EP2700614A3 - Procédés de fabrication de structures mems par gravure de structures sacrificielles intégrées dans du verre - Google Patents
Procédés de fabrication de structures mems par gravure de structures sacrificielles intégrées dans du verre Download PDFInfo
- Publication number
- EP2700614A3 EP2700614A3 EP20130168373 EP13168373A EP2700614A3 EP 2700614 A3 EP2700614 A3 EP 2700614A3 EP 20130168373 EP20130168373 EP 20130168373 EP 13168373 A EP13168373 A EP 13168373A EP 2700614 A3 EP2700614 A3 EP 2700614A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- glass
- methods
- sacrificial features
- mems structures
- silicon substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title abstract 4
- 239000011521 glass Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052710 silicon Inorganic materials 0.000 abstract 4
- 239000010703 silicon Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00619—Forming high aspect ratio structures having deep steep walls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
- B81C2201/0194—Transfer of a layer from a carrier wafer to a device wafer the layer being structured
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261691984P | 2012-08-22 | 2012-08-22 | |
US13/749,008 US8735199B2 (en) | 2012-08-22 | 2013-01-24 | Methods for fabricating MEMS structures by etching sacrificial features embedded in glass |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2700614A2 EP2700614A2 (fr) | 2014-02-26 |
EP2700614A3 true EP2700614A3 (fr) | 2014-09-24 |
EP2700614B1 EP2700614B1 (fr) | 2015-09-16 |
Family
ID=48430598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13168373.2A Active EP2700614B1 (fr) | 2012-08-22 | 2013-05-17 | Procédés de fabrication de structures MEMS par gravure de structures sacrificielles intégrées dans du verre |
Country Status (4)
Country | Link |
---|---|
US (1) | US8735199B2 (fr) |
EP (1) | EP2700614B1 (fr) |
JP (1) | JP2014039995A (fr) |
CN (1) | CN103626116A (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9499392B2 (en) * | 2013-02-05 | 2016-11-22 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
CA2905040C (fr) | 2013-03-15 | 2021-10-19 | Butterfly Network, Inc. | Transducteurs ultrasonores a semi-conducteur complementaire a l'oxyde de metal (cmos) et leurs procedes de formation |
TWI708368B (zh) | 2014-04-18 | 2020-10-21 | 美商蝴蝶網路公司 | 在互補式金屬氧化物半導體晶圓中的超音波轉換器及相關設備和方法 |
CN105174203B (zh) * | 2014-05-28 | 2016-09-28 | 无锡华润上华半导体有限公司 | 基于mems的传感器的制作方法 |
US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
US20160039664A1 (en) * | 2014-08-06 | 2016-02-11 | Honeywell International Inc. | Monolithic integration of stress isolation feautures in a microelectromechanical system (mems) structure |
US10131535B2 (en) | 2015-05-22 | 2018-11-20 | Honeywell International Inc. | Monolithic fabrication of thermally isolated microelectromechanical system (MEMS) devices |
US9987661B2 (en) | 2015-12-02 | 2018-06-05 | Butterfly Network, Inc. | Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
EP3642611B1 (fr) | 2017-06-21 | 2024-02-14 | Butterfly Network, Inc. | Transducteur à ultrasons microfabriqué ayant des cellules individuelles comportant des sections d'électrode électriquement isolées |
FR3076292B1 (fr) * | 2017-12-28 | 2020-01-03 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de transfert d'une couche utile sur un substrat support |
CN112938894B (zh) * | 2021-03-11 | 2024-06-28 | 中北大学 | 一种多层次立体化的mems器件抗冲击防护结构的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004017371A2 (fr) * | 2002-08-15 | 2004-02-26 | The Charles Stark Draper Laboratory, Inc. | Procede de microusinage de structures utilisant un materiau de silicium sur isolant |
DE102007060931A1 (de) * | 2006-12-21 | 2008-08-28 | Continental Teves Ag & Co. Ohg | Verkapselungsmodul, Verfahren zu dessen Herstellung und Verwendung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2368449A1 (fr) * | 1999-03-25 | 2000-10-05 | Nippon Sheet Glass Co., Ltd. | Panneau de verre et son procede de production |
US7381630B2 (en) * | 2001-01-02 | 2008-06-03 | The Charles Stark Draper Laboratory, Inc. | Method for integrating MEMS device and interposer |
FR2880128B1 (fr) * | 2004-12-29 | 2007-02-02 | Commissariat Energie Atomique | Accelerometre micro-usine a peignes capacitifs |
JP2012156403A (ja) * | 2011-01-27 | 2012-08-16 | Panasonic Corp | ガラス埋込シリコン基板およびその製造方法 |
US8847143B2 (en) | 2011-04-27 | 2014-09-30 | Honeywell International Inc. | Systems and methods for an encoder and control scheme |
CN102992261B (zh) * | 2012-12-31 | 2015-08-19 | 东南大学 | 玻璃微结构加氢正压热成型方法 |
-
2013
- 2013-01-24 US US13/749,008 patent/US8735199B2/en active Active
- 2013-05-17 EP EP13168373.2A patent/EP2700614B1/fr active Active
- 2013-05-28 JP JP2013111723A patent/JP2014039995A/ja not_active Ceased
- 2013-06-21 CN CN201310248896.0A patent/CN103626116A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004017371A2 (fr) * | 2002-08-15 | 2004-02-26 | The Charles Stark Draper Laboratory, Inc. | Procede de microusinage de structures utilisant un materiau de silicium sur isolant |
DE102007060931A1 (de) * | 2006-12-21 | 2008-08-28 | Continental Teves Ag & Co. Ohg | Verkapselungsmodul, Verfahren zu dessen Herstellung und Verwendung |
Also Published As
Publication number | Publication date |
---|---|
EP2700614B1 (fr) | 2015-09-16 |
JP2014039995A (ja) | 2014-03-06 |
CN103626116A (zh) | 2014-03-12 |
US8735199B2 (en) | 2014-05-27 |
EP2700614A2 (fr) | 2014-02-26 |
US20140057382A1 (en) | 2014-02-27 |
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