GB201704950D0 - Thin film material transfer method - Google Patents

Thin film material transfer method

Info

Publication number
GB201704950D0
GB201704950D0 GBGB1704950.3A GB201704950A GB201704950D0 GB 201704950 D0 GB201704950 D0 GB 201704950D0 GB 201704950 A GB201704950 A GB 201704950A GB 201704950 D0 GB201704950 D0 GB 201704950D0
Authority
GB
United Kingdom
Prior art keywords
thin film
film material
transfer method
material transfer
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1704950.3A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Manchester
Original Assignee
University of Manchester
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Manchester filed Critical University of Manchester
Priority to GBGB1704950.3A priority Critical patent/GB201704950D0/en
Publication of GB201704950D0 publication Critical patent/GB201704950D0/en
Priority to KR1020197028242A priority patent/KR20190129057A/ko
Priority to JP2019553547A priority patent/JP7168991B2/ja
Priority to US16/498,596 priority patent/US11180367B2/en
Priority to KR1020237027420A priority patent/KR102689459B1/ko
Priority to PCT/GB2018/050733 priority patent/WO2018178634A1/en
Priority to EP18715072.7A priority patent/EP3601153B1/en
Priority to CN201880021060.8A priority patent/CN110461764B/zh
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0013—Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00952—Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/017—Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • B81C2201/0194—Transfer of a layer from a carrier wafer to a device wafer the layer being structured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Micromachines (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
GBGB1704950.3A 2017-03-28 2017-03-28 Thin film material transfer method Ceased GB201704950D0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GBGB1704950.3A GB201704950D0 (en) 2017-03-28 2017-03-28 Thin film material transfer method
KR1020197028242A KR20190129057A (ko) 2017-03-28 2018-03-21 박막 재료 전달 방법
JP2019553547A JP7168991B2 (ja) 2017-03-28 2018-03-21 薄膜材料の転写方法
US16/498,596 US11180367B2 (en) 2017-03-28 2018-03-21 Thin film material transfer method
KR1020237027420A KR102689459B1 (ko) 2017-03-28 2018-03-21 박막 재료 전달 방법
PCT/GB2018/050733 WO2018178634A1 (en) 2017-03-28 2018-03-21 Thin film material transfer method
EP18715072.7A EP3601153B1 (en) 2017-03-28 2018-03-21 Thin film material transfer method
CN201880021060.8A CN110461764B (zh) 2017-03-28 2018-03-21 薄膜材料转移方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1704950.3A GB201704950D0 (en) 2017-03-28 2017-03-28 Thin film material transfer method

Publications (1)

Publication Number Publication Date
GB201704950D0 true GB201704950D0 (en) 2017-05-10

Family

ID=58688006

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1704950.3A Ceased GB201704950D0 (en) 2017-03-28 2017-03-28 Thin film material transfer method

Country Status (7)

Country Link
US (1) US11180367B2 (https=)
EP (1) EP3601153B1 (https=)
JP (1) JP7168991B2 (https=)
KR (2) KR20190129057A (https=)
CN (1) CN110461764B (https=)
GB (1) GB201704950D0 (https=)
WO (1) WO2018178634A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116750711A (zh) * 2023-08-01 2023-09-15 莱斯能特(苏州)科技有限公司 Mems热膜式流量传感器芯片及其制备方法

