JPWO2020240790A1 - - Google Patents

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Publication number
JPWO2020240790A1
JPWO2020240790A1 JP2021521703A JP2021521703A JPWO2020240790A1 JP WO2020240790 A1 JPWO2020240790 A1 JP WO2020240790A1 JP 2021521703 A JP2021521703 A JP 2021521703A JP 2021521703 A JP2021521703 A JP 2021521703A JP WO2020240790 A1 JPWO2020240790 A1 JP WO2020240790A1
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JP
Japan
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JP2021521703A
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JP7101885B2 (ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2924/0001—Technical content checked by a classifier
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    • H01L2924/1305—Bipolar Junction Transistor [BJT]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021521703A 2019-05-30 2019-05-30 パワー半導体モジュール及び電力変換装置 Active JP7101885B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/021601 WO2020240790A1 (ja) 2019-05-30 2019-05-30 パワー半導体モジュール及び電力変換装置

Publications (2)

Publication Number Publication Date
JPWO2020240790A1 true JPWO2020240790A1 (ja) 2020-12-03
JP7101885B2 JP7101885B2 (ja) 2022-07-15

Family

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JP2021521703A Active JP7101885B2 (ja) 2019-05-30 2019-05-30 パワー半導体モジュール及び電力変換装置

Country Status (5)

Country Link
US (1) US11855033B2 (ja)
JP (1) JP7101885B2 (ja)
CN (1) CN113841237A (ja)
DE (1) DE112019007366B4 (ja)
WO (1) WO2020240790A1 (ja)

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPS5769767A (en) * 1980-10-20 1982-04-28 Toshiba Corp Resin sealed type semiconductor device
JPS6352452A (ja) * 1986-08-22 1988-03-05 Hitachi Ltd 電子装置
JPH06120284A (ja) * 1992-10-05 1994-04-28 Toyota Motor Corp 半導体装置
JP2017010994A (ja) * 2015-06-17 2017-01-12 富士通株式会社 半導体装置および半導体装置の製造方法
WO2017145667A1 (ja) * 2016-02-24 2017-08-31 三菱電機株式会社 半導体モジュールおよびその製造方法

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JPH05121614A (ja) 1991-10-29 1993-05-18 Fuji Electric Co Ltd 樹脂封止形半導体装置
JPH05251496A (ja) * 1992-03-09 1993-09-28 Nec Yamagata Ltd 半導体素子
JPH06291160A (ja) * 1993-03-31 1994-10-18 Nippon Steel Corp 半導体装置および半導体装置の製造方法
JP3602453B2 (ja) * 2000-08-31 2004-12-15 Ｎｅｃエレクトロニクス株式会社 半導体装置
JP2007012831A (ja) * 2005-06-30 2007-01-18 Hitachi Ltd パワー半導体装置
JP5404124B2 (ja) * 2009-03-26 2014-01-29 本田技研工業株式会社 半導体装置
JP6002461B2 (ja) * 2011-08-26 2016-10-05 ローム株式会社 半導体装置および電子デバイス
JP6120284B2 (ja) 2011-11-11 2017-04-26 国立研究開発法人理化学研究所 コロイド分散液、その製造方法、およびその利用
JP5914006B2 (ja) * 2012-01-20 2016-05-11 スタンレー電気株式会社 半導体発光装置
JP2014150203A (ja) * 2013-02-04 2014-08-21 Mitsubishi Electric Corp パワーモジュール、およびパワーモジュールの製造方法
JP5769767B2 (ja) 2013-08-30 2015-08-26 株式会社東芝 用紙後処理装置
CA3077920C (en) 2014-06-20 2021-11-09 Hfi Innovation Inc. Method and apparatus of binarization and context-adaptive coding for syntax in video coding

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769767A (en) * 1980-10-20 1982-04-28 Toshiba Corp Resin sealed type semiconductor device
JPS6352452A (ja) * 1986-08-22 1988-03-05 Hitachi Ltd 電子装置
JPH06120284A (ja) * 1992-10-05 1994-04-28 Toyota Motor Corp 半導体装置
JP2017010994A (ja) * 2015-06-17 2017-01-12 富士通株式会社 半導体装置および半導体装置の製造方法
WO2017145667A1 (ja) * 2016-02-24 2017-08-31 三菱電機株式会社 半導体モジュールおよびその製造方法

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DE112019007366T5 (de) 2022-02-17
DE112019007366B4 (de) 2023-08-03
WO2020240790A1 (ja) 2020-12-03
JP7101885B2 (ja) 2022-07-15
US11855033B2 (en) 2023-12-26
CN113841237A (zh) 2021-12-24
US20220165700A1 (en) 2022-05-26

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