JPWO2020054581A1 - 電子部品及び電子部品の製造方法 - Google Patents
電子部品及び電子部品の製造方法 Download PDFInfo
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- JPWO2020054581A1 JPWO2020054581A1 JP2020545975A JP2020545975A JPWO2020054581A1 JP WO2020054581 A1 JPWO2020054581 A1 JP WO2020054581A1 JP 2020545975 A JP2020545975 A JP 2020545975A JP 2020545975 A JP2020545975 A JP 2020545975A JP WO2020054581 A1 JPWO2020054581 A1 JP WO2020054581A1
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- Prior art keywords
- copper
- particles
- metal
- solder
- wiring
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/12—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0094—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with organic materials as the main non-metallic constituent, e.g. resin
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0333—Organic insulating material consisting of one material containing S
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- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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Abstract
Description
第1の工程では、準備工程に続いて、図1の(b)に示すように、ポリマー成形体1上に銅ペーストを所定のパターンで(銅配線を形成する部分に)塗布して銅ペースト層2を形成する(形成工程)。銅ペーストは、例えば、スクリーン印刷、転写印刷、オフセット印刷、ジェットプリンティング法、ディスペンサー、ジェットディスペンサ、ニードルディスペンサ、カンマコータ、スリットコータ、ダイコータ、グラビアコータ、スリットコート、凸版印刷、凹版印刷、グラビア印刷、ステンシル印刷、ソフトリソグラフ、バーコート、アプリケータ、粒子堆積法、スプレーコータ、スピンコータ、ディップコータ、電着塗装等によって塗布される。
図1の(c)に示すように、銅粒子を焼結させることにより、銅配線3を形成する。
銅配線3における銅の含有量(体積%)=[(M1)/8.96]×100 (A)
第2の工程に続いて、図1の(d)に示すように、はんだ粒子4及び樹脂成分5を含有するはんだペーストを、銅配線3上に所定のパターンで塗布してはんだペースト層6を形成する。樹脂成分5の一部は、銅配線3の空隙部3aに浸透し、銅配線3の少なくとも一部に充填された樹脂充填部7を形成している。
第3の工程に続いて、図1の(e)に示すように、はんだペースト層6の所定の位置に電極9を有する電子素子8を配置(マウント)する(第4の工程)。電子素子8としては、ダイオード、整流器、サイリスタ、MOSゲートドライバ、パワースイッチ、パワーMOSFET、IGBT、ショットキーダイオード、ファーストリカバリダイオード等からなるパワーモジュール、発信機、増幅器、LEDモジュール、コンデンサ、ジャイロセンサ等が挙げられる。
第4の工程に続いて、図1の(f)に示すように、はんだ粒子4を溶融することで、はんだ層11を形成し、銅配線3と電子素子8の電極9とを接合する(第5の工程)。これにより、電子部品10が得られる。
(銅ペーストa1)
