TWI862483B - 密封用樹脂組成物 - Google Patents

密封用樹脂組成物 Download PDF

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Publication number
TWI862483B
TWI862483B TW108102549A TW108102549A TWI862483B TW I862483 B TWI862483 B TW I862483B TW 108102549 A TW108102549 A TW 108102549A TW 108102549 A TW108102549 A TW 108102549A TW I862483 B TWI862483 B TW I862483B
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TW
Taiwan
Prior art keywords
resin composition
epoxy resin
sealing resin
mass
sealing
Prior art date
Application number
TW108102549A
Other languages
English (en)
Chinese (zh)
Other versions
TW201936876A (zh
Inventor
大井陽介
平岡崇志
Original Assignee
日商長瀬化成股份有限公司
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Application filed by 日商長瀬化成股份有限公司 filed Critical 日商長瀬化成股份有限公司
Publication of TW201936876A publication Critical patent/TW201936876A/zh
Application granted granted Critical
Publication of TWI862483B publication Critical patent/TWI862483B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
    • C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW108102549A 2018-01-23 2019-01-23 密封用樹脂組成物 TWI862483B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-008661 2018-01-23
JP2018008661 2018-01-23

Publications (2)

Publication Number Publication Date
TW201936876A TW201936876A (zh) 2019-09-16
TWI862483B true TWI862483B (zh) 2024-11-21

Family

ID=67395428

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102549A TWI862483B (zh) 2018-01-23 2019-01-23 密封用樹脂組成物

Country Status (4)

Country Link
US (1) US11760870B2 (https=)
JP (1) JP7420559B2 (https=)
TW (1) TWI862483B (https=)
WO (1) WO2019146617A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3620481B1 (en) 2017-05-31 2024-03-27 Resonac Corporation Liquid resin composition for sealing and electronic component apparatus
US12454612B2 (en) 2017-05-31 2025-10-28 Resonac Corporation Liquid resin composition for compression molding and electronic component apparatus
JP7302331B2 (ja) * 2019-06-26 2023-07-04 味の素株式会社 樹脂組成物
JP7302496B2 (ja) * 2020-02-05 2023-07-04 味の素株式会社 樹脂組成物
JP7849687B2 (ja) 2022-01-27 2026-04-22 エスケーハイニックス株式会社 Ｔｓｖ用モールドアンダーフィル組成物
JP2023149598A (ja) * 2022-03-31 2023-10-13 住友ベークライト株式会社 封止用樹脂組成物、および半導体パッケージの製造方法
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
CN120424471A (zh) * 2025-07-09 2025-08-05 天津德高化成光电科技有限责任公司 一种光学环氧树脂塑封料及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62210653A (ja) * 1986-03-11 1987-09-16 Nitto Electric Ind Co Ltd 半導体装置
JP2002076203A (ja) * 2000-08-31 2002-03-15 Hitachi Chem Co Ltd ウエハレベルチップサイズパッケージ用の封止用成形材料及びウエハレベルチップサイズパッケージ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189247A (ja) * 1984-10-08 1986-05-07 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JP3965511B2 (ja) * 1997-12-27 2007-08-29 ナガセケムテックス株式会社 光ディスク貼り合わせ用エポキシ樹脂接着剤
JPH11199651A (ja) * 1998-01-12 1999-07-27 Sumitomo Bakelite Co Ltd デバイス中空パッケージ封止用紫外線硬化型接着剤樹脂組成物
JP2004018786A (ja) * 2002-06-19 2004-01-22 Kyocera Chemical Corp 封止用樹脂組成物および電子部品封止装置
JP2006176678A (ja) 2004-12-22 2006-07-06 Matsushita Electric Works Ltd エポキシ樹脂組成物及び電子部品
JP2007314702A (ja) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd エポキシ樹脂組成物と樹脂封止半導体装置
JP2012162585A (ja) 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
JP2012224758A (ja) 2011-04-20 2012-11-15 Panasonic Corp エポキシ樹脂組成物及び半導体装置
JP5965485B2 (ja) * 2011-08-31 2016-08-03 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー 計器用トランスフォーマーを封止するための疎水性エポキシ樹脂システムの使用
WO2017027482A1 (en) * 2015-08-08 2017-02-16 Designer Molecules, Inc. Anionic curable compositions
WO2017030126A1 (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
JP6597471B2 (ja) 2016-05-02 2019-10-30 信越化学工業株式会社 大面積の半導体素子搭載基材を封止する方法
US12454612B2 (en) 2017-05-31 2025-10-28 Resonac Corporation Liquid resin composition for compression molding and electronic component apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62210653A (ja) * 1986-03-11 1987-09-16 Nitto Electric Ind Co Ltd 半導体装置
JP2002076203A (ja) * 2000-08-31 2002-03-15 Hitachi Chem Co Ltd ウエハレベルチップサイズパッケージ用の封止用成形材料及びウエハレベルチップサイズパッケージ

Also Published As

Publication number Publication date
JPWO2019146617A1 (ja) 2021-02-12
JP7420559B2 (ja) 2024-01-23
TW201936876A (zh) 2019-09-16
US11760870B2 (en) 2023-09-19
US20210054187A1 (en) 2021-02-25
WO2019146617A1 (ja) 2019-08-01

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