JP7562526B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP7562526B2
JP7562526B2 JP2021528107A JP2021528107A JP7562526B2 JP 7562526 B2 JP7562526 B2 JP 7562526B2 JP 2021528107 A JP2021528107 A JP 2021528107A JP 2021528107 A JP2021528107 A JP 2021528107A JP 7562526 B2 JP7562526 B2 JP 7562526B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
shielding member
protrusion
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021528107A
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English (en)
Japanese (ja)
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JPWO2020255790A5 (https=
JPWO2020255790A1 (https=
Inventor
相佑 金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of JPWO2020255790A1 publication Critical patent/JPWO2020255790A1/ja
Publication of JPWO2020255790A5 publication Critical patent/JPWO2020255790A5/ja
Application granted granted Critical
Publication of JP7562526B2 publication Critical patent/JP7562526B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)
JP2021528107A 2019-06-17 2020-06-09 電子機器 Active JP7562526B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019112277 2019-06-17
JP2019112277 2019-06-17
PCT/JP2020/022661 WO2020255790A1 (ja) 2019-06-17 2020-06-09 電子機器

Publications (3)

Publication Number Publication Date
JPWO2020255790A1 JPWO2020255790A1 (https=) 2020-12-24
JPWO2020255790A5 JPWO2020255790A5 (https=) 2023-06-21
JP7562526B2 true JP7562526B2 (ja) 2024-10-07

Family

ID=74037248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021528107A Active JP7562526B2 (ja) 2019-06-17 2020-06-09 電子機器

Country Status (3)

Country Link
US (1) US11997840B2 (https=)
JP (1) JP7562526B2 (https=)
WO (1) WO2020255790A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557064A (en) 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112973U (ja) * 1983-01-20 1984-07-30 富士通株式会社 高周波用混成集積回路のケ−ス格納構造
US4910434A (en) * 1988-03-31 1990-03-20 Digital Equipment Corporation Multifunctional enclosure for wiring board in display
JPH06112973A (ja) 1992-09-25 1994-04-22 Matsushita Electric Works Ltd パケット再送方式
US5436803A (en) * 1993-12-16 1995-07-25 Schlegel Corporation Emi shielding having flexible conductive envelope
JP3022379B2 (ja) * 1997-02-24 2000-03-21 株式会社セガ・エンタープライゼス ノイズシールド構造を備える電子機器
US6134121A (en) * 1998-02-02 2000-10-17 Motorola, Inc. Housing assembly utilizing a heat shrinkable composite laminate
US6137051A (en) * 1998-12-09 2000-10-24 Nortel Networks Corporation EMI shield/ gasket enclosure
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
JP2002344172A (ja) 2001-05-16 2002-11-29 Matsushita Electric Ind Co Ltd 無線端末装置
DE10260459A1 (de) * 2002-01-08 2003-08-14 Mitsumi Electric Co Ltd Abschirmummantelung für elektronische Geräte
JP4096605B2 (ja) * 2002-04-23 2008-06-04 日本電気株式会社 半導体装置および半導体装置のシールド形成方法
JP2008005461A (ja) * 2006-05-24 2008-01-10 Sharp Corp 衛星信号用コンバータ、アンテナ装置および衛星放送受信装置
US8634823B2 (en) * 2010-06-01 2014-01-21 Hendrikus A. Le Sage Retrofit inline antenna power monitor system and method
WO2013150676A1 (ja) * 2012-04-03 2013-10-10 三菱電機株式会社 Ｅｍｃシールド装置
TW201511655A (zh) * 2013-09-05 2015-03-16 Hon Hai Prec Ind Co Ltd 電子裝置
CN108029222B (zh) * 2015-09-18 2020-08-28 东丽株式会社 电子设备壳体
US10652996B2 (en) * 2015-12-21 2020-05-12 3M Innovative Properties Company Formable shielding film
JP2018060991A (ja) 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
US12098983B2 (en) * 2017-01-18 2024-09-24 Clad Innovations Ltd. Duct mounted air quality monitoring system, method and device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557064A (en) 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same

Also Published As

Publication number Publication date
WO2020255790A1 (ja) 2020-12-24
JPWO2020255790A1 (https=) 2020-12-24
US11997840B2 (en) 2024-05-28
US20220322584A1 (en) 2022-10-06

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