JPWO2017212841A1 - 容器保管装置及び容器保管方法 - Google Patents
容器保管装置及び容器保管方法 Download PDFInfo
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- 238000003860 storage Methods 0.000 title claims abstract description 126
- 238000000034 method Methods 0.000 title claims description 31
- 238000010926 purge Methods 0.000 claims abstract description 117
- 230000032258 transport Effects 0.000 claims description 43
- 238000009792 diffusion process Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 4
- 230000006866 deterioration Effects 0.000 abstract description 11
- 239000007789 gas Substances 0.000 description 141
- 230000008569 process Effects 0.000 description 17
- 230000003028 elevating effect Effects 0.000 description 15
- 238000012546 transfer Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 9
- 230000007613 environmental effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
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- 230000002411 adverse Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
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- 238000007664 blowing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】容器保管装置1Aは、保管される容器2内にパージガスを供給するパージ装置24と、容器2の蓋2cの近傍に配置されて蓋2cの周囲の雰囲気を吸引する吸引装置24と、を備える。
Description
図1及び図2は、第1実施形態に係る容器保管装置1Aの一例を示す図である。図1は側面図であり、図2(A)は正面図であり、図2(B)は上面図である。容器保管装置1Aは、例えば、半導体デバイスの製造工場に設置され、容器2を保管する。
第2実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図4は、第2実施形態に係る容器保管装置1Bの一例を示す図である。図4(A)は正面図であり、図4(B)は上面図であり、図4(C)は図4(A)に示すA−A線に沿った断面を上方から見た図である。
第3実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図5は、第3実施形態に係る容器保管装置1Cの一例を示す図である。図5(A)は側面図であり、図5(B)は上面図である。
第4実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図6は、第4実施形態に係る容器保管装置1Dの一例を示す図である。図6(A)は側面図であり、図6(B)は上面図である。
第5実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図7は、第5実施形態に係る容器保管装置1Eの一例を示す側面図である。
第6実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図8(A)は、第6実施形態に係る容器保管装置1Fの一例を示す側面図である。
第7実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図9は、第7実施形態に係る容器保管装置1Gの一例を示す側面図である。図10は、第7実施形態に係る容器保管装置1Gの他の例を示す側面図である。
第8実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図11は、第8実施形態に係る容器保管装置1Hの一例を示す側面図である。
第9実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図12は、第9実施形態に係る容器保管装置1Jの一例を示す側面図である。
第10実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図13は、第10実施形態に係る容器保管装置1Kの一例を示す正面図である。
2・・・容器
2c・・・蓋
2j、2k・・・側面
3・・・天井搬送車
24、24B、24C、24D、24F・・・吸引装置
26、26B、26C、26D、26F・・・フード
31、31F・・・ファン
32、32A・・・排出経路
Claims (8)
- 保管される容器内にパージガスを供給するパージ装置と、
前記容器の蓋の近傍に配置されて前記蓋の周囲の雰囲気を吸引する吸引装置と、を備える、容器保管装置。 - 前記容器を搬送する天井搬送車から前記容器を移載可能であって、かつ天井近傍に配置される、請求項1に記載の容器保管装置。
- 前記吸引装置は、前記蓋に対向して配置されるフードを備える、請求項1または請求項2に記載の容器保管装置。
- 前記フードは、前記容器の側面を囲むように設けられる、請求項3に記載の容器保管装置。
- 前記フードから吸引したガスを排出するための排出経路を備える、請求項3または請求項4に記載の容器保管装置。
- 前記吸引装置は、拡散用のファンを備える、請求項1または請求項2に記載の容器保管装置。
- 保管される容器内にパージガスを供給することと、
前記容器の蓋の周囲の雰囲気を吸引することと、を含む容器保管方法。 - 前記容器内へのパージガスの供給中に前記容器の蓋の周囲の雰囲気を吸引することを含む、請求項7に記載の容器保管方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016114321 | 2016-06-08 | ||
JP2016114321 | 2016-06-08 | ||
PCT/JP2017/017377 WO2017212841A1 (ja) | 2016-06-08 | 2017-05-08 | 容器保管装置及び容器保管方法 |
Publications (2)
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JPWO2017212841A1 true JPWO2017212841A1 (ja) | 2019-03-28 |
JP6607314B2 JP6607314B2 (ja) | 2019-11-20 |
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JP2018522375A Active JP6607314B2 (ja) | 2016-06-08 | 2017-05-08 | 容器保管装置及び容器保管方法 |
