JPWO2019102557A1 - 窒化物半導体発光素子 - Google Patents
窒化物半導体発光素子 Download PDFInfo
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- JPWO2019102557A1 JPWO2019102557A1 JP2018551480A JP2018551480A JPWO2019102557A1 JP WO2019102557 A1 JPWO2019102557 A1 JP WO2019102557A1 JP 2018551480 A JP2018551480 A JP 2018551480A JP 2018551480 A JP2018551480 A JP 2018551480A JP WO2019102557 A1 JPWO2019102557 A1 JP WO2019102557A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 127
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 90
- 238000003475 lamination Methods 0.000 claims abstract description 3
- 238000000295 emission spectrum Methods 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 35
- 229910052594 sapphire Inorganic materials 0.000 claims description 34
- 239000010980 sapphire Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 12
- 229910002704 AlGaN Inorganic materials 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- 238000005253 cladding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000005204 segregation Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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Abstract
Description
最初に、本発明の実施形態に係る窒化物半導体発光素子の構造の一例について、図面を参照して説明する。図1は、本発明の実施形態に係る窒化物半導体発光素子の構造の一例を模式的に示した要部断面図である。図2は、図1に示す窒化物半導体発光素子を図1の上側から見た場合の構造の一例を模式的に示した平面図である。なお、図1では、図示の都合上、基板、窒化物半導体層及び電極の厚さ(図中の上下方向の長さ)を模式的に示しているため、必ずしも実際の寸法比とは一致しない。
次に、上述した活性層22について図面を参照して説明する。図4は、活性層の構造の一例を模式的に示した要部断面図である。
上述の実施形態では、サファイア基板11の主面11aに由来する多段状のテラスを利用して、井戸層22bの水平面内における厚さを変動させる場合について例示したが、他の方法で井戸層22bの水平面内における厚さを変動させてもよい。
10 下地部
11 サファイア基板
11a 主面
12 AlN層
20 発光素子構造部
21 n型クラッド層(n型層)
22 活性層
22a 障壁層
22b 井戸層
22b1 第1面
22b2 第2面
23 電子ブロック層(p型層)
24 p型コンタクト層(p型層)
25 p電極
26 n電極
A1〜A3 第1〜第3波長範囲
S1〜S4 発光スペクトル
T テラス
Claims (6)
- 少なくともn型層、活性層及びp型層を含む複数の窒化物半導体層を有する発光素子構造部を備え、
前記n型層及び前記p型層の間に配置される前記活性層は、GaN系半導体で構成された井戸層を少なくとも1つ含む量子井戸構造を有し、
前記井戸層は、前記n型層側の第1面と前記p型層側の第2面との間の最短距離が、前記窒化物半導体層の積層方向に対して垂直な平面内において変動しており、
前記発光素子構造部から出射される光のピーク発光波長が、354nmよりも短いことを特徴とする窒化物半導体発光素子。 - 前記発光素子構造部から出射される光の発光スペクトルが、339nm以上343nm未満の第1ピークと、343nm以上349nm未満の第2ピークと、349nm以上353nm以下の第3ピークと、の少なくとも2つが一体化されて成る合成ピークを有していることを特徴とする請求項1に記載の窒化物半導体発光素子。
- 前記合成ピークの半値全幅が10nm以下であることを特徴とする請求項2に記載の窒化物半導体発光素子。
- 前記発光スペクトルが、前記第1ピーク及び前記第2ピークが一体化されて成る前記合成ピークを有し、ピーク発光波長が343nm以上349nm未満であることを特徴とする請求項2または3に記載の窒化物半導体発光素子。
- 前記発光スペクトルが、前記発光素子構造部から出射される光の発光スペクトルが、339nm以上343nm未満の第1ピークと、343nm以上349nm未満の第2ピークと、349nm以上353nm以下の第3ピークと、の少なくとも2つを有していることを特徴とする請求項1に記載の窒化物半導体発光素子。
- サファイア基板を含む下地部を、さらに備え、
前記サファイア基板は、(0001)面に対して所定の角度だけ傾斜した主面を有し、当該主面の上方に前記発光素子構造部が形成されており、
少なくとも前記サファイア基板の前記主面から前記活性層の表面までの各層が、多段状のテラスが形成された表面を有するエピタキシャル成長層であることを特徴とする請求項1〜5のいずれか1項に記載の窒化物半導体発光素子。
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PCT/JP2017/042063 WO2019102557A1 (ja) | 2017-11-22 | 2017-11-22 | 窒化物半導体発光素子 |
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JPWO2019102557A1 true JPWO2019102557A1 (ja) | 2020-01-16 |
JP6686172B2 JP6686172B2 (ja) | 2020-04-22 |
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US (1) | US11152543B2 (ja) |
JP (1) | JP6686172B2 (ja) |
CN (1) | CN111373552B (ja) |
TW (1) | TWI707482B (ja) |
WO (1) | WO2019102557A1 (ja) |
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EP3754732B1 (en) * | 2018-02-14 | 2023-04-12 | Soko Kagaku Co., Ltd. | Nitride semiconductor ultraviolet light-emitting element |
