JPWO2018092883A1 - 実装ヘッド - Google Patents
実装ヘッド Download PDFInfo
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- JPWO2018092883A1 JPWO2018092883A1 JP2018551707A JP2018551707A JPWO2018092883A1 JP WO2018092883 A1 JPWO2018092883 A1 JP WO2018092883A1 JP 2018551707 A JP2018551707 A JP 2018551707A JP 2018551707 A JP2018551707 A JP 2018551707A JP WO2018092883 A1 JPWO2018092883 A1 JP WO2018092883A1
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Abstract
Description
上記のように本発明を実施の形態によって記載したが、この開示の一部をなす記述及び図面はこの発明を限定するものであると理解するべきではない。この開示から当業者には様々な代替実施の形態、実施例及び運用技術が明らかになるはずである。
Claims (13)
- 半導体ダイの電極と基板又は別の半導体ダイの電極とを接合する電子部品実装装置に用いる実装ヘッドであって、
半導体ダイを吸着する吸着面を有するアタッチメントと、
前記アタッチメントの前記吸着面とは反対側の面に配置され、前記アタッチメント及び前記半導体ダイを加熱するボンディングヒータと、
端面で前記ボンディングヒータを保持する本体部と、
前記アタッチメントの前記吸着面に形成された第1開口部と、
前記本体部の前記端面とは異なる面に形成された第2開口部と、
前記本体部内で前記第1開口部から吸引された気体の流路を屈曲させる第1屈曲部を有し、前記アタッチメント、前記ボンディングヒータ、及び前記本体部の内部を貫通する吸引経路であって、前記第1開口部から吸引された気体を前記第2開口部において外部に排出する吸引経路と、
前記吸引経路に形成され、前記気体が凝縮した液滴が前記ボンディングヒータに滴下するのを抑制する滴下防止部と、
を備える、
実装ヘッド。 - 前記滴下防止部は、前記吸引経路の前記第1屈曲部よりも前記気体の吸引方向下流側において配置され、前記気体が凝縮した前記液滴又は前記液滴が凝固した固体を貯留する貯留部を備える、
請求項1に記載の実装ヘッド。 - 前記滴下防止部は、前記吸引経路において前記ボンディングヒータを貫通する貫通孔の直上部に配置され、前記気体の凝縮温度以上の温度に前記気体を加熱する経路ヒータを備える、
請求項1に記載の実装ヘッド。 - 前記滴下防止部は、前記吸引経路の前記第1屈曲部よりも前記気体の吸引方向下流側において配置され、前記気体の凝縮温度以下の温度に前記気体を冷却する冷却部を備える、
請求項1に記載の実装ヘッド。 - 前記滴下防止部は、前記吸引経路の前記第1屈曲部よりも前記気体の吸引方向下流側において配置され、前記気体の流体抵抗を増加させる凝縮部を備える、
請求項1に記載の実装ヘッド。 - 前記吸引経路は、前記第1屈曲部よりも前記気体の吸引方向下流側に設けられた第2屈曲部を更に備え、
前記滴下防止部は、前記第1屈曲部及び前記第2屈曲部に渡って設けられる、
請求項1に記載の実装ヘッド。 - 前記気体が凝縮した前記液滴又は前記液滴が凝固した固体を貯留する貯留部は、前記第2屈曲部に配置されている、
請求項6に記載の実装ヘッド。 - 前記本体部は、前記気体が凝縮した前記液滴又は前記液滴が凝固した固体を貯留する貯留部を通る分割面において上下に分割可能に構成されている、
請求項1から7のいずれか一項に記載の実装ヘッド。 - 前記貯留部の底部が前記分割面で分割した下部本体部に設けられている、
請求項8に記載の実装ヘッド。 - 前記本体部は、前記分割面で分割した上部本体部に第3開口部を備え、
前記第3開口部は、前記気体の吸引方向下流側に向かって次第に小さくなるようにテーパ状に形成されており、前記第3開口部の一端面の直径が前記第3開口部の前記吸引方向下流側の他の端面の直径よりも大きい、
請求項8に記載の実装ヘッド。 - 前記本体部は、前記吸引経路において前記ボンディングヒータを貫通する貫通孔の直上部に配置され、前記気体の凝縮温度以上の温度に前記気体を加熱する経路ヒータと、前記吸引経路の前記第1屈曲部よりも前記気体の吸引方向下流側において配置され、前記気体が凝縮した前記液滴又は前記液滴が凝固した固体を貯留する貯留部と、前記吸引経路の前記第1屈曲部よりも前記気体の吸引方向下流側において配置され、前記気体の凝縮温度以下の温度に前記気体を冷却する冷却部と、を前記気体の吸引方向に沿って順次備えている、
請求項1に記載の実装ヘッド。 - 前記本体部は、前記吸引経路において、前記気体が凝縮した前記液滴又は前記液滴が凝固した固体を貯留する貯留部が設けられている位置に対向する位置に突起部を更に備える、請求項1に記載の実装ヘッド。
- 前記ボンディングヒータと前記本体部とは、異なる熱伝導率を有する材料を含んで構成される、請求項1に記載の実装ヘッド。
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