JPWO2017141460A1 - 圧力センサ - Google Patents
圧力センサ Download PDFInfo
- Publication number
- JPWO2017141460A1 JPWO2017141460A1 JP2017567939A JP2017567939A JPWO2017141460A1 JP WO2017141460 A1 JPWO2017141460 A1 JP WO2017141460A1 JP 2017567939 A JP2017567939 A JP 2017567939A JP 2017567939 A JP2017567939 A JP 2017567939A JP WO2017141460 A1 JPWO2017141460 A1 JP WO2017141460A1
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- Prior art keywords
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- end surface
- convex portion
- pressure sensor
- piezoelectric element
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- 229910052751 metal Inorganic materials 0.000 description 6
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- 239000000919 ceramic Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
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- 230000035945 sensitivity Effects 0.000 description 2
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- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/008—Transmitting or indicating the displacement of flexible diaphragms using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
【選択図】 図2
Description
2・・・積層型圧電素子
21・・・圧電体層
22・・・内部電極
221・・・第1の極
222・・・第2の極
23・・・積層体
231・・・活性部
232・・・不活性部
24・・・外部電極
3・・・ケース
31・・・ケース本体
32・・・第1凸部
32a・・第1凸部の端面
33・・・第2凸部
4・・・樹脂
5・・・リード端子
6・・・封止材
7・・・リード線
8・・・接合材
Claims (7)
- 圧電体層および内部電極が交互に積層された積層体を含む積層型圧電素子と、
該積層型圧電素子を取り囲むケースと、を備えており、
前記ケースは、ケース本体と、該ケース本体から内側に突出している第1凸部とを含み、
該第1凸部の端面は、前記積層体の積層方向の端面に当接しているとともに、前記積層体の端面の外周よりも内側に位置している圧力センサ。 - 前記ケースは、前記ケース本体を挟んで前記第1凸部に対向するように設けられ、前記ケース本体から外側に突出している第2凸部を有している請求項1に記載の圧力センサ。
- 前記第1凸部と前記ケース本体との境界の断面視における長さと、前記第2凸部と前記ケース本体との境界の断面視における長さとが異なる請求項1または請求項2に記載の圧力センサ。
- 前記第1凸部の端面と側面との間の角部が丸められた曲面となっている請求項1乃至請求項3のいずれかに記載の圧力センサ。
- 前記第1凸部が当接している前記積層体の端面と前記ケース本体との間に樹脂が設けられている請求項1乃至請求項4のいずれかに記載の圧力センサ。
- 前記内部電極は第1の極と第2の極とを含むとともに、前記積層体は前記内部電極の前記第1の極および前記第2の極が積層方向に重なる活性部と積層方向に重ならない不活性部とを含み、
前記第1凸部の前記端面は、積層方向から見て前記活性部から前記不活性部の一部にかけて重なるように位置している請求項1乃至請求項5のいずれかに記載の圧力センサ。 - 前記内部電極は第1の極と第2の極とを含むとともに、前記積層体は前記内部電極の前記第1の極および前記第2の極が積層方向に重なる活性部と積層方向に重ならない不活性部とを含み、
前記第1凸部の前記端面は、積層方向から見て前記活性部のみに重なるように位置している請求項1乃至請求項5のいずれかに記載の圧力センサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016026068 | 2016-02-15 | ||
JP2016026068 | 2016-02-15 | ||
PCT/JP2016/068670 WO2017141460A1 (ja) | 2016-02-15 | 2016-06-23 | 圧力センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017141460A1 true JPWO2017141460A1 (ja) | 2018-11-01 |
JP6557367B2 JP6557367B2 (ja) | 2019-08-07 |
Family
ID=59624881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017567939A Active JP6557367B2 (ja) | 2016-02-15 | 2016-06-23 | 圧力センサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10859458B2 (ja) |
EP (1) | EP3418706B1 (ja) |
JP (1) | JP6557367B2 (ja) |
CN (1) | CN108603800B (ja) |
WO (1) | WO2017141460A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9970831B2 (en) * | 2014-02-10 | 2018-05-15 | Texas Instruments Incorporated | Piezoelectric thin-film sensor |
US20220020253A1 (en) * | 2020-07-15 | 2022-01-20 | Palo Alto Research Center Incorporated | Systems and methods for improved object placement sensing for point-of-purchase sales |
CN112082674B (zh) * | 2020-09-25 | 2022-03-25 | 长安大学 | 一种基于正挠曲电效应的土压力测量盒 |
US12009159B2 (en) | 2021-04-13 | 2024-06-11 | Xerox Corporation | Membrane switches configured to sense pressure applied from compliant and rigid objects |
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Also Published As
Publication number | Publication date |
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EP3418706A1 (en) | 2018-12-26 |
US10859458B2 (en) | 2020-12-08 |
CN108603800B (zh) | 2020-08-11 |
CN108603800A (zh) | 2018-09-28 |
JP6557367B2 (ja) | 2019-08-07 |
WO2017141460A1 (ja) | 2017-08-24 |
EP3418706A4 (en) | 2019-12-04 |
EP3418706B1 (en) | 2024-06-19 |
US20190033153A1 (en) | 2019-01-31 |
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