JPWO2018178634A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2018178634A5
JPWO2018178634A5 JP2019553547A JP2019553547A JPWO2018178634A5 JP WO2018178634 A5 JPWO2018178634 A5 JP WO2018178634A5 JP 2019553547 A JP2019553547 A JP 2019553547A JP 2019553547 A JP2019553547 A JP 2019553547A JP WO2018178634 A5 JPWO2018178634 A5 JP WO2018178634A5
Authority
JP
Japan
Prior art keywords
dimensional material
support layer
target substrate
strain
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019553547A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020520788A (ja
JP7168991B2 (ja
JP2020520788A5 (https=
Publication date
Priority claimed from GBGB1704950.3A external-priority patent/GB201704950D0/en
Application filed filed Critical
Publication of JP2020520788A publication Critical patent/JP2020520788A/ja
Publication of JPWO2018178634A5 publication Critical patent/JPWO2018178634A5/ja
Publication of JP2020520788A5 publication Critical patent/JP2020520788A5/ja
Application granted granted Critical
Publication of JP7168991B2 publication Critical patent/JP7168991B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019553547A 2017-03-28 2018-03-21 薄膜材料の転写方法 Active JP7168991B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1704950.3A GB201704950D0 (en) 2017-03-28 2017-03-28 Thin film material transfer method
GB1704950.3 2017-03-28
PCT/GB2018/050733 WO2018178634A1 (en) 2017-03-28 2018-03-21 Thin film material transfer method

Publications (4)

Publication Number Publication Date
JP2020520788A JP2020520788A (ja) 2020-07-16
JPWO2018178634A5 true JPWO2018178634A5 (https=) 2022-09-01
JP2020520788A5 JP2020520788A5 (https=) 2022-09-01
JP7168991B2 JP7168991B2 (ja) 2022-11-10

Family

ID=58688006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019553547A Active JP7168991B2 (ja) 2017-03-28 2018-03-21 薄膜材料の転写方法

Country Status (7)

Country Link
US (1) US11180367B2 (https=)
EP (1) EP3601153B1 (https=)
JP (1) JP7168991B2 (https=)
KR (2) KR20190129057A (https=)
CN (1) CN110461764B (https=)
GB (1) GB201704950D0 (https=)
WO (1) WO2018178634A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110174197A (zh) * 2019-05-28 2019-08-27 北京旭碳新材料科技有限公司 石墨烯基压阻式压力传感器及其制备方法
CN111537116B (zh) * 2020-05-08 2021-01-29 西安交通大学 一种石墨烯压力传感器及其制备方法
CN111952322B (zh) * 2020-08-14 2022-06-03 电子科技大学 一种具有周期可调屈曲结构的柔性半导体薄膜及制备方法
CN112349610B (zh) * 2020-10-10 2022-07-01 广东工业大学 一种人工控制单层ws2面内各向异性的方法
CN112357878B (zh) * 2020-11-23 2024-04-19 华东师范大学 一种二维材料电子器件及其制备方法和应用
CN112964404B (zh) * 2021-02-02 2022-08-19 武汉纺织大学 一种一致性强的用于智能织物的微型压力传感装置
GB2603905B (en) * 2021-02-17 2023-12-13 Paragraf Ltd A method for the manufacture of an improved graphene substrate and applications therefor
CN112978711B (zh) * 2021-03-23 2022-07-22 北京科技大学 一种大面积转移石墨炔薄膜的方法
CN113441094B (zh) * 2021-05-21 2023-06-20 安徽大学 一种硼烯-石墨烯复合气凝胶及制备与应用
EP4105168B1 (en) * 2021-06-18 2025-01-22 Eberhard Karls Universität Tübingen Method for forming a three-dimensional van-der-waals multilayer structure by stacking two-dimensional layers and structure formed by this method
CN113264522B (zh) * 2021-06-21 2022-08-23 松山湖材料实验室 一种二维材料的转移方法
CN114497238B (zh) * 2022-01-17 2025-11-21 青岛科技大学 一种二维原子层材料应变场控制方法
WO2023183526A1 (en) * 2022-03-24 2023-09-28 Massachusetts Institute Of Technology Controlled delamination through surface engineering for nonplanar fabrication
CN114858319B (zh) * 2022-04-26 2023-03-24 中国科学院上海微系统与信息技术研究所 一种拉力传感器的制备方法及拉力传感器
US12391570B2 (en) 2022-05-23 2025-08-19 City University Of Hong Kong Methods of the ultra-clean transfer of two-dimensional materials
CN115140705B (zh) * 2022-07-04 2024-08-16 中国人民解放军国防科技大学 一种二维材料悬空释放装置及方法
CN116750711B (zh) * 2023-08-01 2025-12-09 莱斯能特(苏州)科技有限公司 Mems热膜式流量传感器芯片及其制备方法
CN118183615B (zh) * 2024-03-07 2024-09-10 中国矿业大学 一种二维材料表面褶皱阵列结构的制备方法
CN118670596B (zh) * 2024-08-21 2024-11-12 辽宁意达石油工程有限公司 一种高灵敏度柔性压力传感器及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940016A (en) * 1974-07-25 1976-02-24 Merrill Krakauer Article vending apparatus with door interlock
JP4223678B2 (ja) * 2000-12-28 2009-02-12 株式会社トンボ鉛筆 塗膜転写用テープ、およびそれを装着してなる塗膜転写具
CN102079505B (zh) * 2009-12-01 2013-09-04 中国科学院合肥物质科学研究院 二维空心球有序结构阵列及其制备方法
CN102519657B (zh) * 2011-11-22 2013-12-11 上海交通大学 二维矢量柔性热敏微剪切应力传感器及其阵列和制备方法
US8593783B2 (en) * 2012-02-16 2013-11-26 Elwha Llc Graphene mounted on aerogel
CN103364120A (zh) * 2012-04-10 2013-10-23 中国科学院电子学研究所 银锡共晶真空键合金属应变式mems压力传感器及其制造方法
ITTO20120516A1 (it) * 2012-06-14 2013-12-15 St Microelectronics Srl Metodo di fabbricazione di un sensore elettrochimico basato su grafene e sensore elettrochimico
CN103308498B (zh) * 2013-05-14 2015-09-16 中国科学院物理研究所 一种用于二维层状纳米材料的方向可控单轴应变施加装置
KR20150101039A (ko) * 2014-02-25 2015-09-03 코오롱패션머티리얼 (주) 다공성 지지체, 이의 제조방법, 및 이를 포함하는 강화막
JP6425941B2 (ja) * 2014-08-11 2018-11-21 国立研究開発法人産業技術総合研究所 電子デバイス及び電子デバイスの製造方法
JP2016138794A (ja) * 2015-01-27 2016-08-04 セイコーエプソン株式会社 電子デバイス、電子デバイスの製造方法、圧力センサー、振動子、高度計、電子機器および移動体
CN105115413B (zh) * 2015-07-07 2018-06-05 浙江工商大学 一种模量匹配的二维平面应变场测试传感元件及其制作方法
GB201519620D0 (en) 2015-11-06 2015-12-23 Univ Manchester Device and method of fabricating such a device
AU2017379071B2 (en) * 2016-12-22 2022-09-22 Board Of Trustees Of The University Of Arkansas Energy harvesting devices and sensors, and methods of making and use thereof

