JPWO2019217015A5 - - Google Patents

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Publication number
JPWO2019217015A5
JPWO2019217015A5 JP2020562580A JP2020562580A JPWO2019217015A5 JP WO2019217015 A5 JPWO2019217015 A5 JP WO2019217015A5 JP 2020562580 A JP2020562580 A JP 2020562580A JP 2020562580 A JP2020562580 A JP 2020562580A JP WO2019217015 A5 JPWO2019217015 A5 JP WO2019217015A5
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JP
Japan
Prior art keywords
substrate
process chamber
curvature
processing program
substrate processing
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JP2020562580A
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English (en)
Japanese (ja)
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JP7364597B2 (ja
JP2021523565A (ja
JP2021523565A5 (https=
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Priority claimed from PCT/US2019/026155 external-priority patent/WO2019217015A1/en
Publication of JP2021523565A publication Critical patent/JP2021523565A/ja
Publication of JPWO2019217015A5 publication Critical patent/JPWO2019217015A5/ja
Publication of JP2021523565A5 publication Critical patent/JP2021523565A5/ja
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JP2020562580A 2018-05-07 2019-04-05 基板の変形の検出と修正 Active JP7364597B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862668175P 2018-05-07 2018-05-07
US62/668,175 2018-05-07
PCT/US2019/026155 WO2019217015A1 (en) 2018-05-07 2019-04-05 Substrate deformation detection and correction

Publications (4)

Publication Number Publication Date
JP2021523565A JP2021523565A (ja) 2021-09-02
JPWO2019217015A5 true JPWO2019217015A5 (https=) 2022-04-13
JP2021523565A5 JP2021523565A5 (https=) 2022-04-13
JP7364597B2 JP7364597B2 (ja) 2023-10-18

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Family Applications (1)

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JP2020562580A Active JP7364597B2 (ja) 2018-05-07 2019-04-05 基板の変形の検出と修正

Country Status (7)

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US (2) US10804125B2 (https=)
JP (1) JP7364597B2 (https=)
KR (1) KR102753315B1 (https=)
CN (1) CN112106179B (https=)
SG (1) SG11202010093QA (https=)
TW (1) TWI710038B (https=)
WO (1) WO2019217015A1 (https=)

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* Cited by examiner, † Cited by third party
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WO2020092005A1 (en) * 2018-10-30 2020-05-07 Lam Research Corporation Substrate state detection for plasma processing tools
US11437262B2 (en) * 2018-12-12 2022-09-06 Applied Materials, Inc Wafer de-chucking detection and arcing prevention
US12386342B2 (en) * 2022-05-11 2025-08-12 Applied Materials, Inc. Holistic analysis of multidimensional sensor data for substrate processing equipment
KR20240020964A (ko) * 2022-08-09 2024-02-16 주식회사 테스 기판처리방법

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JPH03228347A (ja) * 1990-02-02 1991-10-09 Hitachi Ltd 半導体素子内部応力制御方式
JPH09129528A (ja) * 1995-11-02 1997-05-16 Hitachi Ltd 半導体装置の製造方法及びその装置
US6455437B1 (en) * 1999-04-07 2002-09-24 Applied Materials Inc. Method and apparatus for monitoring the process state of a semiconductor device fabrication process
US6996472B2 (en) * 2000-10-10 2006-02-07 The United States Of America As Represented By The Department Of Health And Human Services Drift compensation method for fingerprint spectra
JP4060558B2 (ja) * 2001-09-12 2008-03-12 株式会社日立製作所 欠陥検査方法及びその装置
US7265382B2 (en) * 2002-11-12 2007-09-04 Applied Materials, Inc. Method and apparatus employing integrated metrology for improved dielectric etch efficiency
JP5283961B2 (ja) * 2008-04-24 2013-09-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN102089873A (zh) * 2008-05-16 2011-06-08 加拿大马特森技术有限公司 工件破损防止方法及设备
JP4575984B2 (ja) * 2009-02-12 2010-11-04 三井造船株式会社 原子層成長装置および薄膜形成方法
JP5597695B2 (ja) * 2010-03-26 2014-10-01 株式会社アルバック 基板保持装置及び基板保持方法
JP2013046047A (ja) * 2011-08-26 2013-03-04 Toshiba Corp 加熱装置および半導体装置の製造方法
US10497747B2 (en) * 2012-11-28 2019-12-03 Invensense, Inc. Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
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JP6388605B2 (ja) * 2013-02-08 2018-09-12 コーネル ユニバーシティー 生体分子処理プラットフォーム及びその使用
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GB201615114D0 (en) * 2016-09-06 2016-10-19 Spts Technologies Ltd A Method and system of monitoring and controlling deformation of a wafer substrate
JP6690488B2 (ja) 2016-09-29 2020-04-28 株式会社リコー 情報処理システム、閲覧制御方法、情報処理装置及びプログラム
JP7085824B2 (ja) 2017-11-28 2022-06-17 東京エレクトロン株式会社 成膜方法

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