JP7168991B2 - 薄膜材料の転写方法 - Google Patents
薄膜材料の転写方法 Download PDFInfo
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- JP7168991B2 JP7168991B2 JP2019553547A JP2019553547A JP7168991B2 JP 7168991 B2 JP7168991 B2 JP 7168991B2 JP 2019553547 A JP2019553547 A JP 2019553547A JP 2019553547 A JP2019553547 A JP 2019553547A JP 7168991 B2 JP7168991 B2 JP 7168991B2
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
- B81B3/0013—Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
- B81C1/00952—Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0161—Controlling physical properties of the material
- B81C2201/0163—Controlling internal stress of deposited layers
- B81C2201/017—Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
- B81C2201/0194—Transfer of a layer from a carrier wafer to a device wafer the layer being structured
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Carbon And Carbon Compounds (AREA)
- Micromachines (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1704950.3A GB201704950D0 (en) | 2017-03-28 | 2017-03-28 | Thin film material transfer method |
| GB1704950.3 | 2017-03-28 | ||
| PCT/GB2018/050733 WO2018178634A1 (en) | 2017-03-28 | 2018-03-21 | Thin film material transfer method |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2020520788A JP2020520788A (ja) | 2020-07-16 |
| JPWO2018178634A5 JPWO2018178634A5 (https=) | 2022-09-01 |
| JP2020520788A5 JP2020520788A5 (https=) | 2022-09-01 |
| JP7168991B2 true JP7168991B2 (ja) | 2022-11-10 |
Family
ID=58688006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019553547A Active JP7168991B2 (ja) | 2017-03-28 | 2018-03-21 | 薄膜材料の転写方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11180367B2 (https=) |
| EP (1) | EP3601153B1 (https=) |
| JP (1) | JP7168991B2 (https=) |
| KR (2) | KR20190129057A (https=) |
| CN (1) | CN110461764B (https=) |
| GB (1) | GB201704950D0 (https=) |
| WO (1) | WO2018178634A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110174197A (zh) * | 2019-05-28 | 2019-08-27 | 北京旭碳新材料科技有限公司 | 石墨烯基压阻式压力传感器及其制备方法 |
| CN111537116B (zh) * | 2020-05-08 | 2021-01-29 | 西安交通大学 | 一种石墨烯压力传感器及其制备方法 |
| CN111952322B (zh) * | 2020-08-14 | 2022-06-03 | 电子科技大学 | 一种具有周期可调屈曲结构的柔性半导体薄膜及制备方法 |
| CN112349610B (zh) * | 2020-10-10 | 2022-07-01 | 广东工业大学 | 一种人工控制单层ws2面内各向异性的方法 |
| CN112357878B (zh) * | 2020-11-23 | 2024-04-19 | 华东师范大学 | 一种二维材料电子器件及其制备方法和应用 |
| CN112964404B (zh) * | 2021-02-02 | 2022-08-19 | 武汉纺织大学 | 一种一致性强的用于智能织物的微型压力传感装置 |
| GB2603905B (en) * | 2021-02-17 | 2023-12-13 | Paragraf Ltd | A method for the manufacture of an improved graphene substrate and applications therefor |
| CN112978711B (zh) * | 2021-03-23 | 2022-07-22 | 北京科技大学 | 一种大面积转移石墨炔薄膜的方法 |
| CN113441094B (zh) * | 2021-05-21 | 2023-06-20 | 安徽大学 | 一种硼烯-石墨烯复合气凝胶及制备与应用 |
| EP4105168B1 (en) * | 2021-06-18 | 2025-01-22 | Eberhard Karls Universität Tübingen | Method for forming a three-dimensional van-der-waals multilayer structure by stacking two-dimensional layers and structure formed by this method |
| CN113264522B (zh) * | 2021-06-21 | 2022-08-23 | 松山湖材料实验室 | 一种二维材料的转移方法 |
| CN114497238B (zh) * | 2022-01-17 | 2025-11-21 | 青岛科技大学 | 一种二维原子层材料应变场控制方法 |
| WO2023183526A1 (en) * | 2022-03-24 | 2023-09-28 | Massachusetts Institute Of Technology | Controlled delamination through surface engineering for nonplanar fabrication |
