JPWO2017221683A1 - 基板処理方法、読み取り可能なコンピュータ記憶媒体及び基板処理システム - Google Patents

基板処理方法、読み取り可能なコンピュータ記憶媒体及び基板処理システム Download PDF

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Publication number
JPWO2017221683A1
JPWO2017221683A1 JP2018523671A JP2018523671A JPWO2017221683A1 JP WO2017221683 A1 JPWO2017221683 A1 JP WO2017221683A1 JP 2018523671 A JP2018523671 A JP 2018523671A JP 2018523671 A JP2018523671 A JP 2018523671A JP WO2017221683 A1 JPWO2017221683 A1 JP WO2017221683A1
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Japan
Prior art keywords
substrate
block copolymer
wafer
liquid
wet liquid
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Pending
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JP2018523671A
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English (en)
Japanese (ja)
Inventor
剛 山内
剛 山内
正志 榎本
正志 榎本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JPWO2017221683A1 publication Critical patent/JPWO2017221683A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
JP2018523671A 2016-06-24 2017-06-05 基板処理方法、読み取り可能なコンピュータ記憶媒体及び基板処理システム Pending JPWO2017221683A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016125967 2016-06-24
JP2016125967 2016-06-24
PCT/JP2017/020853 WO2017221683A1 (ja) 2016-06-24 2017-06-05 基板処理方法、読み取り可能なコンピュータ記憶媒体及び基板処理システム

Publications (1)

Publication Number Publication Date
JPWO2017221683A1 true JPWO2017221683A1 (ja) 2019-04-04

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JP2018523671A Pending JPWO2017221683A1 (ja) 2016-06-24 2017-06-05 基板処理方法、読み取り可能なコンピュータ記憶媒体及び基板処理システム

Country Status (3)

Country Link
JP (1) JPWO2017221683A1 (zh)
TW (1) TWI723183B (zh)
WO (1) WO2017221683A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207250A (ja) * 1998-01-23 1999-08-03 Tokyo Electron Ltd 膜形成方法
JP2013214689A (ja) * 2012-04-04 2013-10-17 Renesas Electronics Corp 半導体装置の製造方法および塗布装置
JP2013232621A (ja) * 2012-04-06 2013-11-14 Tokyo Electron Ltd パターン形成方法、パターン形成装置、及びコンピュータ可読記憶媒体
JP2013235957A (ja) * 2012-05-09 2013-11-21 Lapis Semiconductor Co Ltd レジスト塗布装置及びレジスト塗布方法
JP2014011420A (ja) * 2012-07-03 2014-01-20 Tokyo Electron Ltd 塗布膜形成方法、塗布膜形成装置、基板処理装置及び記憶媒体
WO2014178333A1 (ja) * 2013-05-02 2014-11-06 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法及び電子デバイス
JP2016115693A (ja) * 2014-12-11 2016-06-23 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6023010B2 (ja) * 2013-06-26 2016-11-09 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11207250A (ja) * 1998-01-23 1999-08-03 Tokyo Electron Ltd 膜形成方法
JP2013214689A (ja) * 2012-04-04 2013-10-17 Renesas Electronics Corp 半導体装置の製造方法および塗布装置
JP2013232621A (ja) * 2012-04-06 2013-11-14 Tokyo Electron Ltd パターン形成方法、パターン形成装置、及びコンピュータ可読記憶媒体
JP2013235957A (ja) * 2012-05-09 2013-11-21 Lapis Semiconductor Co Ltd レジスト塗布装置及びレジスト塗布方法
JP2014011420A (ja) * 2012-07-03 2014-01-20 Tokyo Electron Ltd 塗布膜形成方法、塗布膜形成装置、基板処理装置及び記憶媒体
WO2014178333A1 (ja) * 2013-05-02 2014-11-06 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法及び電子デバイス
JP2016115693A (ja) * 2014-12-11 2016-06-23 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置

Also Published As

Publication number Publication date
TW201802908A (zh) 2018-01-16
TWI723183B (zh) 2021-04-01
WO2017221683A1 (ja) 2017-12-28

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