Country Status (5)
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US (1) | US11501991B2 (ja) |
JP (1) | JP6607314B2 (ja) |
CN (1) | CN109314075B (ja) |
TW (1) | TWI704097B (ja) |
WO (1) | WO2017212841A1 (ja) |
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WO2021090542A1 (ja) * | 2019-11-05 | 2021-05-14 | 村田機械株式会社 | 搬送車システム |
KR102593950B1 (ko) * | 2021-12-29 | 2023-10-24 | 세메스 주식회사 | 유량공급장치 및 공급방법 |
WO2023228660A1 (ja) * | 2022-05-23 | 2023-11-30 | 村田機械株式会社 | 容器保管装置 |
Citations (4)
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JP2005327815A (ja) * | 2004-05-12 | 2005-11-24 | Miraial Kk | 収納容器のガス置換装置およびそれを用いたガス置換方法 |
WO2015166710A1 (ja) * | 2014-04-28 | 2015-11-05 | 村田機械株式会社 | パージ装置及びパージ方法 |
JP2015533026A (ja) * | 2012-10-31 | 2015-11-16 | 株式会社ダイフク | ウェハパージ可能な天井保管装置(apparatusforstockingandpurgingwaferatceiling) |
JP2015214407A (ja) * | 2014-05-12 | 2015-12-03 | 村田機械株式会社 | 保管庫及びクリーンルーム |
Family Cites Families (10)
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JP3082389B2 (ja) * | 1992-01-27 | 2000-08-28 | 神鋼電機株式会社 | クリーンルーム用保管庫 |
WO2005101484A1 (ja) * | 2004-04-07 | 2005-10-27 | Right Mfg Co. Ltd. | 基板収納容器の雰囲気置換ポート接続装置 |
US7314068B2 (en) * | 2004-05-12 | 2008-01-01 | Miraial Co., Ltd. | Apparatus for replacing gas in storage container and method for replacing gas therewith |
FR2901546B1 (fr) * | 2006-05-24 | 2010-10-15 | Cit Alcatel | Procede et dispositif de depollution d'environnement confine |
JP4928841B2 (ja) * | 2006-06-15 | 2012-05-09 | 株式会社リコー | 微細部品の製造装置と製造方法及びそれにより製造された液吐出ヘッド |
JP5123618B2 (ja) * | 2007-09-07 | 2013-01-23 | 東京エレクトロン株式会社 | 容器清浄度計測装置、基板処理システム及び容器清浄度計測方法 |
JP5993252B2 (ja) * | 2012-09-06 | 2016-09-14 | 東京エレクトロン株式会社 | 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法 |
US20140157722A1 (en) * | 2012-12-04 | 2014-06-12 | Tdk Corporation | Lid opening/closing system for closed container, and substrate processing method using the same |
JP6268425B2 (ja) * | 2013-07-16 | 2018-01-31 | シンフォニアテクノロジー株式会社 | Efem、ロードポート、ウェーハ搬送方法 |
JP2016066689A (ja) * | 2014-09-24 | 2016-04-28 | 東京エレクトロン株式会社 | 容器清掃装置及び容器清掃方法 |
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2017
- 2017-05-08 CN CN201780034836.5A patent/CN109314075B/zh active Active
- 2017-05-08 WO PCT/JP2017/017377 patent/WO2017212841A1/ja active Application Filing
- 2017-05-08 US US16/307,959 patent/US11501991B2/en active Active
- 2017-05-08 JP JP2018522375A patent/JP6607314B2/ja active Active
- 2017-06-05 TW TW106118541A patent/TWI704097B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005327815A (ja) * | 2004-05-12 | 2005-11-24 | Miraial Kk | 収納容器のガス置換装置およびそれを用いたガス置換方法 |
JP2015533026A (ja) * | 2012-10-31 | 2015-11-16 | 株式会社ダイフク | ウェハパージ可能な天井保管装置(apparatusforstockingandpurgingwaferatceiling) |
WO2015166710A1 (ja) * | 2014-04-28 | 2015-11-05 | 村田機械株式会社 | パージ装置及びパージ方法 |
JP2015214407A (ja) * | 2014-05-12 | 2015-12-03 | 村田機械株式会社 | 保管庫及びクリーンルーム |
Also Published As
Publication number | Publication date |
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JP6607314B2 (ja) | 2019-11-20 |
CN109314075B (zh) | 2023-02-21 |
TWI704097B (zh) | 2020-09-11 |
TW201803793A (zh) | 2018-02-01 |
CN109314075A (zh) | 2019-02-05 |
WO2017212841A1 (ja) | 2017-12-14 |
US11501991B2 (en) | 2022-11-15 |
US20190304822A1 (en) | 2019-10-03 |
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