JPWO2017164254A1 - 基板供給ユニット及びボンディング装置 - Google Patents
基板供給ユニット及びボンディング装置 Download PDFInfo
- Publication number
- JPWO2017164254A1 JPWO2017164254A1 JP2018507382A JP2018507382A JPWO2017164254A1 JP WO2017164254 A1 JPWO2017164254 A1 JP WO2017164254A1 JP 2018507382 A JP2018507382 A JP 2018507382A JP 2018507382 A JP2018507382 A JP 2018507382A JP WO2017164254 A1 JPWO2017164254 A1 JP WO2017164254A1
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonding
- unit
- grade
- deck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
Description
10…ウェハローダ部
12…ウェハ保持部
14…ピックアップツール
16…中間ステージ
17…レーン
18…自動搬送機構
20a…第1ボンディングヘッド
20b…第2ボンディングヘッド
21…Z軸駆動機構
22…ボンディングツール
24…撮像部
26…XYテーブル
30…搬送レーン
40…ローダ部
42…デッキ
44…デッキ
46…デッキ
50…アンローダ部
52…デッキ
54…デッキ
56…デッキ
60…ボンディング制御部
70…ウェハ
72…ダイ
74…ダイ(第1グレード)
76…ダイ(第2グレード)
80…基板
84…基板(第1グレード)
86…基板(第2グレード)
90…基板収容体
94…基板収容体(第1グレード)
96…基板収容体(第2グレード)
Claims (11)
- 高さ方向のそれぞれ異なる位置に設けられた3階層以上の複数のデッキから構成され、各デッキが前記高さ方向に直交する奥行方向に配列される複数の基板収容体を収容する、本体部と、
前記本体部における前記奥行方向の一方側に隣接して配置され、いずれかのデッキに前記基板収容体を供給するように前記基板収容体を前記高さ方向に上下に移動させるエレベータ部と、
前記本体部における前記奥行方向の他方側に隣接して配置され、いずれかのデッキから前記基板収容体を取り出し、かつ、当該基板収容体に収容される基板をボンディング用搬送レーンへ搬送する基板搬送部と
を備えた、基板供給ユニット。 - 前記エレベータ部が、製造設備における所定のレーンに従って走行する自動搬送機構を介して、外部から前記基板収容体を受け取る、請求項1記載の基板供給ユニット。
- 前記エレベータ部が、製造設備における所定のレーンに従って走行する自動搬送機構を介して、外部へ前記基板収容体を排出する、請求項1記載の基板供給ユニット。
- 前記エレベータ部が、前記基板収容体の位置決めを行うオフセット手段を有する、請求項2記載の基板供給ユニット。
- 前記複数のデッキのうち前記高さ方向の最上階層に位置するデッキが、前記自動搬送機構を介して、外部へ前記基板収容体を排出する、請求項2記載の基板供給ユニット。
- 前記自動搬送機構は、OHT(Overhead Hoist Transfer)を含む、請求項2記載の基板供給ユニット。
- 前記基板は、複数のグレード毎に分類されたダイのうち、同一のグレードに属する複数のダイがボンディングされるものであり、
前記各基板収容体は、同一のグレードに属する複数の基板を収容する、請求項1記載の基板供給ユニット。 - 前記グレードは、少なくとも第1グレード及び第2グレードを含み、
前記本体部の前記複数のデッキは、
前記第1グレードに属する基板収容体を収容する第1グレード専用デッキと、
前記第2グレードに属する基板収容体を収容する第2グレード専用デッキと、
前記第1グレード又は前記第2グレードに属する基板収容体を収容する共用デッキと
を含む、請求項7記載の基板供給ユニット。 - 前記共用デッキは、前記高さ方向の最上階層に位置する、請求項8記載の基板供給ユニット。
- 前記ボンディング用搬送レーンは、前記高さ方向及び前記奥行方向のそれぞれに直交する幅方向に延在する、請求項1記載の基板供給ユニット。
- 複数のグレードに区分される複数のダイを有するウェハを保持するウェハ保持部と、
前記ウェハ保持部から搬送された前記ダイを基板にボンディングするボンディングヘッドと、
前記ボンディングヘッドによってボンディングするために前記基板を搬送する搬送レーンと、
前記搬送レーンの一方端に設けられたローダ部と、
前記搬送レーンの他方端に設けられたアンローダ部と、
前記ウェハにおける複数のグレード毎にダイを分類したマッピング情報に基づいて、前記ウェハの前記各ダイを当該ダイのグレードに対応する前記基板にボンディングするボンディング制御部と
を備え、
前記ローダ部及び前記アンローダ部の少なくとも一方が、請求項1から10のいずれか一項に記載の基板供給ユニットから構成された、ボンディング装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016057314 | 2016-03-22 | ||
JP2016057314 | 2016-03-22 | ||
PCT/JP2017/011524 WO2017164254A1 (ja) | 2016-03-22 | 2017-03-22 | 基板供給ユニット及びボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017164254A1 true JPWO2017164254A1 (ja) | 2019-02-14 |
JP6549310B2 JP6549310B2 (ja) | 2019-07-24 |
Family
ID=59900313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018507382A Active JP6549310B2 (ja) | 2016-03-22 | 2017-03-22 | 基板供給ユニット及びボンディング装置 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6549310B2 (ja) |
KR (1) | KR102129837B1 (ja) |
CN (1) | CN109155270B (ja) |
SG (1) | SG11201811531XA (ja) |
TW (1) | TWI645496B (ja) |
WO (1) | WO2017164254A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7159337B2 (ja) * | 2018-10-09 | 2022-10-24 | ヤマハ発動機株式会社 | 部品実装装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60145000A (ja) * | 1983-12-06 | 1985-07-31 | ジーメンス・アクチエンゲゼルシヤフト | 導体板用加工装置の導体板受渡し装置 |
JP2010192855A (ja) * | 2009-02-20 | 2010-09-02 | Tokyo Electron Ltd | 基板処理装置 |