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CN110174197A (zh) * 2019-05-28 2019-08-27 北京旭碳新材料科技有限公司 石墨烯基压阻式压力传感器及其制备方法
CN111537116B (zh) * 2020-05-08 2021-01-29 西安交通大学 一种石墨烯压力传感器及其制备方法
CN111952322B (zh) * 2020-08-14 2022-06-03 电子科技大学 一种具有周期可调屈曲结构的柔性半导体薄膜及制备方法
CN112349610B (zh) * 2020-10-10 2022-07-01 广东工业大学 一种人工控制单层ws2面内各向异性的方法
CN112357878B (zh) * 2020-11-23 2024-04-19 华东师范大学 一种二维材料电子器件及其制备方法和应用
CN112964404B (zh) * 2021-02-02 2022-08-19 武汉纺织大学 一种一致性强的用于智能织物的微型压力传感装置
GB2603905B (en) * 2021-02-17 2023-12-13 Paragraf Ltd A method for the manufacture of an improved graphene substrate and applications therefor
CN112978711B (zh) * 2021-03-23 2022-07-22 北京科技大学 一种大面积转移石墨炔薄膜的方法
CN113441094B (zh) * 2021-05-21 2023-06-20 安徽大学 一种硼烯-石墨烯复合气凝胶及制备与应用
EP4105168B1 (en) * 2021-06-18 2025-01-22 Eberhard Karls Universität Tübingen Method for forming a three-dimensional van-der-waals multilayer structure by stacking two-dimensional layers and structure formed by this method
CN113264522B (zh) * 2021-06-21 2022-08-23 松山湖材料实验室 一种二维材料的转移方法
CN114497238B (zh) * 2022-01-17 2025-11-21 青岛科技大学 一种二维原子层材料应变场控制方法
WO2023183526A1 (en) * 2022-03-24 2023-09-28 Massachusetts Institute Of Technology Controlled delamination through surface engineering for nonplanar fabrication
CN114858319B (zh) * 2022-04-26 2023-03-24 中国科学院上海微系统与信息技术研究所 一种拉力传感器的制备方法及拉力传感器
US12391570B2 (en) 2022-05-23 2025-08-19 City University Of Hong Kong Methods of the ultra-clean transfer of two-dimensional materials
CN115140705B (zh) * 2022-07-04 2024-08-16 中国人民解放军国防科技大学 一种二维材料悬空释放装置及方法
CN118183615B (zh) * 2024-03-07 2024-09-10 中国矿业大学 一种二维材料表面褶皱阵列结构的制备方法
CN118670596B (zh) * 2024-08-21 2024-11-12 辽宁意达石油工程有限公司 一种高灵敏度柔性压力传感器及其制备方法

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JP4223678B2 (ja) * 2000-12-28 2009-02-12 株式会社トンボ鉛筆 塗膜転写用テープ、およびそれを装着してなる塗膜転写具
CN102079505B (zh) * 2009-12-01 2013-09-04 中国科学院合肥物质科学研究院 二维空心球有序结构阵列及其制备方法
CN102519657B (zh) * 2011-11-22 2013-12-11 上海交通大学 二维矢量柔性热敏微剪切应力传感器及其阵列和制备方法
US8593783B2 (en) * 2012-02-16 2013-11-26 Elwha Llc Graphene mounted on aerogel
CN103364120A (zh) * 2012-04-10 2013-10-23 中国科学院电子学研究所 银锡共晶真空键合金属应变式mems压力传感器及其制造方法
ITTO20120516A1 (it) * 2012-06-14 2013-12-15 St Microelectronics Srl Metodo di fabbricazione di un sensore elettrochimico basato su grafene e sensore elettrochimico
CN103308498B (zh) * 2013-05-14 2015-09-16 中国科学院物理研究所 一种用于二维层状纳米材料的方向可控单轴应变施加装置
KR20150101039A (ko) * 2014-02-25 2015-09-03 코오롱패션머티리얼 (주) 다공성 지지체, 이의 제조방법, 및 이를 포함하는 강화막
JP6425941B2 (ja) * 2014-08-11 2018-11-21 国立研究開発法人産業技術総合研究所 電子デバイス及び電子デバイスの製造方法
JP2016138794A (ja) * 2015-01-27 2016-08-04 セイコーエプソン株式会社 電子デバイス、電子デバイスの製造方法、圧力センサー、振動子、高度計、電子機器および移動体
CN105115413B (zh) * 2015-07-07 2018-06-05 浙江工商大学 一种模量匹配的二维平面应变场测试传感元件及其制作方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116750711A (zh) * 2023-08-01 2023-09-15 莱斯能特(苏州)科技有限公司 Mems热膜式流量传感器芯片及其制备方法

Also Published As

Publication number Publication date
JP2020520788A (ja) 2020-07-16
KR102689459B1 (ko) 2024-07-26
US11180367B2 (en) 2021-11-23
KR20230124101A (ko) 2023-08-24
JP7168991B2 (ja) 2022-11-10
CN110461764B (zh) 2023-11-24
EP3601153B1 (en) 2024-09-04
CN110461764A (zh) 2019-11-15
EP3601153A1 (en) 2020-02-05
WO2018178634A1 (en) 2018-10-04
US20200048082A1 (en) 2020-02-13
KR20190129057A (ko) 2019-11-19

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)