Similar Documents

Publication Publication Date Title
JP2020520788A5 (https=)
JPWO2018178634A5 (https=)
CN110461764B (zh) 薄膜材料转移方法
US10192736B2 (en) Method for transferring graphene by attaching removable frame to protective layer applied on a sample containing graphene monolayer
JP2012508906A5 (https=)
WO2007024711A3 (en) Oscillator and method of making for atomic force microscope and other applications
WO2007126919A3 (en) Non-planar surface structures and process for microelectromechanical systems
WO2007126844A3 (en) Non-planar surface structures and process for microelectromechanical systems
JP2012500089A5 (https=)
WO2008124372A3 (en) Eliminate release etch attack by interface modification in sacrificial layers
DE10323302A1 (de) Vakuumunterstützte adhäsive Haltevorrichtung für Dünnstglas
WO2008051351A3 (en) Sacrificial spacer process and resultant structure for mems support structure
KR20120037874A (ko) 실리콘 및 글래스 기판의 분자 결합 방법
WO2011114484A1 (ja) 樹脂フィルムの被覆方法及び被覆装置
WO2017222796A3 (en) Systems and methods for fabricating single-crystalline diamond membranes
WO2009024762A3 (en) Mems process and device
WO2008039372A3 (en) Assembling and applying nano-electro-mechanical systems
WO2010012966A3 (fr) Procede et dispositif d'encapsulation de microstructures
FR2968241B1 (fr) Procede de fabrication d'un article permettant l'apposition d'un film
Yamashita et al. Diaphragm deflection control of piezoelectric ultrasonic microsensors for sensitivity improvement
KR101350241B1 (ko) 표면 패턴 제조 방법 및 이를 이용하여 제조된 초소수성 부재
WO2008095526A3 (de) Verfahren zum aufbringen einer struktur auf ein halbleiterbauelement
US10395954B2 (en) Method and device for coating a product substrate
KR20150023507A (ko) 금속/금속 결합을 가지는 복합 구조체의 생산방법
JP6469070B2 (ja) 第１の基板を第２の基板から剥離する方法および可撓性の基板保持装置の使用