JP2013065711A (ja) * | 2011-09-16 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
WO2014207803A1 (ja) * | 2013-06-24 | 2014-12-31 | 富士機械製造株式会社 | 部品実装システム及び部品実装方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3258748B2 (ja) * | 1993-02-08 | 2002-02-18 | 東京エレクトロン株式会社 | 熱処理装置 |
FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
WO2006124683A2 (en) * | 2005-05-16 | 2006-11-23 | Asyst Technologies, Inc. | Modular terminal for high-throughput amhs |
JP5009602B2 (ja) | 2006-12-20 | 2012-08-22 | 日本電産トーソク株式会社 | リードフレーム供給装置 |
JP2007227972A (ja) * | 2007-05-28 | 2007-09-06 | Dainippon Screen Mfg Co Ltd | キャリアストッカ |
KR20090008630A (ko) * | 2007-07-18 | 2009-01-22 | 한미반도체 주식회사 | 반도체 패키지 제조용 기판 인입출장치 |
JP4887332B2 (ja) * | 2007-09-20 | 2012-02-29 | 東京エレクトロン株式会社 | 基板の処理装置 |
JP2013035711A (ja) * | 2011-08-05 | 2013-02-21 | Mitsubishi Chemicals Corp | 六角棒状GaN系半導体結晶およびその製造方法 |
-
2017
- 2017-03-22 KR KR1020187030095A patent/KR102129837B1/ko active IP Right Review Request
- 2017-03-22 CN CN201780031168.0A patent/CN109155270B/zh active Active
- 2017-03-22 TW TW106109540A patent/TWI645496B/zh active
- 2017-03-22 WO PCT/JP2017/011524 patent/WO2017164254A1/ja active Application Filing
- 2017-03-22 SG SG11201811531XA patent/SG11201811531XA/en unknown
- 2017-03-22 JP JP2018507382A patent/JP6549310B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60145000A (ja) * | 1983-12-06 | 1985-07-31 | ジーメンス・アクチエンゲゼルシヤフト | 導体板用加工装置の導体板受渡し装置 |
JP2010192855A (ja) * | 2009-02-20 | 2010-09-02 | Tokyo Electron Ltd | 基板処理装置 |
JP2013065711A (ja) * | 2011-09-16 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
WO2014207803A1 (ja) * | 2013-06-24 | 2014-12-31 | 富士機械製造株式会社 | 部品実装システム及び部品実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6549310B2 (ja) | 2019-07-24 |
KR20180124955A (ko) | 2018-11-21 |
TWI645496B (zh) | 2018-12-21 |
KR102129837B1 (ko) | 2020-07-03 |
WO2017164254A1 (ja) | 2017-09-28 |
CN109155270A (zh) | 2019-01-04 |
TW201801231A (zh) | 2018-01-01 |
SG11201811531XA (en) | 2019-01-30 |
CN109155270B (zh) | 2023-08-25 |
KR102129837B9 (ko) | 2022-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101931127B1 (ko) | 반도체 제조 장치 및 반도체 장치의 제조 방법 | |
CN108346585B (zh) | 半导体制造装置及半导体器件的制造方法 | |
JP4128319B2 (ja) | マルチチップボンディング方法及び装置 | |
JP4307410B2 (ja) | 集積回路チップのピックアップ及び分類装置 | |
KR102106884B1 (ko) | 본딩 장치 및 본딩 방법 | |
KR100395981B1 (ko) | 다이본딩 방법 및 그 장치 | |
WO2017164254A1 (ja) | 基板供給ユニット及びボンディング装置 | |
JP2000118681A (ja) | トレイ搬送装置及び方法 | |
JP6329665B2 (ja) | ダイボンダ及びボンディング方法 | |
KR20020079653A (ko) | 반도체 패키지 싱귤레이션 시스템 | |
KR100639400B1 (ko) | 리드 픽 앤 플레이스 장비 | |
CN107225700A (zh) | 封装基板的操作方法 | |
US6787374B2 (en) | Semiconductor device manufacturing method and semiconductor device sorting system to be used with the same | |
JP7328848B2 (ja) | ダイボンディング装置および半導体装置の製造方法 | |
TWI830438B (zh) | 晶粒接合裝置以及晶粒接合方法 | |
KR102654727B1 (ko) | 다이 본딩 방법 및 다이 본딩 장치 | |
JP2006294897A (ja) | バンプボンディング装置 | |
JP2589100B2 (ja) | チップボンディング装置 | |
CN117855083A (zh) | 裸片键合装置 | |
KR20170103137A (ko) | 기판 이송 장치 | |
JPH11274242A (ja) | ボンディング装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180918 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190530 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190626 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6549310 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |