JPWO2020017599A1 - 基板処理システム及び基板処理方法 - Google Patents
基板処理システム及び基板処理方法 Download PDFInfo
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Abstract
Description
具体的に、研削装置46は、裏面Wbに研削砥石を当接させた状態で、処理ウェハW(重合ウェハT)と研削砥石をそれぞれ回転させ、さらに研削砥石を下降させて行われる。なお、上述した内部面改質層と周縁改質層はダメージを受けた層であり、裏面Wbはダメージ面を構成する。
変形例1として、ステップA4の周縁部Weの除去とステップA5の内部面改質層M3の形成の順序を入れ替えてもよい。かかる場合、ウェハ処理は、ステップA1〜A3、A5、A4、A6〜A10の順で行われる。
変形例2として、ステップA5の内部面改質層M3形成をステップA2の周縁改質層M1の形成の前に行ってもよい。かかる場合、ウェハ処理は、ステップA5、A1〜A4、A6〜A10の順で行われる。
変形例3として、ステップA6の保護膜P1の形成とステップA7の裏面ウェハWb1の分離の順序を入れ替えてもよい。かかる場合、ウェハ処理は、ステップA1〜A5、A7、A6、A8〜A10の順で行われる。
変形例4として、変形例1と変形例3を組み合わせてもよい。すなわち、ウェハ処理は、ステップA1〜A3、A5、A4、A7、A6、A8〜A10の順で行われる。
また、変形例5として、変形例2と変形例3を組み合わせてもよい。すなわち、ウェハ処理は、ステップA5、A1〜A4、A7、A6、A8〜A10の順で行われる。
変形例6として、ステップA1の未接合領域Aeの形成をステップA2の周縁改質層M1の形成後に行ってもよい。かかる場合、ウェハ処理は、ステップA2、A1、A3、A4〜A10の順で行われる。
その他、任意の順序によりウェハ処理を行うことができる。
変形例1として、ステップB2の周縁改質層M4の形成とステップB3の内部面改質層M5の形成の順序を入れ替えてもよい。かかる場合、ウェハ処理は、ステップB1、ステップB3、B2、B3〜B8の順で行われる。
変形例2として、ステップB1の未接合領域Aeの形成は、ステップB2の周縁改質層M4の形成後に行われてもよい。かかる場合、ウェハ処理はステップB2、ステップB1、ステップB3〜B8の順で行われる。
変形例3として、ステップB1の未接合領域Aeの形成は、ステップB3の内部面改質層M5の形成後に行われてもよい。かかる場合、ウェハ処理はステップB2〜B3、ステップB1、ステップB4〜B8の順で行われる。
40 改質装置
44 分離装置
M3、M5、M6 内部面改質層
S 支持ウェハ
T 重合ウェハ
W 処理ウェハ
変形例1として、ステップB2の周縁改質層M4の形成とステップB3の内部面改質層M5の形成の順序を入れ替えてもよい。かかる場合、ウェハ処理は、ステップB1、ステップB3、B2、B4〜B8の順で行われる。
変形例2として、ステップB1の未接合領域Aeの形成は、ステップB2の周縁改質層M4の形成後に行われてもよい。かかる場合、ウェハ処理はステップB2、ステップB1、ステップB3〜B8の順で行われる。
変形例3として、ステップB1の未接合領域Aeの形成は、ステップB3の内部面改質層M5の形成後に行われてもよい。かかる場合、ウェハ処理はステップB2〜B3、ステップB1、ステップB4〜B8の順で行われる。
Claims (25)
- 基板を処理する基板処理システムであって、
第1の基板の表面と第2の基板の表面が接合された重合基板に対し、前記第1の基板の内部において面方向に中心部から少なくとも当該第1の基板の除去対象の周縁部に向けて延伸する内部面改質層を形成する第1の改質装置と、
前記第1の基板の内部において、前記周縁部と中央部との境界に沿って厚み方向に延伸する周縁改質層を形成する第2の改質装置と、
前記内部面改質層を基点に前記第1の基板の裏面側を分離する分離装置と、有する、基板処理システム。 - 前記周縁部に相当する部分における前記第1の基板と前記第2の基板の接合力を低下させる未接合領域を形成する第3の改質装置を有する、請求項1に記載の基板処理システム。
- 前記第2の改質装置は、前記周縁改質層から前記第1の基板の厚み方向に形成されるクラックを、前記第1の基板の表面と裏面まで進展させるように当該周縁改質層を形成する、請求項1または2に記載の基板処理システム。
- 前記周縁改質層を基点に前記周縁部を除去する周縁除去装置を有する、請求項3に記載の基板処理システム。
- 前記第2の改質装置は、前記第1の基板の内部において前記周縁改質層から径方向外側に延伸した分割改質層を形成する、請求項1〜4のいずれか一項に記載の基板処理システム。
- 前記第1の改質装置は、前記第1の基板の内部において面方向に中心部から前記周縁改質層まで延伸するように形成し、
