JPWO2019171198A5 - - Google Patents

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JPWO2019171198A5
JPWO2019171198A5 JP2020504471A JP2020504471A JPWO2019171198A5 JP WO2019171198 A5 JPWO2019171198 A5 JP WO2019171198A5 JP 2020504471 A JP2020504471 A JP 2020504471A JP 2020504471 A JP2020504471 A JP 2020504471A JP WO2019171198 A5 JPWO2019171198 A5 JP WO2019171198A5
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transistor
transistors
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JP2020504471A
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JPWO2019171198A1 (ja
JP7209692B2 (ja
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Priority claimed from PCT/IB2019/051406 external-priority patent/WO2019171198A1/ja
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JP2020504471A 2018-03-06 2019-02-21 半導体装置 Active JP7209692B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2018039854 2018-03-06
JP2018039854 2018-03-06
JP2018075977 2018-04-11
JP2018075977 2018-04-11
JP2018149313 2018-08-08
JP2018149313 2018-08-08
PCT/IB2019/051406 WO2019171198A1 (ja) 2018-03-06 2019-02-21 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2019171198A1 JPWO2019171198A1 (ja) 2021-02-12
JPWO2019171198A5 true JPWO2019171198A5 (https=) 2022-01-31
JP7209692B2 JP7209692B2 (ja) 2023-01-20

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ID=67847019

Family Applications (1)

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JP2020504471A Active JP7209692B2 (ja) 2018-03-06 2019-02-21 半導体装置

Country Status (5)

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US (1) US12300752B2 (https=)
JP (1) JP7209692B2 (https=)
KR (1) KR20200127004A (https=)
CN (1) CN111788697B (https=)
WO (1) WO2019171198A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7679305B2 (ja) 2019-11-08 2025-05-19 株式会社半導体エネルギー研究所 半導体装置
CN111834413A (zh) * 2020-04-17 2020-10-27 昆山国显光电有限公司 显示面板以及显示装置
CN112289796B (zh) * 2020-10-28 2021-09-28 长江存储科技有限责任公司 三维存储器的制造方法及三维存储器
KR102895845B1 (ko) * 2020-12-02 2025-12-04 삼성디스플레이 주식회사 표시 장치의 검사 방법
JP7393471B2 (ja) * 2021-06-03 2023-12-06 シャープ株式会社 光電変換装置およびx線撮像装置
CN114339313B (zh) * 2021-12-28 2024-09-13 维沃移动通信有限公司 插帧方法、装置及电子设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566633B2 (en) 2005-02-25 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5046529B2 (ja) * 2005-02-25 2012-10-10 株式会社半導体エネルギー研究所 半導体装置
JP2008004796A (ja) * 2006-06-23 2008-01-10 Matsushita Electric Ind Co Ltd 半導体装置および回路素子レイアウト方法
KR101291384B1 (ko) * 2008-11-21 2013-07-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2011205049A (ja) * 2010-03-26 2011-10-13 Toshiba Corp 半導体集積回路
KR20120004774A (ko) 2010-07-07 2012-01-13 주식회사 하이닉스반도체 더미 패턴을 포함하는 반도체 장치 및 레이아웃
US8643008B2 (en) 2011-07-22 2014-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6016455B2 (ja) 2012-05-23 2016-10-26 株式会社半導体エネルギー研究所 半導体装置
JP6607681B2 (ja) 2014-03-07 2019-11-20 株式会社半導体エネルギー研究所 半導体装置
US9336348B2 (en) 2014-09-12 2016-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming layout design
KR20160093749A (ko) * 2015-01-29 2016-08-09 삼성디스플레이 주식회사 표시 기판, 이의 제조 방법 및 이를 포함하는 표시 장치
CN113314545B (zh) 2015-04-20 2024-10-29 株式会社半导体能源研究所 半导体装置及电子设备

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