| CN114858319B (zh) * | 2022-04-26 | 2023-03-24 | 中国科学院上海微系统与信息技术研究所 | 一种拉力传感器的制备方法及拉力传感器 |
| US12391570B2 (en) | 2022-05-23 | 2025-08-19 | City University Of Hong Kong | Methods of the ultra-clean transfer of two-dimensional materials |
| CN115140705B (zh) * | 2022-07-04 | 2024-08-16 | 中国人民解放军国防科技大学 | 一种二维材料悬空释放装置及方法 |
| CN116750711B (zh) * | 2023-08-01 | 2025-12-09 | 莱斯能特(苏州)科技有限公司 | Mems热膜式流量传感器芯片及其制备方法 |
| CN118183615B (zh) * | 2024-03-07 | 2024-09-10 | 中国矿业大学 | 一种二维材料表面褶皱阵列结构的制备方法 |
| CN118670596B (zh) * | 2024-08-21 | 2024-11-12 | 辽宁意达石油工程有限公司 | 一种高灵敏度柔性压力传感器及其制备方法 |
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| JP2002200891A (ja) | 2000-12-28 | 2002-07-16 | Tombow Pencil Co Ltd | 塗膜転写用テープ、およびそれを装着してなる塗膜転写具 |
| US20130215551A1 (en) | 2012-02-16 | 2013-08-22 | Elwha Llc | Graphene mounted on aerogel |
| US20130334579A1 (en) | 2012-06-14 | 2013-12-19 | Stmicroelectronics S.R.L. | Manufacturing method of a graphene-based electrochemical sensor, and electrochemical sensor |
| JP2016039343A (ja) | 2014-08-11 | 2016-03-22 | 国立研究開発法人産業技術総合研究所 | 電子デバイス及びその製造方法 |
| JP2016138794A (ja) | 2015-01-27 | 2016-08-04 | セイコーエプソン株式会社 | 電子デバイス、電子デバイスの製造方法、圧力センサー、振動子、高度計、電子機器および移動体 |
| JP2018533488A (ja) | 2015-11-06 | 2018-11-15 | ザ・ユニバーシティ・オブ・マンチェスターＴｈｅ Ｕｎｉｖｅｒｓｉｔｙ Ｏｆ Ｍａｎｃｈｅｓｔｅｒ | デバイス及びかかるデバイスを製作する方法 |
| JP2020516211A (ja) | 2016-12-22 | 2020-05-28 | ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ アーカンソー | エネルギー採取装置及びセンサならびにそれらの製造及び使用方法 |
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| US3940016A (en) * | 1974-07-25 | 1976-02-24 | Merrill Krakauer | Article vending apparatus with door interlock |
| CN102079505B (zh) * | 2009-12-01 | 2013-09-04 | 中国科学院合肥物质科学研究院 | 二维空心球有序结构阵列及其制备方法 |
| CN102519657B (zh) * | 2011-11-22 | 2013-12-11 | 上海交通大学 | 二维矢量柔性热敏微剪切应力传感器及其阵列和制备方法 |
| CN103364120A (zh) * | 2012-04-10 | 2013-10-23 | 中国科学院电子学研究所 | 银锡共晶真空键合金属应变式mems压力传感器及其制造方法 |
| CN103308498B (zh) * | 2013-05-14 | 2015-09-16 | 中国科学院物理研究所 | 一种用于二维层状纳米材料的方向可控单轴应变施加装置 |
| KR20150101039A (ko) * | 2014-02-25 | 2015-09-03 | 코오롱패션머티리얼 (주) | 다공성 지지체, 이의 제조방법, 및 이를 포함하는 강화막 |
| CN105115413B (zh) * | 2015-07-07 | 2018-06-05 | 浙江工商大学 | 一种模量匹配的二维平面应变场测试传感元件及其制作方法 |
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| JP2002200891A (ja) | 2000-12-28 | 2002-07-16 | Tombow Pencil Co Ltd | 塗膜転写用テープ、およびそれを装着してなる塗膜転写具 |
| US20130215551A1 (en) | 2012-02-16 | 2013-08-22 | Elwha Llc | Graphene mounted on aerogel |
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| JP2016138794A (ja) | 2015-01-27 | 2016-08-04 | セイコーエプソン株式会社 | 電子デバイス、電子デバイスの製造方法、圧力センサー、振動子、高度計、電子機器および移動体 |
| JP2018533488A (ja) | 2015-11-06 | 2018-11-15 | ザ・ユニバーシティ・オブ・マンチェスターＴｈｅ Ｕｎｉｖｅｒｓｉｔｙ Ｏｆ Ｍａｎｃｈｅｓｔｅｒ | デバイス及びかかるデバイスを製作する方法 |
| JP2020516211A (ja) | 2016-12-22 | 2020-05-28 | ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ アーカンソー | エネルギー採取装置及びセンサならびにそれらの製造及び使用方法 |
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| GB201704950D0 (en) | 2017-05-10 |
| KR102689459B1 (ko) | 2024-07-26 |
| US11180367B2 (en) | 2021-11-23 |
| KR20230124101A (ko) | 2023-08-24 |
| CN110461764B (zh) | 2023-11-24 |
| EP3601153B1 (en) | 2024-09-04 |
| CN110461764A (zh) | 2019-11-15 |
| EP3601153A1 (en) | 2020-02-05 |
| WO2018178634A1 (en) | 2018-10-04 |
| US20200048082A1 (en) | 2020-02-13 |
| KR20190129057A (ko) | 2019-11-19 |
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