機器

Publications (3)

Publication Number Publication Date
JPWO2020255790A1 true JPWO2020255790A1 (https=) 2020-12-24
JPWO2020255790A5 JPWO2020255790A5 (https=) 2023-06-21
JP7562526B2 JP7562526B2 (ja) 2024-10-07

Family

ID=74037248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021528107A Active JP7562526B2 (ja) 2019-06-17 2020-06-09 電子機器

Country Status (3)

Country Link
US (1) US11997840B2 (https=)
JP (1) JP7562526B2 (https=)
WO (1) WO2020255790A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112973U (ja) * 1983-01-20 1984-07-30 富士通株式会社 高周波用混成集積回路のケ−ス格納構造
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
JPH10229289A (ja) * 1997-02-24 1998-08-25 Sega Enterp Ltd ノイズシールド構造を備える電子機器
JP2008005461A (ja) * 2006-05-24 2008-01-10 Sharp Corp 衛星信号用コンバータ、アンテナ装置および衛星放送受信装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4910434A (en) * 1988-03-31 1990-03-20 Digital Equipment Corporation Multifunctional enclosure for wiring board in display
JPH06112973A (ja) 1992-09-25 1994-04-22 Matsushita Electric Works Ltd パケット再送方式
US5436803A (en) * 1993-12-16 1995-07-25 Schlegel Corporation Emi shielding having flexible conductive envelope
US6134121A (en) * 1998-02-02 2000-10-17 Motorola, Inc. Housing assembly utilizing a heat shrinkable composite laminate
US6137051A (en) * 1998-12-09 2000-10-24 Nortel Networks Corporation EMI shield/ gasket enclosure
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
JP2002344172A (ja) * 2001-05-16 2002-11-29 Matsushita Electric Ind Co Ltd 無線端末装置
DE10260459A1 (de) * 2002-01-08 2003-08-14 Mitsumi Electric Co Ltd Abschirmummantelung für elektronische Geräte
JP4096605B2 (ja) * 2002-04-23 2008-06-04 日本電気株式会社 半導体装置および半導体装置のシールド形成方法
US8634823B2 (en) * 2010-06-01 2014-01-21 Hendrikus A. Le Sage Retrofit inline antenna power monitor system and method
WO2013150676A1 (ja) * 2012-04-03 2013-10-10 三菱電機株式会社 Emcシールド装置
TW201511655A (zh) * 2013-09-05 2015-03-16 Hon Hai Prec Ind Co Ltd 電子裝置
EP3352548B1 (en) * 2015-09-18 2020-10-28 Toray Industries, Inc. Electronic device housing
US10652996B2 (en) * 2015-12-21 2020-05-12 3M Innovative Properties Company Formable shielding film
JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
US12098983B2 (en) * 2017-01-18 2024-09-24 Clad Innovations Ltd. Duct mounted air quality monitoring system, method and device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112973U (ja) * 1983-01-20 1984-07-30 富士通株式会社 高周波用混成集積回路のケ−ス格納構造
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
JPH10229289A (ja) * 1997-02-24 1998-08-25 Sega Enterp Ltd ノイズシールド構造を備える電子機器
JP2008005461A (ja) * 2006-05-24 2008-01-10 Sharp Corp 衛星信号用コンバータ、アンテナ装置および衛星放送受信装置

Also Published As

Publication number Publication date
WO2020255790A1 (ja) 2020-12-24
JP7562526B2 (ja) 2024-10-07
US20220322584A1 (en) 2022-10-06
US11997840B2 (en) 2024-05-28

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