US11552217B2 (en) | 2018-11-12 | 2023-01-10 | Epistar Corporation | Semiconductor device |
JP7406633B2 (ja) * | 2020-06-24 | 2023-12-27 | 日機装株式会社 | 窒化物半導体紫外線発光素子及びその製造方法 |
JP7406632B2 (ja) * | 2020-06-24 | 2023-12-27 | 日機装株式会社 | 窒化物半導体紫外線発光素子 |
CN115868033A (zh) | 2020-07-07 | 2023-03-28 | 创光科学株式会社 | 氮化物半导体紫外线发光元件及其制造方法 |
WO2022149183A1 (ja) * | 2021-01-05 | 2022-07-14 | 創光科学株式会社 | 窒化物半導体紫外線発光素子の製造方法、及び、窒化物半導体紫外線発光素子 |
Citations (6)
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JP2002033513A (ja) * | 2000-07-13 | 2002-01-31 | Shiro Sakai | 発光素子 |
JP2003086840A (ja) * | 2001-09-10 | 2003-03-20 | Mitsubishi Cable Ind Ltd | GaN系半導体発光ダイオード |
JP2006060164A (ja) * | 2004-08-24 | 2006-03-02 | National Institute Of Advanced Industrial & Technology | 窒化物半導体デバイスおよび窒化物半導体結晶成長方法 |
JP2012044120A (ja) * | 2010-08-23 | 2012-03-01 | Nippon Telegr & Teleph Corp <Ntt> | Iii族窒化物半導体の深紫外発光素子構造 |
US20160064598A1 (en) * | 2013-04-12 | 2016-03-03 | Seoul Viosys Co., Ltd. | Ultraviolet light-emitting device |
JP6194138B2 (ja) * | 2015-07-21 | 2017-09-06 | 創光科学株式会社 | 窒化物半導体紫外線発光素子 |
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JP3719047B2 (ja) | 1999-06-07 | 2005-11-24 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP4937599B2 (ja) * | 2005-02-14 | 2012-05-23 | 昭和電工株式会社 | 窒化物半導体発光素子及びその製造方法 |
JP2007281140A (ja) * | 2006-04-05 | 2007-10-25 | Hamamatsu Photonics Kk | 化合物半導体基板、その製造方法及び半導体デバイス |
JP5995302B2 (ja) * | 2011-07-05 | 2016-09-21 | パナソニック株式会社 | 窒化物半導体発光素子の製造方法 |
WO2013021464A1 (ja) * | 2011-08-09 | 2013-02-14 | 創光科学株式会社 | 窒化物半導体紫外線発光素子 |
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EP3432369A4 (en) * | 2017-05-26 | 2019-08-28 | Soko Kagaku Co., Ltd. | MODEL, ULTRAVIOLET SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND METHOD FOR PRODUCING THE MODEL |
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- 2017-11-22 CN CN201780097121.4A patent/CN111373552B/zh active Active
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- 2017-11-22 US US16/761,090 patent/US11152543B2/en active Active
- 2017-11-22 WO PCT/JP2017/042063 patent/WO2019102557A1/ja active Application Filing
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Patent Citations (6)
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JP2002033513A (ja) * | 2000-07-13 | 2002-01-31 | Shiro Sakai | 発光素子 |
JP2003086840A (ja) * | 2001-09-10 | 2003-03-20 | Mitsubishi Cable Ind Ltd | GaN系半導体発光ダイオード |
JP2006060164A (ja) * | 2004-08-24 | 2006-03-02 | National Institute Of Advanced Industrial & Technology | 窒化物半導体デバイスおよび窒化物半導体結晶成長方法 |
JP2012044120A (ja) * | 2010-08-23 | 2012-03-01 | Nippon Telegr & Teleph Corp <Ntt> | Iii族窒化物半導体の深紫外発光素子構造 |
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JP6194138B2 (ja) * | 2015-07-21 | 2017-09-06 | 創光科学株式会社 | 窒化物半導体紫外線発光素子 |
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CN111373552B (zh) | 2023-09-05 |
WO2019102557A1 (ja) | 2019-05-31 |
TW201937753A (zh) | 2019-09-16 |
US20200357953A1 (en) | 2020-11-12 |
US11152543B2 (en) | 2021-10-19 |
JP6686172B2 (ja) | 2020-04-22 |
CN111373552A (zh) | 2020-07-03 |
TWI707482B (zh) | 2020-10-11 |
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