JPWO2019146617A5 - - Google Patents
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- Publication number
- JPWO2019146617A5 JPWO2019146617A5 JP2019567101A JP2019567101A JPWO2019146617A5 JP WO2019146617 A5 JPWO2019146617 A5 JP WO2019146617A5 JP 2019567101 A JP2019567101 A JP 2019567101A JP 2019567101 A JP2019567101 A JP 2019567101A JP WO2019146617 A5 JPWO2019146617 A5 JP WO2019146617A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- sealing resin
- composition according
- epoxy resin
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 15
- 238000007789 sealing Methods 0.000 claims 13
- 239000003822 epoxy resin Substances 0.000 claims 8
- 229920000647 polyepoxide Polymers 0.000 claims 8
- 125000003827 glycol group Chemical group 0.000 claims 6
- 229920001515 polyalkylene glycol Polymers 0.000 claims 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 238000005538 encapsulation Methods 0.000 claims 3
- 239000011256 inorganic filler Substances 0.000 claims 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- -1 alkylene glycols Chemical class 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 229920001451 polypropylene glycol Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018008661 | 2018-01-23 | ||
| JP2018008661 | 2018-01-23 | ||
| PCT/JP2019/002010 WO2019146617A1 (ja) | 2018-01-23 | 2019-01-23 | 封止用樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2019146617A1 JPWO2019146617A1 (ja) | 2021-02-12 |
| JPWO2019146617A5 true JPWO2019146617A5 (https=) | 2022-01-24 |
| JP7420559B2 JP7420559B2 (ja) | 2024-01-23 |
Family
ID=67395428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019567101A Active JP7420559B2 (ja) | 2018-01-23 | 2019-01-23 | 封止用樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11760870B2 (https=) |
| JP (1) | JP7420559B2 (https=) |
| TW (1) | TWI862483B (https=) |
| WO (1) | WO2019146617A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3620481B1 (en) | 2017-05-31 | 2024-03-27 | Resonac Corporation | Liquid resin composition for sealing and electronic component apparatus |
| US12454612B2 (en) | 2017-05-31 | 2025-10-28 | Resonac Corporation | Liquid resin composition for compression molding and electronic component apparatus |
| JP7302331B2 (ja) * | 2019-06-26 | 2023-07-04 | 味の素株式会社 | 樹脂組成物 |
| JP7302496B2 (ja) * | 2020-02-05 | 2023-07-04 | 味の素株式会社 | 樹脂組成物 |
| JP7849687B2 (ja) | 2022-01-27 | 2026-04-22 | エスケーハイニックス株式会社 | Ｔｓｖ用モールドアンダーフィル組成物 |
| JP2023149598A (ja) * | 2022-03-31 | 2023-10-13 | 住友ベークライト株式会社 | 封止用樹脂組成物、および半導体パッケージの製造方法 |
| WO2026009780A1 (ja) * | 2024-07-03 | 2026-01-08 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法 |
| WO2026009778A1 (ja) * | 2024-07-03 | 2026-01-08 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法 |
| CN120424471A (zh) * | 2025-07-09 | 2025-08-05 | 天津德高化成光电科技有限责任公司 | 一种光学环氧树脂塑封料及其制备方法和应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189247A (ja) * | 1984-10-08 | 1986-05-07 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPS62210653A (ja) * | 1986-03-11 | 1987-09-16 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JP3965511B2 (ja) * | 1997-12-27 | 2007-08-29 | ナガセケムテックス株式会社 | 光ディスク貼り合わせ用エポキシ樹脂接着剤 |
| JPH11199651A (ja) * | 1998-01-12 | 1999-07-27 | Sumitomo Bakelite Co Ltd | デバイス中空パッケージ封止用紫外線硬化型接着剤樹脂組成物 |
| JP2002076203A (ja) * | 2000-08-31 | 2002-03-15 | Hitachi Chem Co Ltd | ウエハレベルチップサイズパッケージ用の封止用成形材料及びウエハレベルチップサイズパッケージ |
| JP2004018786A (ja) * | 2002-06-19 | 2004-01-22 | Kyocera Chemical Corp | 封止用樹脂組成物および電子部品封止装置 |
| JP2006176678A (ja) | 2004-12-22 | 2006-07-06 | Matsushita Electric Works Ltd | エポキシ樹脂組成物及び電子部品 |
| JP2007314702A (ja) * | 2006-05-26 | 2007-12-06 | Matsushita Electric Works Ltd | エポキシ樹脂組成物と樹脂封止半導体装置 |
| JP2012162585A (ja) | 2011-02-03 | 2012-08-30 | Namics Corp | 半導体樹脂封止材 |
| JP2012224758A (ja) | 2011-04-20 | 2012-11-15 | Panasonic Corp | エポキシ樹脂組成物及び半導体装置 |
| JP5965485B2 (ja) * | 2011-08-31 | 2016-08-03 | ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー | 計器用トランスフォーマーを封止するための疎水性エポキシ樹脂システムの使用 |
| WO2017027482A1 (en) * | 2015-08-08 | 2017-02-16 | Designer Molecules, Inc. | Anionic curable compositions |
| WO2017030126A1 (ja) * | 2015-08-17 | 2017-02-23 | 積水化学工業株式会社 | 半導体装置及び半導体素子保護用材料 |
| JP6597471B2 (ja) | 2016-05-02 | 2019-10-30 | 信越化学工業株式会社 | 大面積の半導体素子搭載基材を封止する方法 |
| US12454612B2 (en) | 2017-05-31 | 2025-10-28 | Resonac Corporation | Liquid resin composition for compression molding and electronic component apparatus |
-
2019
- 2019-01-23 US US16/963,292 patent/US11760870B2/en active Active
- 2019-01-23 TW TW108102549A patent/TWI862483B/zh active
- 2019-01-23 WO PCT/JP2019/002010 patent/WO2019146617A1/ja not_active Ceased
- 2019-01-23 JP JP2019567101A patent/JP7420559B2/ja active Active
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