SG11201811531XA - Substrate supply unit and bonding apparatus - Google Patents

Substrate supply unit and bonding apparatus

Info

Publication number
SG11201811531XA
SG11201811531XA SG11201811531XA SG11201811531XA SG11201811531XA SG 11201811531X A SG11201811531X A SG 11201811531XA SG 11201811531X A SG11201811531X A SG 11201811531XA SG 11201811531X A SG11201811531X A SG 11201811531XA SG 11201811531X A SG11201811531X A SG 11201811531XA
Authority
SG
Singapore
Prior art keywords
supply unit
bonding apparatus
substrate supply
substrate
bonding
Prior art date
Application number
SG11201811531XA
Inventor
Taito Kobayashi
Masayoshi Kouta
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59900313&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201811531X(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201811531XA publication Critical patent/SG11201811531XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
SG11201811531XA 2016-03-22 2017-03-22 Substrate supply unit and bonding apparatus SG11201811531XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016057314 2016-03-22
PCT/JP2017/011524 WO2017164254A1 (en) 2016-03-22 2017-03-22 Substrate supply unit and bonding device

Publications (1)

Publication Number Publication Date
SG11201811531XA true SG11201811531XA (en) 2019-01-30

Family

ID=59900313

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201811531XA SG11201811531XA (en) 2016-03-22 2017-03-22 Substrate supply unit and bonding apparatus

Country Status (6)

Country Link
JP (1) JP6549310B2 (en)
KR (1) KR102129837B1 (en)
CN (1) CN109155270B (en)
SG (1) SG11201811531XA (en)
TW (1) TWI645496B (en)
WO (1) WO2017164254A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020075216A1 (en) * 2018-10-09 2020-04-16 ヤマハ発動機株式会社 Component mounting device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3344483A1 (en) * 1983-12-06 1985-06-20 Siemens AG, 1000 Berlin und 8000 München DEVICE FOR LOADING AND UNLOADING PROCESSING DEVICES FOR CIRCUIT BOARDS, IN PARTICULAR COMPONENT EQUIPMENT EQUIPMENT
JP3258748B2 (en) * 1993-02-08 2002-02-18 東京エレクトロン株式会社 Heat treatment equipment
FR2844258B1 (en) * 2002-09-06 2005-06-03 Recif Sa SYSTEM FOR TRANSPORTING AND STORING SEMICONDUCTOR PLATE CONTAINERS, AND TRANSFER MECHANISM
EP1883958A2 (en) * 2005-05-16 2008-02-06 Asyst Technologies, Inc. Modular terminal for high-throughput amhs
JP5009602B2 (en) 2006-12-20 2012-08-22 日本電産トーソク株式会社 Lead frame supply device
JP2007227972A (en) * 2007-05-28 2007-09-06 Dainippon Screen Mfg Co Ltd Carrier stocker
KR20090008630A (en) * 2007-07-18 2009-01-22 한미반도체 주식회사 Apparatus for extracting or inserting substrate plate for manufacturing semiconductor packages
JP4887332B2 (en) * 2007-09-20 2012-02-29 東京エレクトロン株式会社 Substrate processing equipment
JP5212165B2 (en) * 2009-02-20 2013-06-19 東京エレクトロン株式会社 Substrate processing equipment
JP2013035711A (en) * 2011-08-05 2013-02-21 Mitsubishi Chemicals Corp HEXAGONAL ROD-LIKE GaN-BASED SEMICONDUCTOR CRYSTAL AND METHOD FOR PRODUCING THE SAME
JP5815345B2 (en) * 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 Die bonder and bonding method
WO2014207803A1 (en) * 2013-06-24 2014-12-31 富士機械製造株式会社 Component mounting system and component mounting method

Also Published As

Publication number Publication date
TWI645496B (en) 2018-12-21
CN109155270A (en) 2019-01-04
JPWO2017164254A1 (en) 2019-02-14
KR20180124955A (en) 2018-11-21
CN109155270B (en) 2023-08-25
WO2017164254A1 (en) 2017-09-28
KR102129837B9 (en) 2022-06-07
JP6549310B2 (en) 2019-07-24
TW201801231A (en) 2018-01-01
KR102129837B1 (en) 2020-07-03

Similar Documents

Publication Publication Date Title
IL246532A0 (en) Aerosol-forming substrate and aerosol-delivery system
IL246529A0 (en) Aerosol-forming substrate and aerosol-delivery system
IL246506A0 (en) Aerosol-forming substrate and aerosol-delivery system
SG11201609249XA (en) Bonding apparatus and bonding method
SG11201606136UA (en) Method and device for bonding substrates
EP3154326A4 (en) Bulk component supply device and component mounting device
EP2926464A4 (en) Electronic device and method for controlling the same
SG11201811522QA (en) Bonding apparatus
SG10201502030UA (en) Substrate polishing apparatus
EP3273759A4 (en) Component supply device
SG10201500361UA (en) Substrate holding apparatus and polishing apparatus
GB201509915D0 (en) Electronic device and power supply apparatus
EP3115143A4 (en) Solder supply apparatus
EP3266731A4 (en) Article supply device
SG10201707289XA (en) Substrate polishing apparatus
SG10201508329UA (en) Buffing apparatus and substrate processing apparatus
EP3138690A4 (en) Liquid supply unit and liquid jet device
SG10201503374QA (en) Substrate Polishing Apparatus
EP3264877A4 (en) Component supply device and mounting device
EP3258762A4 (en) Component supply device
SG11202003745TA (en) Bonding apparatus
EP3203821A4 (en) Component supply device
EP3468329A4 (en) Component supply apparatus
EP3468328A4 (en) Component supply device
EP3154325A4 (en) Component supply device and surface mounter