前記第2の改質装置は、前記周縁改質層から前記第1の基板の厚み方向に形成されるクラックを、前記第1の基板の表面まで進展させるように当該周縁改質層を形成する、請求項1または2に記載の基板処理システム。 - 前記第1の改質装置は、前記第1の基板の内部において面方向に中心部から外端部に向けて延伸するように形成し、
第2の改質装置は、前記周縁改質層から前記第1の基板の厚み方向に形成されるクラックを、前記第1の基板の表面まで進展させるように当該周縁改質層を形成する、請求項1または2に記載の基板処理システム。 - 前記第1の改質装置と前記第2の改質装置は、同じ装置である、請求項1〜7のいずれか一項に記載の基板処理システム。
- 前記分離装置で分離後の前記第1の基板において、前記内部面改質層が形成されたダメージ面を処理するダメージ処理装置を有する、請求項1〜8のいずれか一項に記載の基板処理システム。
- 第1の基板の表面に形成されたデバイス層を保護する保護層を形成する保護層形成装置を有し、
前記ダメージ処理装置は、前記ダメージ面に対してウェットエッチングを行い、
前記保護層形成装置は、少なくとも前記第1の基板の周縁部の除去により露出した前記デバイス層の側壁部を保護するように前記保護層を形成する、請求項9に記載の基板処理システム。 - 前記保護層を除去する保護層除去装置を有する、請求項10に記載の基板処理システム。
- 前記第1の基板に対する改質層の形成前に、前記第1の基板の裏面に形成された裏面膜の除去を行う裏面膜除去装置を有する、請求項1〜11のいずれか一項に記載の基板処理システム。
- 基板を処理する基板処理方法であって、
第1の基板の表面と第2の基板の表面が接合された重合基板に対し、前記第1の基板の内部において面方向に中心部から少なくとも当該第1の基板の除去対象の周縁部に向けて延伸する内部面改質層を形成することと、
前記第1の基板の内部において、前記周縁部と中央部との境界に沿って厚み方向に延伸する周縁改質層を形成することと、
前記内部面改質層を基点に前記第1の基板の裏面側を分離することと、有する、基板処理方法。 - 前記周縁部に相当する部分における前記第1の基板と前記第2の基板の接合力を低下させる未接合領域を形成することを有する、請求項13に記載の基板処理方法。
- 前記未接合領域の形成は、前記第1の基板と前記第2の基板の接合前に行われる、請求項14に記載の基板処理方法。
- 前記未接合領域の形成は、前記第1の基板と前記第2の基板の接合後に行われる、請求項14に記載の基板処理方法。
- 前記周縁改質層の形成においては、前記周縁改質層から前記第1の基板の厚み方向に形成されるクラックを、前記第1の基板の表面と裏面まで進展させるように当該周縁改質層を形成する、請求項13〜16のいずれか一項に記載の基板処理方法。
- 前記周縁改質層を基点に前記周縁部を除去することを有する、請求項17に記載の基板処理方法。
- 前記第1の基板の内部において前記周縁改質層から径方向外側に延伸した分割改質層を形成することを有する、請求項13〜18のいずれか一項に記載の基板処理方法。
- 前記内部面改質層の形成においては、前記第1の基板の内部において面方向に中心部から前記周縁改質層まで延伸するように形成し、
前記周縁改質層の形成においては、前記周縁改質層から前記第1の基板の厚み方向に形成されるクラックを、前記第1の基板の表面まで進展させるように当該周縁改質層を形成する、請求項13〜16のいずれか一項に記載の基板処理方法。 - 前記内部面改質層の形成においては、前記第1の基板の内部において面方向に中心部から外端部に向けて延伸するように形成し、
前記周縁改質層の形成においては、前記周縁改質層から前記第1の基板の厚み方向に形成されるクラックを、前記第1の基板の表面まで進展させるように当該周縁改質層を形成する、請求項13〜16のいずれか一項に記載の基板処理方法。 - 分離後の前記第1の基板において、前記内部面改質層が形成されたダメージ面を処理することを有する、請求項13〜21のいずれか一項に記載の基板処理方法。
- 第1の基板の表面に形成されたデバイス層を保護する保護層を形成することを有し、
前記ダメージ面の処理において、前記ダメージ面に対してウェットエッチングを行い、
前記保護層の形成においては、少なくとも前記第1の基板の周縁部の除去により露出した前記デバイス層の側壁部を保護するように前記保護層を形成する、請求項22に記載の基板処理方法。 - 前記保護層を除去することを有する、請求項23に記載の基板処理方法。
- 前記第1の基板に対する改質層の形成前に、前記第1の基板の裏面に形成された裏面膜の除去を行うことを有する、請求項13〜24のいずれか一項に記載の基板処理方法。
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