JPWO2019065725A1 - 電子素子搭載用基板および電子装置 - Google Patents
電子素子搭載用基板および電子装置 Download PDFInfo
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- JPWO2019065725A1 JPWO2019065725A1 JP2019545561A JP2019545561A JPWO2019065725A1 JP WO2019065725 A1 JPWO2019065725 A1 JP WO2019065725A1 JP 2019545561 A JP2019545561 A JP 2019545561A JP 2019545561 A JP2019545561 A JP 2019545561A JP WO2019065725 A1 JPWO2019065725 A1 JP WO2019065725A1
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Abstract
Description
第1の実施形態における電子素子搭載用基板1は、図1〜図4に示された例のように、第1基板11と凹部12aを含む第2基板12とを含んでいる。電子装置は、電子素子等用基板1と、電子素子搭載用基板の搭載部11aに搭載された電子素子2とを含んでいる。
次に、第2の実施形態による電子素子搭載用基板について、図5〜図7を参照しつつ説明する。
次に、第3の実施形態による電子装置について、図8〜図10を参照しつつ説明する。
Claims (5)
- 第1主面を有し、該第1主面に位置した電子素子の搭載部を有した矩形状である第1基板と、
前記第1主面と相対する第2主面に位置し、炭素材料からなり、矩形状であって、前記第2主面と対向する第3主面および該第3主面と相対する第4主面を有し、
平面透視において、前記第3主面または前記第4主面が、長手方向の熱伝導が長手方向に垂直に交わる方向の熱伝導より大きく、
前記第4主面に凹部を含む第2基板とを備えていることを特徴とする電子素子搭載用基板。 - 平面透視において、前記凹部は前記搭載部と重なっていることを特徴とする請求項1に記載の電子素子搭載用基板。
- 前記第4主面に位置し、矩形状であって、前記第4主面と相対する第5主面および該第5主面と相対する第6主面を有しており、
前記凹部と相対する、厚み方向に貫通する貫通孔を有した第3基板を備えていることを特徴とする請求項1または請求項2に記載の電子素子搭載用基板。 - 平面透視において、前記貫通孔は前記搭載部と重なっていることを特徴とする請求項3に記載の電子素子搭載用基板。
- 請求項1乃至請求項4のいずれかに記載の電子素子搭載用基板と、
該電子素子搭載用基板の前記搭載部に搭載された電子素子と、
前記凹部に位置した伝熱体とを有していることを特徴とする電子装置。
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CN111108594B (zh) | 2017-09-28 | 2024-03-19 | 京瓷株式会社 | 电子元件搭载用基板及电子装置 |
CN113079626A (zh) * | 2021-03-18 | 2021-07-06 | 扬州国宇电子有限公司 | 一种陶瓷基板薄膜电路结构及其制备方法 |
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