JP7420559B2 - 封止用樹脂組成物 - Google Patents

封止用樹脂組成物 Download PDF

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Publication number
JP7420559B2
JP7420559B2 JP2019567101A JP2019567101A JP7420559B2 JP 7420559 B2 JP7420559 B2 JP 7420559B2 JP 2019567101 A JP2019567101 A JP 2019567101A JP 2019567101 A JP2019567101 A JP 2019567101A JP 7420559 B2 JP7420559 B2 JP 7420559B2
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resin composition
sealing resin
epoxy resin
sealing
mass
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Japanese (ja)
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JPWO2019146617A1 (ja
JPWO2019146617A5 (https=
Inventor
陽介 大井
崇志 平岡
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Nagase Chemtex Corp
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Nagase Chemtex Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
    • C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2019567101A 2018-01-23 2019-01-23 封止用樹脂組成物 Active JP7420559B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018008661 2018-01-23
JP2018008661 2018-01-23
PCT/JP2019/002010 WO2019146617A1 (ja) 2018-01-23 2019-01-23 封止用樹脂組成物

Publications (3)

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JPWO2019146617A1 JPWO2019146617A1 (ja) 2021-02-12
JPWO2019146617A5 JPWO2019146617A5 (https=) 2022-01-24
JP7420559B2 true JP7420559B2 (ja) 2024-01-23

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JP2019567101A Active JP7420559B2 (ja) 2018-01-23 2019-01-23 封止用樹脂組成物

Country Status (4)

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US (1) US11760870B2 (https=)
JP (1) JP7420559B2 (https=)
TW (1) TWI862483B (https=)
WO (1) WO2019146617A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3620481B1 (en) 2017-05-31 2024-03-27 Resonac Corporation Liquid resin composition for sealing and electronic component apparatus
US12454612B2 (en) 2017-05-31 2025-10-28 Resonac Corporation Liquid resin composition for compression molding and electronic component apparatus
JP7302331B2 (ja) * 2019-06-26 2023-07-04 味の素株式会社 樹脂組成物
JP7302496B2 (ja) * 2020-02-05 2023-07-04 味の素株式会社 樹脂組成物
JP7849687B2 (ja) 2022-01-27 2026-04-22 エスケーハイニックス株式会社 Ｔｓｖ用モールドアンダーフィル組成物
JP2023149598A (ja) * 2022-03-31 2023-10-13 住友ベークライト株式会社 封止用樹脂組成物、および半導体パッケージの製造方法
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
CN120424471A (zh) * 2025-07-09 2025-08-05 天津德高化成光电科技有限责任公司 一种光学环氧树脂塑封料及其制备方法和应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076203A (ja) 2000-08-31 2002-03-15 Hitachi Chem Co Ltd ウエハレベルチップサイズパッケージ用の封止用成形材料及びウエハレベルチップサイズパッケージ
JP2004018786A (ja) 2002-06-19 2004-01-22 Kyocera Chemical Corp 封止用樹脂組成物および電子部品封止装置
JP2006176678A (ja) 2004-12-22 2006-07-06 Matsushita Electric Works Ltd エポキシ樹脂組成物及び電子部品
JP2007314702A (ja) 2006-05-26 2007-12-06 Matsushita Electric Works Ltd エポキシ樹脂組成物と樹脂封止半導体装置
JP2012162585A (ja) 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
JP2012224758A (ja) 2011-04-20 2012-11-15 Panasonic Corp エポキシ樹脂組成物及び半導体装置
WO2017030126A1 (ja) 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
WO2018221682A1 (ja) 2017-05-31 2018-12-06 日立化成株式会社 圧縮成型用液状樹脂組成物及び電子部品装置

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Publication number Priority date Publication date Assignee Title
JPS6189247A (ja) * 1984-10-08 1986-05-07 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS62210653A (ja) * 1986-03-11 1987-09-16 Nitto Electric Ind Co Ltd 半導体装置
JP3965511B2 (ja) * 1997-12-27 2007-08-29 ナガセケムテックス株式会社 光ディスク貼り合わせ用エポキシ樹脂接着剤
JPH11199651A (ja) * 1998-01-12 1999-07-27 Sumitomo Bakelite Co Ltd デバイス中空パッケージ封止用紫外線硬化型接着剤樹脂組成物
JP5965485B2 (ja) * 2011-08-31 2016-08-03 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー 計器用トランスフォーマーを封止するための疎水性エポキシ樹脂システムの使用
WO2017027482A1 (en) * 2015-08-08 2017-02-16 Designer Molecules, Inc. Anionic curable compositions
JP6597471B2 (ja) 2016-05-02 2019-10-30 信越化学工業株式会社 大面積の半導体素子搭載基材を封止する方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076203A (ja) 2000-08-31 2002-03-15 Hitachi Chem Co Ltd ウエハレベルチップサイズパッケージ用の封止用成形材料及びウエハレベルチップサイズパッケージ
JP2004018786A (ja) 2002-06-19 2004-01-22 Kyocera Chemical Corp 封止用樹脂組成物および電子部品封止装置
JP2006176678A (ja) 2004-12-22 2006-07-06 Matsushita Electric Works Ltd エポキシ樹脂組成物及び電子部品
JP2007314702A (ja) 2006-05-26 2007-12-06 Matsushita Electric Works Ltd エポキシ樹脂組成物と樹脂封止半導体装置
JP2012162585A (ja) 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
JP2012224758A (ja) 2011-04-20 2012-11-15 Panasonic Corp エポキシ樹脂組成物及び半導体装置
WO2017030126A1 (ja) 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
WO2018221682A1 (ja) 2017-05-31 2018-12-06 日立化成株式会社 圧縮成型用液状樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
JPWO2019146617A1 (ja) 2021-02-12
TWI862483B (zh) 2024-11-21
TW201936876A (zh) 2019-09-16
US11760870B2 (en) 2023-09-19
US20210054187A1 (en) 2021-02-25
WO2019146617A1 (ja) 2019-08-01

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