WO2010012966A3 - Procede et dispositif d'encapsulation de microstructures - Google Patents
Procede et dispositif d'encapsulation de microstructures Download PDFInfo
- Publication number
- WO2010012966A3 WO2010012966A3 PCT/FR2009/051544 FR2009051544W WO2010012966A3 WO 2010012966 A3 WO2010012966 A3 WO 2010012966A3 FR 2009051544 W FR2009051544 W FR 2009051544W WO 2010012966 A3 WO2010012966 A3 WO 2010012966A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mould
- cover
- encapsulating
- carrier substrate
- catching layer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0127—Using a carrier for applying a plurality of packaging lids to the system wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Pressure Sensors (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/056,796 US8617413B2 (en) | 2008-08-01 | 2009-07-31 | Method and device for encapsulating microstructures |
JP2011520573A JP2011529798A (ja) | 2008-08-01 | 2009-07-31 | マイクロ構造体を封入する方法及びデバイス |
EP09740426A EP2321216A2 (fr) | 2008-08-01 | 2009-07-31 | Procede et dispositif d'encapsulation de microstructures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0855357 | 2008-08-01 | ||
FR0855357A FR2934580B1 (fr) | 2008-08-01 | 2008-08-01 | Procede et dispositif d'encapsulation de microstructures |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010012966A2 WO2010012966A2 (fr) | 2010-02-04 |
WO2010012966A3 true WO2010012966A3 (fr) | 2010-03-25 |
Family
ID=40482048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2009/051544 WO2010012966A2 (fr) | 2008-08-01 | 2009-07-31 | Procede et dispositif d'encapsulation de microstructures |
Country Status (5)
Country | Link |
---|---|
US (1) | US8617413B2 (fr) |
EP (1) | EP2321216A2 (fr) |
JP (1) | JP2011529798A (fr) |
FR (1) | FR2934580B1 (fr) |
WO (1) | WO2010012966A2 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2934709B1 (fr) * | 2008-08-01 | 2010-09-10 | Commissariat Energie Atomique | Structure d'echange thermique et dispositif de refroidissement comportant une telle structure. |
FR2968647A1 (fr) * | 2010-12-08 | 2012-06-15 | Kfm Technology | Circuit comportant un composant recouvert d'un capot, procede pour realiser un tel circuit et dispositif pour la mise en oeuvre dudit procede |
US8790946B2 (en) | 2012-02-02 | 2014-07-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of bonding caps for MEMS devices |
US9513346B2 (en) * | 2014-01-07 | 2016-12-06 | Invensense, Inc. | Magnetic sensors with permanent magnets magnetized in different directions |
FR3008965B1 (fr) | 2013-07-26 | 2017-03-03 | Commissariat Energie Atomique | Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter |
DE102014202220B3 (de) * | 2013-12-03 | 2015-05-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines Deckelsubstrats und gehäustes strahlungsemittierendes Bauelement |
EP3450391A1 (fr) * | 2017-08-28 | 2019-03-06 | Indigo Diabetes N.V. | Encapsulation de dispositif de détection |
KR102074456B1 (ko) * | 2017-10-16 | 2020-02-06 | 전성욱 | 반도체 패키지의 제조방법 |
EP3578293A1 (fr) * | 2018-06-08 | 2019-12-11 | Nitto Belgium NV | Procédé permettant de fixer un élément sur une pièce à l'aide d'un outil d'application et outil d'application à utiliser dans le procédé |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070231943A1 (en) * | 2006-03-21 | 2007-10-04 | Dalsa Semiconductor Inc. | Protection capsule for mems devices |
US20080061458A1 (en) * | 2006-09-07 | 2008-03-13 | Samsung Electro-Mechanics Co., Ltd | Mold for forming lens of light emitting diode package and method of manufacturing light emitting diode package using the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3286312A (en) * | 1965-03-29 | 1966-11-22 | Little Inc A | Refractory coated casting mold |
-
2008
- 2008-08-01 FR FR0855357A patent/FR2934580B1/fr not_active Expired - Fee Related
-
2009
- 2009-07-31 EP EP09740426A patent/EP2321216A2/fr not_active Withdrawn
- 2009-07-31 WO PCT/FR2009/051544 patent/WO2010012966A2/fr active Application Filing
- 2009-07-31 US US13/056,796 patent/US8617413B2/en not_active Expired - Fee Related
- 2009-07-31 JP JP2011520573A patent/JP2011529798A/ja not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070231943A1 (en) * | 2006-03-21 | 2007-10-04 | Dalsa Semiconductor Inc. | Protection capsule for mems devices |
US20080061458A1 (en) * | 2006-09-07 | 2008-03-13 | Samsung Electro-Mechanics Co., Ltd | Mold for forming lens of light emitting diode package and method of manufacturing light emitting diode package using the same |
Non-Patent Citations (3)
Title |
---|
JOURDAIN A ET AL: "Optimization of 0-level packaging for rf-mems devices", TRANSDUCERS, SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS, 12TH INN ATIONAL CONFERENCE ON, 2003, PISCATAWAY, NJ, USA,IEEE, vol. 2, 9 June 2003 (2003-06-09), pages 1915 - 1918, XP010647489, ISBN: 978-0-7803-7731-8 * |
See also references of EP2321216A2 * |
SEOK S ET AL: "Packaging methodology for RF devices using a BCB membrane transfer technique", JOURNAL OF MICROMECHANICS & MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 16, no. 11, 1 November 2006 (2006-11-01), pages 2384 - 2388, XP020104816, ISSN: 0960-1317 * |
Also Published As
Publication number | Publication date |
---|---|
EP2321216A2 (fr) | 2011-05-18 |
WO2010012966A2 (fr) | 2010-02-04 |
FR2934580B1 (fr) | 2015-01-16 |
FR2934580A1 (fr) | 2010-02-05 |
US8617413B2 (en) | 2013-12-31 |
JP2011529798A (ja) | 2011-12-15 |
US20110165365A1 (en) | 2011-07-07 |
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