分散媒としてα−テルピネオール(富士フイルム和光純薬株式会社製)5.2g及びイソボルニルシクロヘキサノール(日本テルペン化学株式会社製)6.8gと、サブマイクロ銅粒子として「CH−0200」(三井金属鉱業株式会社製、50%体積平均粒径:0.36μm、粒径が0.01〜0.8μmの銅粒子の含有量:95質量%)52.8gとをポリ瓶に混合し、超音波ホモジナイザー(日本精機株式会社製の商品名「US−600」)により19.6kHz、600W、1分間処理し分散液を得た。この分散液に、フレーク状マイクロ銅粒子として「MA−C025」(三井金属鉱業株式会社製、最大径が1〜20μmの銅粒子の含有量:100質量%)35.2gを添加し、スパチュラで乾燥粉がなくなるまでかき混ぜた。ポリ瓶を密栓し、自転公転型攪拌装置(株式会社シンキー製の商品名「Planetry Vacuum Mixer ARV−310」)を用いて、2000rpmで2分間撹拌し、減圧下、2000rpmで2分間撹拌して、銅ペーストa1を得た。
サブマイクロ銅粒子の代わりに、銀コート銅粒子「10%AgコートCu−HWQ 5μm」(福田金属箔粉工業株式会社製、50%体積平均粒径:5.89μm)を用い、フレーク状マイクロ銅粒子の代わりに、銀コート銅粒子「10%Agコート2L3」(福田金属箔粉工業株式会社製、50%体積平均粒径:10.86μm)を用いた以外は、銅ペーストa1の調製と同様にして、銅ペーストa2を得た。
はんだ粒子(「Sn42−Bi58粒子」、平均粒子径:20μm)を70質量部、ビスフェノールF型エポキシ樹脂(新日鉄住金化学株式会社製の商品名「YDF−170」、エポキシ当量:170)を25.2質量部、イミダゾール化合物(四国化成工業株式会社製の商品名「2PZ−CN」)を1.3質量部、2,2−ビスヒドロキシメチルプロピオン酸を3.5質量部混合して、はんだペーストを調製した。
(電子部品40の作製)
大きさ40mm×40mm、厚み3mmの液晶ポリマーからなるポリマー成形体(住友化学株式会社製の商品名「スミカスーパーLCP E6000HF」)を準備した。続いて、図5の(a)に示すように、ポリマー成形体31上に、1.5mm×1mmの長方形の開口を2つ有するステンレス製のメタルマスク(厚み:50μm)を載せ、メタルスキージを用いたステンシル印刷により銅ペーストa1を塗布して銅ペースト層32を形成した部材を得た。
電子部品40について、ボンドテスタ(Dage社製の商品名:万能ボンドテスタ シリーズ4000)を用いて、接続強度(シェア強度)を測定した。具体的には、図10の(a)及び(b)に示すように、電子部品40に対し、シェアツール45を、シェア高さ50μmで配置し、矢印の方向に0.5mm/分の速度でシェアを行い、シェア強度を測定した。なお、図10の(b)は、図5の(d)におけるIVc−IVc線に沿った断面図である。ポリマー成形体31と銅配線33とが接合されている20箇所のシェア強度の平均値から、ポリマー成形体31と銅配線33との接着性を評価した。結果を表1に示す。
上記ポリマー成形体を準備し、図8の(a)に示すように、ポリマー成形体31上に、0.9mm×0.9mmの正方形の開口を1つ有するステンレス製のメタルマスク(厚み:50μm)を載せ、メタルスキージを用いたステンシル印刷により銅ペーストa1を塗布して銅ペースト層32を形成した部材を得た。得られた部材を、チューブ炉(株式会社エイブイシー製)にセットし、アルゴンガスを1L/分で流して空気をアルゴンガスに置換した。その後、水素ガスを300mL/分で流しながら昇温10分間、180℃で60分間の条件で焼結処理することにより銅ペースト層を焼結し、図8の(b)に示すように、銅配線33を形成した。
電子部品44について、ボンドテスタを用いて、接続強度(シェア強度)を測定した。具体的には、図11に示すように、電子部品44に対し、シェアツール45を、シェア高さ50μmで配置し、矢印の方向に0.5mm/分の速度でシェアを行い、シェア強度を測定した。ポリマー成形体31と銅配線33とが接合されている20箇所のシェア強度の平均値から、ポリマー成形体31と銅配線33との接着性を評価した。結果を表1に示す。
銅ペースト層32の焼結温度を180℃から225℃に変更した以外は、実施例1と同様にして電子部品40及び電子部品44を作製して、接着性を評価した。
銅ペーストa1に代えて、銅ペーストa2を用いて、銅ペースト層32を形成し、銅ペースト層32を大気中において180℃で10分間焼成した以外は、実施例1と同様にして電子部品40及び電子部品44を作製して、接着性を評価した。
はんだペーストに代えて、はんだ粒子「Sn42−Bi58粒子」のみを用いてはんだ層37を形成した以外は実施例1と同様にして、図12に示す電子部品48及び図13に示す電子部品49を作製して、接着性を評価した。
はんだペーストに代えて、はんだ粒子「Sn42−Bi58粒子」のみを用いてはんだ層37を形成した以外は実施例2と同様にして、電子部品48及び電子部品49を作製して、接着性を評価した。
はんだペーストに代えて、はんだ粒子「Sn42−Bi58粒子」のみを用いてはんだ層37を形成した以外は実施例3と同様にして、電子部品48及び電子部品49を作製して、接着性を評価した。
Claims (18)
- ポリマー成形体上に、金属粒子を含有する金属ペーストを所定のパターンで塗布して金属ペースト層を形成する第1の工程と、
前記金属粒子を焼結させることにより、金属配線を形成する第2の工程と、
前記金属配線上に、はんだ粒子及び樹脂成分を含有するはんだペーストを塗布してはんだペースト層を形成する第3の工程と、
前記はんだペースト層上に電子素子を配置する第4の工程と、
前記はんだペースト層を加熱して、前記金属配線と前記電子素子とを接合するはんだ層を形成すると共に、前記はんだ層の少なくとも一部を被覆する樹脂層を形成する第5の工程と、を備える、電子部品の製造方法。 - 前記第2の工程において、前記金属配線が空隙を有している、請求項1に記載の電子部品の製造方法。
- 前記第3の工程において、前記空隙の少なくとも一部が、前記樹脂成分により充填されている、請求項2に記載の電子部品の製造方法。
- 前記はんだ粒子が、スズを含む、請求項1〜3のいずれか一項に記載の電子部品の製造方法。
- 前記はんだ粒子が、In−Sn合金、In−Sn−Ag合金、Sn−Bi合金、Sn−Bi−Ag合金、Sn−Ag−Cu合金及びSn−Cu合金からなる群より選ばれる少なくとも1種のスズ合金からなる、請求項4に記載の電子部品の製造方法。
- 前記金属粒子が、銅、ニッケル、パラジウム、金、白金、銀及びスズからなる群より選ばれる少なくとも1種の金属を含む、請求項1〜5のいずれか一項に記載の電子部品の製造方法。
- 前記ポリマー成形体が、液晶ポリマー又はポリフェニレンスルフィドからなる、請求項1〜6のいずれか一項に記載の電子部品の製造方法。
- 前記電子素子が、銅、ニッケル、パラジウム、金、白金、銀及びスズからなる群より選ばれる少なくとも1種を最表面に含む電極を有し、
前記第4の工程において、前記電極が前記はんだペースト層と接するように前記電子素子を配置する、請求項1〜7のいずれか一項に記載の電子部品の製造方法。 - 前記金属粒子が、粒径が2.0μm以上である第1の金属粒子と、粒径が0.8μm以下である第2の金属粒子とを含む、請求項1〜8のいずれか一項に記載の電子部品の製造方法。
- ポリマー成形体と、
前記ポリマー成形体上に設けられ、金属粒子の焼結体からなる金属配線と、
前記金属配線上に配置された電子素子と、
前記金属配線と前記電子素子とを接合するはんだ層と、
前記はんだ層の少なくとも一部を被覆する樹脂成分の硬化物からなる樹脂層と、
を備える、電子部品。 - 前記金属配線が、空隙を有する、請求項10に記載の電子部品。
- 前記空隙の少なくとも一部が、前記樹脂成分の硬化物で充填されている、請求項11に記載の電子部品。
- 前記はんだ層が、スズを含む、請求項10〜12のいずれか一項に記載の電子部品。
- 前記はんだ層が、In−Sn合金、In−Sn−Ag合金、Sn−Bi合金、Sn−Bi−Ag合金、Sn−Ag−Cu合金及びSn−Cu合金からなる群より選ばれる少なくとも1種のスズ合金からなる、請求項13に記載の電子部品。
- 前記金属粒子が、銅、ニッケル、パラジウム、金、白金、銀及びスズからなる群より選ばれる少なくとも1種の金属を含む、請求項10〜14のいずれか一項に記載の電子部品。
- 前記ポリマー成形体が、液晶ポリマー又はポリフェニレンスルフィドからなる、請求項10〜15のいずれか一項に記載の電子部品。
- 前記電子素子が、銅、ニッケル、パラジウム、金、白金、銀及びスズからなる群より選ばれる少なくとも1種を最表面に含む電極を有し、
前記電極が、前記はんだ層と接合している、請求項10〜16のいずれか一項に記載の電子部品。 - 前記金属粒子が、粒径が2.0μm以上である第1の金属粒子と、粒径が0.8μm以下である第2の金属粒子とを含む、請求項10〜17のいずれか一項に記載の電子部品。
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